A54SX32-2BGG329I - SX FPGA 48K Gates 329-BGA | Microchip
料号： A54SX32-2BGG329I ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $128.5 | $128.50 |
| 10 | $118.2 | $1,182.00 |
| 100 | $105.75 | $10,575.00 |
| 500 | $96.4 | $48,200.00 |
| 1,000 | $88.9 | $88,900.00 |
A54SX32-2BGG329I 概述
An FPGA (Field Programmable Gate Array) is a semiconductor device that implements digital logic through a configurable fabric of programmable logic blocks and interconnects. The SX family uses a sea-of-modules architecture built on 0.35 um CMOS technology, positioning it within the hierarchy: A54SX32 -> SX FPGA family -> one-time-programmable (OTP) antifuse FPGA -> programmable logic device -> digital IC.
Key features include 32,000 equivalent gates (about 1800 cells) of nonvolatile antifuse logic, 249 user I/O, operation from 3.3V/5.0V compatible supplies, and up to 320 MHz system performance. Because antifuse configuration is one-time programmable and nonvolatile, the device is immune to configuration readback, offering inherent design security and no boot-up configuration time, unlike SRAM-based FPGAs.
The sea-of-modules architecture delivers ASIC-like routing density and deterministic timing, enabling dramatic reductions in design cost and power consumption for performance-intensive applications. The '-2' speed grade balances performance with power; the 'I' suffix denotes the industrial -40C to +85C operating range suitable for harsh environments.
Typical applications include industrial automation and control, communications and networking equipment, aerospace and defense logic consolidation, and test and measurement instrumentation where single-chip integration of glue logic plus functions reduces BOM cost.
Design consideration: antifuse FPGAs cannot be reprogrammed, so logic must be fully verified in simulation with Microchip Libero/Designer software before programming; plan I/O banking for the 3.3V/5V mixed-voltage environment.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： A54SX32-2BGG329I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： A54SX32-2BGG329I （相同外形与封装尺寸） ——差异在于 Package, Family, System Gates, RoHS Status, Supply Voltage.
快速对比工具——选择替代料号进行并排对比：
A54SX32A-2BGG329I
✅ 直接替换✓ 有现货
$95 / 个
查看数据手册 →A54SX32A-BG329I
✅ 直接替换📋 参考替代料（不在目录中）
A54SX32-P2BGG329I
✅ 直接替换📋 参考替代料（不在目录中）
A54SX32-2BGG329
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →A54SX32-BGG329
✅ 直接替换✓ 有现货
$515.58 / 个
查看数据手册 →A54SX32-BG329
✅ 直接替换✓ 有现货
$510 / 个
查看数据手册 →A54SX32-2BGG329I 最大额定值与电气特性
| Family | SX (Actel/Microsemi SX FPGA) |
| System Gates | 48000 |
| Equivalent Gates | 32000 |
| Logic Cells | 1800 |
| Number of I/O | 249 |
| 最大时钟频率 | 320 MHz |
| Process Technology | 0.35 um CMOS |
| 电源电压 | 3.3 V / 5 V |
| Programming Technology | Antifuse (one-time programmable, nonvolatile) |
| Speed Grade | -2 |
| 工作温度 | -40C to +85C (Industrial, suffix I) |
| 封装 | 329-ball BGA (329-BBGA), 31 x 31 x 2.59 mm |
| Ball Pitch | 1.27 mm |
| 安装类型 | Surface Mount |
| RoHS 状态 | RoHS Compliant |
| Lead Free Status | Lead Free |
| Packaging | Tray |
A54SX32-2BGG329I 329-ball bga (329-bbga), 31 x 31 x 2.59 mm 引脚配置指南
A54SX32-2BGG329I（329-ball bga (329-bbga), 31 x 31 x 2.59 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： A54SX32-2BGG329I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
A54SX32-2BGG329I 适用于 6 应用s: Industrial Automation and Control, Communications and Networking Equipment, Aerospace and Defense Logic, Test and Measurement Instrumentation, Embedded System Logic Consolidation, Battery-Powered and Low-Power Portable Systems.
Industrial Automation and Control
The A54SX32-2BGG329I fits industrial automation because its 48K system gates and 249 user I/O consolidate PLC glue logic, I/O expansion decoding, and motor-control interface functions into one antifuse device operating reliably from -40C to +85C. Its nonvolatile one-time-programmable configuration means factory-floor controllers power up instantly with no configuration load delay and cannot be corrupted by brownouts or EMI on the 3.3V/5V supply rails. The 329-ball BGA at 31x31x2.59 mm with 1.27 mm pitch supports dense control-card layouts, while the 0.35 um CMOS process keeps static power low for passively cooled cabinets. Deterministic sea-of-modules routing simplifies timing closure for interlocked safety logic that must meet fixed latency budgets.
推荐
Communications and Networking Equipment
In networking line cards and backplane controllers, the A54SX32-2BGG329I provides glueless bridging between processors, PHYs, and memories using its 249 user I/O and 320 MHz maximum clock capability from the SX sea-of-modules architecture. Because the antifuse fabric delivers deterministic, ASIC-like interconnect delays, engineers can meet fixed packet-latency budgets that SRAM FPGAs with reconfigurable routing struggle to guarantee. The nonvolatile configuration removes the boot-time configuration read from serial flash, enabling hot-swappable cards that resume operation immediately on insertion. Industrial -40C to +85C rating and RoHS-compliant lead-free 329-BBGA construction suit telecom outdoor cabinets and central-office equipment requiring long service life.
