A3PE600-2FG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip
MPN: A3PE600-2FG484 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $128.5 | $128.50 |
| 10 | $115.65 | $1,156.50 |
| 100 | $102.8 | $10,280.00 |
| 500 | $92.52 | $46,260.00 |
| 1,000 | $83.27 | $83,270.00 |
Drop-in alternatives for A3PE600-2FG484 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE600-2FG484I
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$79.9 / Unit
View Datasheet →A3PE600-FG484
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$59 / Unit
View Datasheet →A3PE600-FG484I
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$86.1 / Unit
View Datasheet →A3PE600-FGG484
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$53.7 / Unit
View Datasheet →A3PE600-2FGG484I
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View Datasheet →A3P600-2FG484
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$61.5 / Unit
View Datasheet →A3PE600-2FG484 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E (Flash-based FPGA) |
| System Gates | 600,000 gates |
| Logic Cells | 13,824 |
| Number of I/Os | 270 |
| Embedded RAM | 110592 bits |
| Maximum Operating Frequency | 310 MHz |
| Process Technology | 130 nm CMOS flash |
| Core Supply Voltage | 1.5 V |
| Speed Grade | -2 |
| Package | 484-ball FBGA (S-PBGA-B484) |
| Ball Pitch | 1.00 mm |
| Mounting Style | SMD/SMT |
| Operating Temperature (Commercial) | 0 C to +70 C |
| Configuration Memory | On-chip flash (non-volatile, single-chip) |
| Packaging | Tray |
| Reprogrammability | Yes (in-system reprogrammable) |
A3PE600-2FG484 484-ball fbga (s-pbga-b484) Pin Configuration Guide
Complete pinout information for A3PE600-2FG484 (484-ball fbga (s-pbga-b484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE600-2FG484.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE600-2FG484 is suitable for 6 applications: Industrial Automation and Control, Communications and Networking Line Cards, Aerospace and Defense Systems, Medical Instrumentation, Test and Measurement Equipment, Video and Display Processing.
Industrial Automation and Control
The A3PE600-2FG484 fits industrial automation controllers because its 270 user I/Os interface with many sensors, encoders, and fieldbus transceivers simultaneously, while the 600K-gate fabric implements real-time logic and protocol bridging at up to 310 MHz. Its flash-based, single-chip configuration eliminates the external boot PROM required by SRAM FPGAs, improving uptime in electrically noisy factory environments and cutting bill-of-materials cost. Deployed between motor-drive interfaces and an industrial Ethernet MAC, the device provides deterministic glue logic and safety interlocks; the trade-off is that deterministic timing should be verified at the -2 speed grade with static timing analysis in Libero SoC. Choose the industrial-temperature A3PE600-2FG484I variant for environments outside 0 C to +70 C.
Recommended
Communications and Networking Line Cards
In networking line cards, the A3PE600-2FG484 implements framer glue logic, packet-buffer management, and bus bridging using its 110592 bits of embedded RAM for FIFOs and dual-port buffering. The -2 speed grade sustains system performance up to 310 MHz, adequate for mid-rate backplane interfaces, and 270 I/Os support wide parallel data buses to PHY and MAC devices. Because ProASIC3E fabric is flash-based, configuration loads instantly at power-up, an advantage for equipment with strict link-recovery time requirements. The design consideration is signal integrity: the 484-ball FBGA with 1.00 mm pitch requires controlled-impedance routing and solid reference planes for the parallel buses; the trade-off versus newer families is lower serial bandwidth, so this device is best for parallel-bus architectures rather than multi-gigabit SerDes designs.
Recommended
Aerospace and Defense Systems
Flash-based ProASIC3E devices are widely used in aerospace and defense because flash switching elements are inherently non-volatile and more tolerant of configuration upsets than SRAM-based fabrics, removing the need for continuous configuration scrubbing in many missions. The A3PE600-2FG484's 600K gates and 270 I/Os implement sensor interfaces, telemetry aggregation, and reconfigurable glue logic, while the 1.5V core keeps power budgets manageable in size-constrained avionics. The Microchip USA listings for related variants (A3PE600-2FG484IY/YI) confirm use in high-reliability programs. Use the Y-graded (military/extended-temperature) or I-graded variants for extreme environments; the commercial FG484 part is appropriate for prototypes and ground equipment. Radiation data must be taken from Microchip's formal reports rather than assumed.
Recommended
Medical Instrumentation
Medical diagnostic and imaging instruments use the A3PE600-2FG484 for detector-interface timing, data-path formatting, and control logic, benefiting from 13,824 logic cells and instant-on flash configuration that shortens instrument boot time between patient examinations. The 110592-bit embedded RAM buffers ADC sample streams, and the wide 270-I/O count connects multi-channel front ends. Because flash devices power up within microseconds without external configuration memory, system availability improves, and reprogramming in the field allows feature updates without hardware changes, supporting long product lifecycles required by regulatory certification. Design caution: medical designs should lock the exact speed and temperature grade early because requalification after part substitution can require regulatory re-filing; the commercial part suits bench/lab instruments within 0 C to +70 C.
