AM6528BACDXEA - Dual Cortex-A53 1.1GHz Sitara MPU | TI
MPN: AM6528BACDXEA β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.75 | $18.75 |
| 10 | $17.25 | $172.50 |
| 100 | $15.95 | $1,595.00 |
| 500 | $14.75 | $7,375.00 |
| 1,000 | $13.6 | $13,600.00 |
Drop-in alternatives for AM6528BACDXEA β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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AM6548BACDXEA
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
AM6546BACDXEA
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
AM6544BACDXEA
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
AM6526BACDXEA
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
AM6528BACDXE
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
AM6528BACDXEA Maximum Ratings & Electrical Characteristics
| Core Processor | ARM Cortex-A53 |
| Number of A53 Cores | 2 |
| A53 Core Frequency | 1.1 GHz |
| Real-Time Subsystem | Dual ARM Cortex-R5F |
| R5F Core Frequency | 400 MHz |
| Data Bus Width | 32-Bit (R5F subsystem, per distributor listing) |
| Industrial Communications | Gigabit PRU-ICSS |
| Graphics | 3D graphics accelerator |
| Operating Temperature | -40C to +105C |
| Package | 784-FCBGA (FCCSP, ACD), 23x23 mm |
| Pin Count | 784 |
| Mounting Type | Surface Mount |
| Product Family | Sitara AM652x |
| Silicon Revision Documentation | AM654x/AM652x Silicon Revision 2.1 |
AM6528BACDXEA 784-fcbga (fccsp, acd), 23x23 mm Pin Configuration Guide
Complete pinout information for AM6528BACDXEA (784-fcbga (fccsp, acd), 23x23 mm package) with 784 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for AM6528BACDXEA.
Refer to the datasheet for full pin configuration.
Estimated pin count: 784 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
AM6528BACDXEA is suitable for 6 applications: Industrial PLC and Motion Control, Industrial Ethernet Gateway, HMI and Visualization Panels, Factory Automation Edge Computing, Test and Measurement Instrumentation, Energy and Building Automation Controllers.
Industrial PLC and Motion Control
The AM6528BACDXEA fits PLC and motion-control head units because its 400 MHz dual Cortex-R5F subsystem executes deterministic control loops while the 1.1 GHz dual Cortex-A53 cluster runs the Linux-based PLC runtime and engineering interface. The Gigabit PRU-ICSS instances handle fieldbus timing in hardware, so protocol turnaround does not depend on Linux scheduling latency. In a typical topology the R5F cores close servo current loops at fixed cycle times while the A53 side executes IEC 61131-3 logic and communication management. The -40C to +105C rating allows deployment in sealed cabinets without active cooling, though designers should budget DDR bandwidth shared between real-time and application subsystems.
Recommended
Industrial Ethernet Gateway
As a protocol gateway, the AM6528BACDXEA leverages its three Gigabit PRU-ICSS subsystems to terminate multiple industrial networks - for example EtherCAT on one port and PROFINET on another - with hardware-level determinism, while the Cortex-A53 cores run protocol translation middleware and TLS-secured cloud connectivity. The 1.1 GHz A53 pair has sufficient headroom for OPC UA servers alongside the fieldbus stacks, and the 784-pin package exposes enough Ethernet MAC/PHY interfaces for multi-port designs. The extended -40C to +105C temperature range suits wall-mounted gateways in unconditioned facilities; designers should verify magnetics and PHY selection meet the same industrial temperature requirement.
Recommended
HMI and Visualization Panels
The AM6528BACDXEA integrates a 3D graphics accelerator, making it appropriate for industrial touch panels and operator terminals. The dual Cortex-A53 cores at 1.1 GHz run Qt- or HTML5-based HMI frameworks on Linux, while the GPU renders smooth animations, trends, and 3D equipment visualizations. Display output and touch interfaces are routed through the 784-ball package's peripheral balls. Because HMI duty cycles are moderate, two A53 cores are usually sufficient, keeping system cost below quad-core alternatives. The -40C to +105C rating matches panel-mount installations near heat-generating drives; thermal spreading through the PCB is typically adequate for graphics workloads.
Recommended
Factory Automation Edge Computing
For edge analytics nodes on the factory floor, the AM6528BACDXEA combines data acquisition (via PRU-ICSS-connected sensors and fieldbuses) with local inference or rule-based decisioning on the Cortex-A53 cluster, publishing only summarized results to the cloud. This reduces uplink bandwidth and keeps safety-relevant reactions on-premise. The dual R5F cores timestamp and pre-process high-rate sensor data deterministically before handing it to Linux. The processor's -40C to +105C range supports fanless DIN-rail enclosures. Designers should size DDR memory - industrial DDR3L/DDR4 parts are common companions - to balance analytics workloads against real-time buffering needs.