推荐
Aerospace and Defense Logic
The A54SX32-2BGG329I serves defense electronics where configuration security matters: antifuse programming is one-time and nonvolatile, offering no readable bitstream and immunity to configuration upset from power transients or single-event functional interruptions of a configuration store. The 32,000-gate capacity integrates mission-mode glue logic, bus interfaces, and housekeeping functions, reducing parts count in constrained enclosures. The industrial -40C to +85C I-grade covers many terrestrial defense environments, while the SX architecture's deterministic timing supports safety interlocks with verifiable latency. For space programs Microchip offers RTAX radiation-taxed derivatives, letting teams reuse SX-family design methodology, though the A54SX32 itself is not radiation characterized.
推荐
Test and Measurement Instrumentation
Bench and automated test equipment benefits from the A54SX32-2BGG329I's combination of 249 flexible I/O and 320 MHz-class timing to implement trigger engines, pattern generators, and bus protocol capture logic. The deterministic antifuse routing means trigger-to-capture latency is fixed across units, which is essential for calibration repeatability in production testers. Nonvolatile configuration lets instruments pass power-on self-test immediately without waiting for a configuration controller, and the absence of configuration readback protects proprietary test algorithms embedded in the logic. The 3.3V/5V-tolerant I/O directly interfaces legacy TTL-level instrumentation backplanes without level-shifting glue.
推荐
Embedded System Logic Consolidation
For cost-reduction redesigns, the A54SX32-2BGG329I replaces multi-chip glue logic: address decoders, bus bridges, state machines, and interrupt controllers fit within 32,000 equivalent gates (1800 cells), collapsing PCB area and assembly cost into one 329-BBGA. The Microchip product page emphasizes that SX devices integrate multiple functions into a low-cost single-chip solution, cutting BOM count and inventory complexity. Because configuration is nonvolatile, no supervisor or configuration flash is required, further reducing system components. The industrial temperature range and RoHS compliance let one consolidated design serve consumer, commercial, and industrial product variants without respins.
推荐
Battery-Powered and Low-Power Portable Systems
The SX family's 0.35 um CMOS process and antifuse architecture deliver low static power because no configuration SRAM must be continuously held, and Microchip markets the family for dramatic reductions in power consumption in performance-intensive applications. The A54SX32-2BGG329I therefore suits portable and battery-backed industrial data loggers where the logic fabric must idle at microamp-class levels between acquisition events. Instant-on nonvolatile configuration enables aggressive sleep/wakeup cycling with no reconfiguration energy overhead, unlike SRAM FPGAs that must reload bitstreams on each cycle. The industrial -40C to +85C rating covers unheated outdoor and vehicle-mounted deployments common in remote monitoring systems.
推荐
推荐产品汇总
工程参考数据： A54SX32-2BGG329I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | A54SX32A-2BGG329I | A54SX32A-BG329I | A54SX32-P2BGG329I | A54SX32-2BGG329 | A54SX32-BG329 |
|---|---|---|---|---|---|---|
| Package | 329-BBGA, 31x31x2.59 mm | 329-BBGA - same footprint | 329-BBGA - same footprint | 329-BBGA - same footprint | 329-BBGA - same footprint | 329-pin BGA - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 48K | 48K (32K equivalent) | 48K (32K equivalent) | 48K (32K equivalent) | 48K | 48K |
| User I/O | 249 | 249 | 249 | 249 | 249 | 249 |
| Speed Grade | -2 | -2 | standard | P2 (enhanced -2) | -2 | standard |
| Temperature Range | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | 0C to +70C (commercial) | 0C to +70C (commercial) |
| Family / Architecture | SX antifuse, 0.35 um | SX-A antifuse (enhanced) | SX-A antifuse (enhanced) | SX antifuse, P speed flow | SX antifuse, 0.35 um | SX antifuse, 0.35 um |
关键差异点
- Nonvolatile antifuse configuration with no boot delay （对比 A54SX32A-2BGG329I)
- Industrial -40C to +85C rating in same footprint （对比 A54SX32-2BGG329)
- -2 speed grade timing （对比 A54SX32-BG329)
设计说明
Antifuse FPGAs are one-time programmable and cannot be reworked in circuit. Complete full functional and timing simulation in Microchip Libero/Designer (or legacy Actel Designer) before committing a device, and maintain programmed spare units for any field program. Also note the temperature suffix: A54SX32-2BGG329 (commercial, 0C to +70C) must not be substituted into industrial -40C to +85C sockets; only the I-suffix parts are qualified for the full industrial range per the 54SX family datasheet.
The 329-ball BGA uses a 1.27 mm ball pitch on a 31x31 mm body, which allows conventional via-in-pad or dog-bone fanout with 0.5 mm/0.15 mm drill rules - no microvia stack needed. Plan power/ground ball connectivity with a solid internal plane pair; the exposed two-row perimeter ball pattern means interior balls (VCC/GND grid) benefit from directly connecting thermal relief spokes to planes. Follow the datasheet mechanical drawing (31x31x2.59 mm) for courtyard and stencil design.
The SX family operates in a 3.3V/5V environment on 0.35 um CMOS; decouple each supply ball pair with 0.1 uF ceramics placed within 3 mm of the package and bulk 10 uF near the regulator. Because antifuse configuration is drawn from the internal supply only at programming time (programmed at board test or in-system with the recommended programmer), normal-operation supply current is dominated by clock activity - estimate Icc from the datasheet current-vs-frequency curves for your toggle rate rather than using worst-case numbers.
合规信息
RoHS Compliant: Yes and Lead Free per Newark distributor listing and digchip datasheet summary for A54SX32-2BGG329I. REACH and halogen-free status not stated in provided data.
