AM6528BACDXEA - Dual Cortex-A53 1.1GHz Sitara MPU | TI
料号： AM6528BACDXEA ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $18.75 | $18.75 |
| 10 | $17.25 | $172.50 |
| 100 | $15.95 | $1,595.00 |
| 500 | $14.75 | $7,375.00 |
| 1,000 | $13.6 | $13,600.00 |
AM6528BACDXEA 概述
A microprocessor unit (MPU) is the central computation engine of an embedded system, sitting above microcontrollers (MCU) in the processing hierarchy but below application processors in complexity. Modern industrial MPUs like the AM6528 combine an applications-class Arm Cortex-A53 cluster for Linux-based software with a real-time Cortex-R5F lockstep-capable MCU subsystem, enabling a single chip to run both a high-level OS and deterministic real-time control tasks - a partitioning that previously required two separate devices.
Key differentiating features include the PRU-ICSSG (Programmable Real-time Unit Industrial Communication Subsystem) with three Gigabit instances, supporting industrial Ethernet protocols such as EtherCAT, PROFINET, and EtherNet/IP in hardware with deterministic latency. A 3D graphics acceleration engine (SGX544 class) enables HMI and visualization workloads. The Cortex-R5F subsystem includes features intended to support functional-safety goals per the TI datasheet for the AM654x/AM652x family (Silicon Revision 2.1 documentation).
Architecturally, the AM6528 belongs to the Sitara AM65x generation, built on TI's proven Cortex-A53/R5F heterogeneous multicore approach. The A53 cluster executes Linux or RTOS software, while the R5F cores handle time-critical control loops and safety monitoring, communicating through shared on-chip interconnect and memory subsystems.
Typical applications include industrial PLCs and motor drive control heads, factory automation gateways with multi-protocol industrial Ethernet, HMI panels with 3D graphics, and building/energy automation controllers where -40C to +105C operation is required.
When designing with this part, plan power sequencing for the multiple core rails and allocate DDR memory bandwidth carefully between the A53 and R5F subsystems; TI provides reference designs and power estimation tools in the AM65x documentation set.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： AM6528BACDXEA ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
AM6548BACDXEA
📋 参考替代料（不在目录中）
AM6546BACDXEA
📋 参考替代料（不在目录中）
AM6544BACDXEA
📋 参考替代料（不在目录中）
AM6526BACDXEA
📋 参考替代料（不在目录中）
AM6528BACDXE
📋 参考替代料（不在目录中）
AM6528BACDXEA 最大额定值与电气特性
| Core Processor | ARM Cortex-A53 |
| Number of A53 Cores | 2 |
| A53 Core Frequency | 1.1 GHz |
| Real-Time Subsystem | Dual ARM Cortex-R5F |
| R5F Core Frequency | 400 MHz |
| 数据总线宽度 | 32-Bit (R5F subsystem, per distributor listing) |
| Industrial Communications | Gigabit PRU-ICSS |
| Graphics | 3D graphics accelerator |
| 工作温度 | -40C to +105C |
| 封装 | 784-FCBGA (FCCSP, ACD), 23x23 mm |
| 引脚数量 | 784 |
| 安装类型 | Surface Mount |
| Product Family | Sitara AM652x |
| Silicon Revision Documentation | AM654x/AM652x Silicon Revision 2.1 |
AM6528BACDXEA 784-fcbga (fccsp, acd), 23x23 mm 引脚配置指南
AM6528BACDXEA（784-fcbga (fccsp, acd), 23x23 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： AM6528BACDXEA.
请参阅 数据手册 以查看完整引脚配置。
典型应用
AM6528BACDXEA 适用于 6 应用s: Industrial PLC and Motion Control, Industrial Ethernet Gateway, HMI and Visualization Panels, Factory Automation Edge Computing, Test and Measurement Instrumentation, Energy and Building Automation Controllers.
Industrial PLC and Motion Control
The AM6528BACDXEA fits PLC and motion-control head units because its 400 MHz dual Cortex-R5F subsystem executes deterministic control loops while the 1.1 GHz dual Cortex-A53 cluster runs the Linux-based PLC runtime and engineering interface. The Gigabit PRU-ICSS instances handle fieldbus timing in hardware, so protocol turnaround does not depend on Linux scheduling latency. In a typical topology the R5F cores close servo current loops at fixed cycle times while the A53 side executes IEC 61131-3 logic and communication management. The -40C to +105C rating allows deployment in sealed cabinets without active cooling, though designers should budget DDR bandwidth shared between real-time and application subsystems.
推荐
Industrial Ethernet Gateway
As a protocol gateway, the AM6528BACDXEA leverages its three Gigabit PRU-ICSS subsystems to terminate multiple industrial networks - for example EtherCAT on one port and PROFINET on another - with hardware-level determinism, while the Cortex-A53 cores run protocol translation middleware and TLS-secured cloud connectivity. The 1.1 GHz A53 pair has sufficient headroom for OPC UA servers alongside the fieldbus stacks, and the 784-pin package exposes enough Ethernet MAC/PHY interfaces for multi-port designs. The extended -40C to +105C temperature range suits wall-mounted gateways in unconditioned facilities; designers should verify magnetics and PHY selection meet the same industrial temperature requirement.
推荐
HMI and Visualization Panels
The AM6528BACDXEA integrates a 3D graphics accelerator, making it appropriate for industrial touch panels and operator terminals. The dual Cortex-A53 cores at 1.1 GHz run Qt- or HTML5-based HMI frameworks on Linux, while the GPU renders smooth animations, trends, and 3D equipment visualizations. Display output and touch interfaces are routed through the 784-ball package's peripheral balls. Because HMI duty cycles are moderate, two A53 cores are usually sufficient, keeping system cost below quad-core alternatives. The -40C to +105C rating matches panel-mount installations near heat-generating drives; thermal spreading through the PCB is typically adequate for graphics workloads.
