A54SX32-2BGG329I - SX FPGA 48K Gates 329-BGA | Microchip
部品番号: A54SX32-2BGG329I ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $128.5 | $128.50 |
| 10 | $118.2 | $1,182.00 |
| 100 | $105.75 | $10,575.00 |
| 500 | $96.4 | $48,200.00 |
| 1,000 | $88.9 | $88,900.00 |
A54SX32-2BGG329I 概要
An FPGA (Field Programmable Gate Array) is a semiconductor device that implements digital logic through a configurable fabric of programmable logic blocks and interconnects. The SX family uses a sea-of-modules architecture built on 0.35 um CMOS technology, positioning it within the hierarchy: A54SX32 -> SX FPGA family -> one-time-programmable (OTP) antifuse FPGA -> programmable logic device -> digital IC.
Key features include 32,000 equivalent gates (about 1800 cells) of nonvolatile antifuse logic, 249 user I/O, operation from 3.3V/5.0V compatible supplies, and up to 320 MHz system performance. Because antifuse configuration is one-time programmable and nonvolatile, the device is immune to configuration readback, offering inherent design security and no boot-up configuration time, unlike SRAM-based FPGAs.
The sea-of-modules architecture delivers ASIC-like routing density and deterministic timing, enabling dramatic reductions in design cost and power consumption for performance-intensive applications. The '-2' speed grade balances performance with power; the 'I' suffix denotes the industrial -40C to +85C operating range suitable for harsh environments.
Typical applications include industrial automation and control, communications and networking equipment, aerospace and defense logic consolidation, and test and measurement instrumentation where single-chip integration of glue logic plus functions reduces BOM cost.
Design consideration: antifuse FPGAs cannot be reprogrammed, so logic must be fully verified in simulation with Microchip Libero/Designer software before programming; plan I/O banking for the 3.3V/5V mixed-voltage environment.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: A54SX32-2BGG329I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A54SX32-2BGG329I （同一形状・フットプリント） — 相違点: Package, Family, System Gates, RoHS Status, Supply Voltage.
クイック比較ツール — 並列比較する代替部品を選択:
A54SX32A-2BGG329I
✅ ドロップイン✓ 在庫あり
$95 / 個
データシートを見る →A54SX32A-BG329I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
A54SX32-P2BGG329I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
A54SX32-2BGG329
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →A54SX32-BGG329
✅ ドロップイン✓ 在庫あり
$515.58 / 個
データシートを見る →A54SX32-BG329
✅ ドロップイン✓ 在庫あり
$510 / 個
データシートを見る →A54SX32-2BGG329I 最大定格＆電気的特性
| Family | SX (Actel/Microsemi SX FPGA) |
| System Gates | 48000 |
| Equivalent Gates | 32000 |
| Logic Cells | 1800 |
| Number of I/O | 249 |
| 最大クロック周波数 | 320 MHz |
| Process Technology | 0.35 um CMOS |
| 電源電圧 | 3.3 V / 5 V |
| Programming Technology | Antifuse (one-time programmable, nonvolatile) |
| Speed Grade | -2 |
| 動作温度 | -40C to +85C (Industrial, suffix I) |
| パッケージ | 329-ball BGA (329-BBGA), 31 x 31 x 2.59 mm |
| Ball Pitch | 1.27 mm |
| 実装タイプ | Surface Mount |
| RoHS ステータス | RoHS Compliant |
| Lead Free Status | Lead Free |
| Packaging | Tray |
A54SX32-2BGG329I 329-ball bga (329-bbga), 31 x 31 x 2.59 mm ピン配置ガイド
A54SX32-2BGG329I (329-ball bga (329-bbga), 31 x 31 x 2.59 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: A54SX32-2BGG329I.
詳細は データシート をご参照ください。
主な用途
A54SX32-2BGG329I の用途: 6 件s: Industrial Automation and Control, Communications and Networking Equipment, Aerospace and Defense Logic, Test and Measurement Instrumentation, Embedded System Logic Consolidation, Battery-Powered and Low-Power Portable Systems.
Industrial Automation and Control
The A54SX32-2BGG329I fits industrial automation because its 48K system gates and 249 user I/O consolidate PLC glue logic, I/O expansion decoding, and motor-control interface functions into one antifuse device operating reliably from -40C to +85C. Its nonvolatile one-time-programmable configuration means factory-floor controllers power up instantly with no configuration load delay and cannot be corrupted by brownouts or EMI on the 3.3V/5V supply rails. The 329-ball BGA at 31x31x2.59 mm with 1.27 mm pitch supports dense control-card layouts, while the 0.35 um CMOS process keeps static power low for passively cooled cabinets. Deterministic sea-of-modules routing simplifies timing closure for interlocked safety logic that must meet fixed latency budgets.
おすすめ
Communications and Networking Equipment
In networking line cards and backplane controllers, the A54SX32-2BGG329I provides glueless bridging between processors, PHYs, and memories using its 249 user I/O and 320 MHz maximum clock capability from the SX sea-of-modules architecture. Because the antifuse fabric delivers deterministic, ASIC-like interconnect delays, engineers can meet fixed packet-latency budgets that SRAM FPGAs with reconfigurable routing struggle to guarantee. The nonvolatile configuration removes the boot-time configuration read from serial flash, enabling hot-swappable cards that resume operation immediately on insertion. Industrial -40C to +85C rating and RoHS-compliant lead-free 329-BBGA construction suit telecom outdoor cabinets and central-office equipment requiring long service life.