Recommended
Test and Measurement Equipment
Bench and automated test equipment leverage the A3PE600-2FG484 as a reconfigurable timing, trigger, and protocol engine. Its 310 MHz capability and fine-grained VersaTile architecture implement precise trigger state machines and pattern generators, while 270 I/Os adapt to varied DUT interfaces across fixture generations. Because the fabric is reprogrammable flash, instrument firmware can be updated in the field, extending product life without hardware spins. The 110592-bit embedded RAM captures trace buffers between the analog front end and host processor. A practical benefit is single-chip boot: no configuration PROM means fewer failure points in rack systems. The trade-off is that very high capture bandwidth should be offloaded to dedicated memory since on-chip RAM is limited; plan the architecture accordingly at schematic time.
Recommended
Video and Display Processing
The A3PE600-2FG484 serves video switchers, industrial displays, and broadcast glue logic by implementing pixel-pipeline formatting, scan conversion bridging, and multi-standard sync generation. The 110592-bit embedded RAM holds line buffers, and the -2 speed grade supports pixel clocks in the tens of MHz range comfortably, with 270 I/Os handling wide parallel video buses such as RGB and ITU-R interfaces. Flash configuration gives instant-on display initialization, avoiding visible blanking delays at power-up. For higher resolutions, the fabric concentrates on protocol bridging while dedicated scaler/serializer chips handle pixel-rate conversion. The design trade-off: the 1.5V core plus I/O banks need careful plane segmentation to prevent video noise coupling; verify power integrity with Microchip's ProASIC3E power estimation flow before tape-out.
Recommended
Recommended Products Summary
Engineering reference data for A3PE600-2FG484 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE600-2FG484I | A3PE600-FG484 | A3PE600-FGG484 | A3PE600-2FGG484I | A3P600-2FG484 |
|---|---|---|---|---|---|---|
| Package | 484-ball FBGA | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| User I/Os | 270 | 270 | 270 | 270 | 270 | 270 |
| Speed Grade | -2 (up to 310 MHz) | -2 | Standard (-1) | Standard (-1) | -2 | -2 |
| Operating Temperature | 0 C to +70 C (commercial) | Industrial (-40 C to +100 C) | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | Industrial (-40 C to +100 C) | 0 C to +70 C (commercial) |
| Embedded RAM | 110592 bits | 110592 bits | 110592 bits | 110592 bits | 110592 bits | [DATA_NEEDED] |
| Configuration Type | On-chip flash, single-chip, instant-on | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
Key Differentiators
- Fastest timing grade in the same footprint (vs A3PE600-FG484)
- Industrial temperature availability (vs A3PE600-2FG484I)
- Embedded RAM for buffering (vs A3P600-2FG484)
Design Notes
The A3PE600-2FG484 requires a 1.5V core supply with separate I/O bank supplies. Estimate dynamic power using Microchip's ProASIC3E power calculation tools in Libero SoC, since flash FPGA power depends heavily on toggling activity rather than a fixed quiescent figure. Provide wide power planes with bulk capacitance at each I/O bank; Estimated: for typical designs at moderate utilization, total power remains well under 1 W, but verify per your netlist. Follow the ProASIC3E family datasheet power-up sequencing recommendations to avoid latch-up during multi-rail startup.
The 484-ball FBGA with 1.00 mm pitch typically requires a minimum 6-layer stack-up with dedicated ground planes for signal-integrity escape routing. Use via-in-pad or dog-bone escape patterns, and download the verified symbol and footprint from SnapMagic (SnapEDA) or Libero SoC rather than hand-drawing the 484-ball map. Keep parallel high-speed bus lengths matched within the interface's timing budget and maintain controlled impedance referenced to an unbroken plane.
Confirm the temperature grade before finalizing the BOM: the FG484 suffix is commercial 0 C to +70 C, while the I suffix is industrial. Mixing grades in one design creates a sourcing/configuration risk. Also remember that while ProASIC3E is single-chip flash (no external boot PROM), device programming still requires the Libero SoC toolchain and programming hardware; plan programming access in production fixtures. Verify the -2 speed grade timing with static timing analysis; do not assume standard-grade timing closure transfers automatically.
Compliance Information
Verified web data does not state RoHS/REACH status for A3PE600-2FG484. Note the GG suffix variants (e.g., A3PE600-2FGG484I) denote Pb-free/halogen-free ball metallurgy per Microchip naming conventions; confirm certification documents with Microchip for the exact MPN.