推荐
Factory Automation Edge Computing
For edge analytics nodes on the factory floor, the AM6528BACDXEA combines data acquisition (via PRU-ICSS-connected sensors and fieldbuses) with local inference or rule-based decisioning on the Cortex-A53 cluster, publishing only summarized results to the cloud. This reduces uplink bandwidth and keeps safety-relevant reactions on-premise. The dual R5F cores timestamp and pre-process high-rate sensor data deterministically before handing it to Linux. The processor's -40C to +105C range supports fanless DIN-rail enclosures. Designers should size DDR memory - industrial DDR3L/DDR4 parts are common companions - to balance analytics workloads against real-time buffering needs.
推荐
Test and Measurement Instrumentation
Benchtop and modular test instruments use the AM6528BACDXEA as the embedded controller running the instrument OS, user interface, and communication stack (USB, Ethernet). The dual A53 cores at 1.1 GHz manage the Linux application layer while the R5F subsystem sequences acquisitions with tight timing, and the PRU-ICSS can implement custom trigger and timing interfaces. The 3D graphics engine supports rich on-screen waveforms and analysis displays. The 784-ball FCCSP provides the broad peripheral mix these instruments require. In this application the full -40C to +105C range is rarely needed, but the extended rating simplifies qualification for laboratory-to-field portable instruments.
推荐
Energy and Building Automation Controllers
Substation RTUs, solar inverter controllers, and building automation supervisors benefit from the AM6528BACDXEA's combination of industrial temperature rating, hardware fieldbus support, and Linux-class processing. The Cortex-A53 cores run protocol converters between IEC-style utility protocols and IP-based management networks, while PRU-ICSS ports provide deterministic links to protection relays and remote I/O. The R5F pair monitors watchdog and failover logic. Its -40C to +105C rating covers outdoor switchgear cabinets and rooftop equipment, and the 784-pin package provides sufficient I/O for multiple communication sections. Power-supply companions should meet the same extended temperature range for system-level reliability.
推荐
推荐产品汇总
工程参考数据： AM6528BACDXEA ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | AM6548BACDXEA | AM6546BACDXEA | AM6544BACDXEA | AM6526BACDXEA | AM6528BACDXE |
|---|---|---|---|---|---|---|
| Package | 784-FCBGA (FCCSP, ACD) 23x23 mm | 784-FCBGA (FCCSP, ACD) - same | 784-FCBGA (FCCSP, ACD) - same | 784-FCBGA (FCCSP, ACD) - same | 784-FCBGA (FCCSP, ACD) - same | 784-FCBGA (FCCSP, ACD) - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Cortex-A53 Cores | 2 (1.1 GHz) | 4 (1.1 GHz) | 4 (1.1 GHz) | 4 (1.1 GHz) | 2 (1.1 GHz) | 2 (1.1 GHz) |
| Cortex-R5F Subsystem | Dual, 400 MHz | Dual, 400 MHz | Dual, 400 MHz | Dual, 400 MHz | Dual, 400 MHz | Dual, 400 MHz |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | 0C to +85C (commercial) |
关键差异点
- Dual-core A53 cost efficiency for two-core-sufficient workloads （对比 AM6548BACDXEA)
- Full extended industrial temperature rating （对比 AM6528BACDXE)
- Hardware-offloaded industrial Ethernet （对比 Generic Cortex-A53 MPUs (non-AM65x))
- Trade-off: fewer A53 cores than quad-core siblings （对比 AM6546BACDXEA)
设计说明
The AM6528BACDXEA requires multiple core rails (A53, R5F, PRU-ICSS, DDR, and I/O domains) with defined power-up sequencing. TI provides a recommended power tree and reference PMIC solutions in the AM65x documentation set; use TI's power estimation tool with your actual core loading profile rather than worst-case datasheet numbers to size regulators. Estimated: budget input values - assume several watts total dissipation at full 1.1 GHz A53 and 400 MHz R5F load - and verify junction temperature against the -40C to +105C ambient rating with your enclosure's thermal resistance.
The 784-ball FCCSP (ACD) at 23x23 mm with fine ball pitch requires a high-layer-count PCB (typically 8-12 layers) with controlled-impedance DDR routing, matched length groups, and solid power/ground planes. Follow the TI AM65x hardware design guide for ball breakout, via-in-pad usage, and DDR fly-by/topology rules. Plan the ball-map using TI's pin-mux utility before routing to avoid conflicting peripheral assignments.
A 784-ball BGA dissipating several watts relies on the PCB as the primary heat spreader. Estimated: with a typical multi-layer board theta_JA on the order of 15-25 C/W (verify against the TI datasheet thermal appendix for your stack-up), a 3W dissipation raises junction temperature roughly 45-75C above ambient - significant against the +105C limit. Add thermal vias under the package and consider a lid-mounted heatsink or forced airflow for high-load, high-ambient designs.
Confirm silicon revision handling: the verified datasheet covers AM654x/AM652x Silicon Revision 2.1, and TI publishes revision-specific errata. Before production, check the errata document against your use of specific peripherals. Also confirm boot-mode pin strapping (boot media selection) matches your flashing strategy early in layout, since rework of boot-mode nets on a 784-ball BGA board is expensive.
合规信息
Compliance status was not stated in the verified web data for this ordering option. Consult the TI product page quality section for AM6528 for official RoHS/REACH declarations.