おすすめ
Aerospace and Defense Logic
The A54SX32-2BGG329I serves defense electronics where configuration security matters: antifuse programming is one-time and nonvolatile, offering no readable bitstream and immunity to configuration upset from power transients or single-event functional interruptions of a configuration store. The 32,000-gate capacity integrates mission-mode glue logic, bus interfaces, and housekeeping functions, reducing parts count in constrained enclosures. The industrial -40C to +85C I-grade covers many terrestrial defense environments, while the SX architecture's deterministic timing supports safety interlocks with verifiable latency. For space programs Microchip offers RTAX radiation-taxed derivatives, letting teams reuse SX-family design methodology, though the A54SX32 itself is not radiation characterized.
おすすめ
Test and Measurement Instrumentation
Bench and automated test equipment benefits from the A54SX32-2BGG329I's combination of 249 flexible I/O and 320 MHz-class timing to implement trigger engines, pattern generators, and bus protocol capture logic. The deterministic antifuse routing means trigger-to-capture latency is fixed across units, which is essential for calibration repeatability in production testers. Nonvolatile configuration lets instruments pass power-on self-test immediately without waiting for a configuration controller, and the absence of configuration readback protects proprietary test algorithms embedded in the logic. The 3.3V/5V-tolerant I/O directly interfaces legacy TTL-level instrumentation backplanes without level-shifting glue.
おすすめ
Embedded System Logic Consolidation
For cost-reduction redesigns, the A54SX32-2BGG329I replaces multi-chip glue logic: address decoders, bus bridges, state machines, and interrupt controllers fit within 32,000 equivalent gates (1800 cells), collapsing PCB area and assembly cost into one 329-BBGA. The Microchip product page emphasizes that SX devices integrate multiple functions into a low-cost single-chip solution, cutting BOM count and inventory complexity. Because configuration is nonvolatile, no supervisor or configuration flash is required, further reducing system components. The industrial temperature range and RoHS compliance let one consolidated design serve consumer, commercial, and industrial product variants without respins.
おすすめ
Battery-Powered and Low-Power Portable Systems
The SX family's 0.35 um CMOS process and antifuse architecture deliver low static power because no configuration SRAM must be continuously held, and Microchip markets the family for dramatic reductions in power consumption in performance-intensive applications. The A54SX32-2BGG329I therefore suits portable and battery-backed industrial data loggers where the logic fabric must idle at microamp-class levels between acquisition events. Instant-on nonvolatile configuration enables aggressive sleep/wakeup cycling with no reconfiguration energy overhead, unlike SRAM FPGAs that must reload bitstreams on each cycle. The industrial -40C to +85C rating covers unheated outdoor and vehicle-mounted deployments common in remote monitoring systems.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: A54SX32-2BGG329I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | A54SX32A-2BGG329I | A54SX32A-BG329I | A54SX32-P2BGG329I | A54SX32-2BGG329 | A54SX32-BG329 |
|---|---|---|---|---|---|---|
| Package | 329-BBGA, 31x31x2.59 mm | 329-BBGA - same footprint | 329-BBGA - same footprint | 329-BBGA - same footprint | 329-BBGA - same footprint | 329-pin BGA - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 48K | 48K (32K equivalent) | 48K (32K equivalent) | 48K (32K equivalent) | 48K | 48K |
| User I/O | 249 | 249 | 249 | 249 | 249 | 249 |
| Speed Grade | -2 | -2 | standard | P2 (enhanced -2) | -2 | standard |
| Temperature Range | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | 0C to +70C (commercial) | 0C to +70C (commercial) |
| Family / Architecture | SX antifuse, 0.35 um | SX-A antifuse (enhanced) | SX-A antifuse (enhanced) | SX antifuse, P speed flow | SX antifuse, 0.35 um | SX antifuse, 0.35 um |
主な差別化要因
- Nonvolatile antifuse configuration with no boot delay （vs A54SX32A-2BGG329I)
- Industrial -40C to +85C rating in same footprint （vs A54SX32-2BGG329)
- -2 speed grade timing （vs A54SX32-BG329)
設計ノート
Antifuse FPGAs are one-time programmable and cannot be reworked in circuit. Complete full functional and timing simulation in Microchip Libero/Designer (or legacy Actel Designer) before committing a device, and maintain programmed spare units for any field program. Also note the temperature suffix: A54SX32-2BGG329 (commercial, 0C to +70C) must not be substituted into industrial -40C to +85C sockets; only the I-suffix parts are qualified for the full industrial range per the 54SX family datasheet.
The 329-ball BGA uses a 1.27 mm ball pitch on a 31x31 mm body, which allows conventional via-in-pad or dog-bone fanout with 0.5 mm/0.15 mm drill rules - no microvia stack needed. Plan power/ground ball connectivity with a solid internal plane pair; the exposed two-row perimeter ball pattern means interior balls (VCC/GND grid) benefit from directly connecting thermal relief spokes to planes. Follow the datasheet mechanical drawing (31x31x2.59 mm) for courtyard and stencil design.
The SX family operates in a 3.3V/5V environment on 0.35 um CMOS; decouple each supply ball pair with 0.1 uF ceramics placed within 3 mm of the package and bulk 10 uF near the regulator. Because antifuse configuration is drawn from the internal supply only at programming time (programmed at board test or in-system with the recommended programmer), normal-operation supply current is dominated by clock activity - estimate Icc from the datasheet current-vs-frequency curves for your toggle rate rather than using worst-case numbers.
コンプライアンス情報
RoHS Compliant: Yes and Lead Free per Newark distributor listing and digchip datasheet summary for A54SX32-2BGG329I. REACH and halogen-free status not stated in provided data.