Recommended
Test and Measurement Instrumentation
Benchtop and modular test instruments use the AM6528BACDXEA as the embedded controller running the instrument OS, user interface, and communication stack (USB, Ethernet). The dual A53 cores at 1.1 GHz manage the Linux application layer while the R5F subsystem sequences acquisitions with tight timing, and the PRU-ICSS can implement custom trigger and timing interfaces. The 3D graphics engine supports rich on-screen waveforms and analysis displays. The 784-ball FCCSP provides the broad peripheral mix these instruments require. In this application the full -40C to +105C range is rarely needed, but the extended rating simplifies qualification for laboratory-to-field portable instruments.
Recommended
Energy and Building Automation Controllers
Substation RTUs, solar inverter controllers, and building automation supervisors benefit from the AM6528BACDXEA's combination of industrial temperature rating, hardware fieldbus support, and Linux-class processing. The Cortex-A53 cores run protocol converters between IEC-style utility protocols and IP-based management networks, while PRU-ICSS ports provide deterministic links to protection relays and remote I/O. The R5F pair monitors watchdog and failover logic. Its -40C to +105C rating covers outdoor switchgear cabinets and rooftop equipment, and the 784-pin package provides sufficient I/O for multiple communication sections. Power-supply companions should meet the same extended temperature range for system-level reliability.
Recommended
Recommended Products Summary
Engineering reference data for AM6528BACDXEA β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | AM6548BACDXEA | AM6546BACDXEA | AM6544BACDXEA | AM6526BACDXEA | AM6528BACDXE |
|---|---|---|---|---|---|---|
| Package | 784-FCBGA (FCCSP, ACD) 23x23 mm | 784-FCBGA (FCCSP, ACD) - same | 784-FCBGA (FCCSP, ACD) - same | 784-FCBGA (FCCSP, ACD) - same | 784-FCBGA (FCCSP, ACD) - same | 784-FCBGA (FCCSP, ACD) - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Cortex-A53 Cores | 2 (1.1 GHz) | 4 (1.1 GHz) | 4 (1.1 GHz) | 4 (1.1 GHz) | 2 (1.1 GHz) | 2 (1.1 GHz) |
| Cortex-R5F Subsystem | Dual, 400 MHz | Dual, 400 MHz | Dual, 400 MHz | Dual, 400 MHz | Dual, 400 MHz | Dual, 400 MHz |
| Industrial Communications | Gigabit PRU-ICSS | Gigabit PRU-ICSS | Gigabit PRU-ICSS | [DATA_NEEDED] | [DATA_NEEDED] | Gigabit PRU-ICSS |
| 3D Graphics | Yes | Yes | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | Yes |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | 0C to +85C (commercial) |
| Unit Price (qty 1, as of 2026-09-03) | $18.75 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Dual-core A53 cost efficiency for two-core-sufficient workloads (vs AM6548BACDXEA)
- Full extended industrial temperature rating (vs AM6528BACDXE)
- Hardware-offloaded industrial Ethernet (vs Generic Cortex-A53 MPUs (non-AM65x))
- Trade-off: fewer A53 cores than quad-core siblings (vs AM6546BACDXEA)
Design Notes
The AM6528BACDXEA requires multiple core rails (A53, R5F, PRU-ICSS, DDR, and I/O domains) with defined power-up sequencing. TI provides a recommended power tree and reference PMIC solutions in the AM65x documentation set; use TI's power estimation tool with your actual core loading profile rather than worst-case datasheet numbers to size regulators. Estimated: budget input values - assume several watts total dissipation at full 1.1 GHz A53 and 400 MHz R5F load - and verify junction temperature against the -40C to +105C ambient rating with your enclosure's thermal resistance.
The 784-ball FCCSP (ACD) at 23x23 mm with fine ball pitch requires a high-layer-count PCB (typically 8-12 layers) with controlled-impedance DDR routing, matched length groups, and solid power/ground planes. Follow the TI AM65x hardware design guide for ball breakout, via-in-pad usage, and DDR fly-by/topology rules. Plan the ball-map using TI's pin-mux utility before routing to avoid conflicting peripheral assignments.
A 784-ball BGA dissipating several watts relies on the PCB as the primary heat spreader. Estimated: with a typical multi-layer board theta_JA on the order of 15-25 C/W (verify against the TI datasheet thermal appendix for your stack-up), a 3W dissipation raises junction temperature roughly 45-75C above ambient - significant against the +105C limit. Add thermal vias under the package and consider a lid-mounted heatsink or forced airflow for high-load, high-ambient designs.
Confirm silicon revision handling: the verified datasheet covers AM654x/AM652x Silicon Revision 2.1, and TI publishes revision-specific errata. Before production, check the errata document against your use of specific peripherals. Also confirm boot-mode pin strapping (boot media selection) matches your flashing strategy early in layout, since rework of boot-mode nets on a 784-ball BGA board is expensive.
Compliance Information
Compliance status was not stated in the verified web data for this ordering option. Consult the TI product page quality section for AM6528 for official RoHS/REACH declarations.