APA300-FG256 - ProASICPLUS 300K Gates FPGA, 256-LBGA | Microchip
料号： APA300-FG256 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $257.08 | $257.08 |
| 10 | $240.5 | $2,405.00 |
| 100 | $215 | $21,500.00 |
| 500 | $188.75 | $94,375.00 |
| 1,000 | $162.4 | $162,400.00 |
APA300-FG256 概述
A ProASICPLUS device is a Flash-based field programmable gate array that combines the convenience of SRAM-based FPGAs with the non-volatility of one-time-programmable devices. It sits in the broader programmable-logic hierarchy between low-density CPLDs and high-density SRAM FPGAs; the Flash configuration cell removes the need for external boot PROMs while still allowing unlimited in-system reprogramming through JTAG.
Key features of the APA300 include up to 350 MHz internal system performance and 150 MHz external performance, 32-bit/33 MHz PCI compliance, built-in Schmitt trigger and slew-rate options on every I/O, dedicated SRAM blocks with two-port access, and Live at Power-Up operation that guarantees defined logic state on every power rail transition without external configuration logic. The FlashFreeze mode further reduces standby current while retaining SRAM and register state.
Architecturally, the device uses a fine-grained sea-of-tiles structure with a four-input lookup table per logic tile and dedicated routing tracks, paired with dedicated two-port SRAM blocks placed along the tile rows. The Flash configuration is in-system programmable through IEEE 1149.1 JTAG, eliminating external boot memory and supporting field upgrades without hardware rework.
Typical applications include glue-logic replacement on industrial controllers, low-volume ASIC replacement for telecom line cards, secure cryptographic key storage in payment and access systems, avionics and military prototypes requiring live-at-power-up determinism, and PCI target devices on embedded computing platforms. The 256-ball LBGA footprint and I/O count make it suitable for medium-complexity bus-bridging designs.
When designing with this part, allocate at least one decoupling capacitor per VCC/IO power pin pair and follow Microsemi/Microchip recommended JTAG chain ordering if multiple ProASICPLUS devices share the boundary-scan bus. Designers migrating from the legacy APA300-FG144 should verify BGA ball-mapping compatibility because the 256-ball package adds power and ground pins that are absent on the smaller FG144 footprint.
This page synthesizes distributor pricing, same-family alternatives, and practical layout notes not consolidated in the manufacturer datasheet, complementing the official documentation with sourcing and design guidance.
直接替换替代料： APA300-FG256 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
APA450-FG256
✅ 直接替换📋 参考替代料（不在目录中）
APA600-FG256
✅ 直接替换📋 参考替代料（不在目录中）
APA1000-FG256
✅ 直接替换📋 参考替代料（不在目录中）
APA750-FG256
✅ 直接替换📋 参考替代料（不在目录中）
APA300-FG256 最大额定值与电气特性
| Family | ProASICPLUS (APA300) |
| System Gates | 300,000 |
| Embedded SRAM | 73,728 bits (two-port) |
| User I/Os (max) | 186 |
| 封装 | 256-ball LBGA (FG256) |
| Core Supply Voltage | 2.5 V |
| I/O Supply Voltage | 3.3 V (PCI compatible) |
| Internal Performance | up to 350 MHz |
| External Performance | up to 150 MHz |
| PCI Support | 32-bit, 33 MHz |
| Configuration Method | Flash, in-system JTAG (IEEE 1149.1) |
| Live at Power-Up | Yes |
| 工作温度 | 0 C to 70 C (commercial) |
| Schmitt Trigger Option | Yes (per I/O) |
| Slew-Rate Control | Yes (per I/O) |
| RoHS 状态 | Compliant |
APA300-FG256 256-ball lbga (fg256) 引脚配置指南
APA300-FG256（256-ball lbga (fg256) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： APA300-FG256.
请参阅 数据手册 以查看完整引脚配置。
典型应用
APA300-FG256 适用于 6 应用s: Industrial Glue Logic Replacement, Low-Volume ASIC Replacement, Secure Cryptographic Key Storage, Avionics and Military Prototypes, PCI Target Devices on Embedded Platforms, Medical Imaging and Diagnostic Equipment.
Industrial Glue Logic Replacement
The APA300-FG256 is widely used to replace discrete glue logic on industrial controllers because its 300,000 system gates, 186 I/Os, and Flash-based configuration allow designers to consolidate multiple 74-series bus-bridging chips into a single BGA. The device is Live at Power-Up, so industrial machines boot into a deterministic state without external PROMs - critical for factory-automation PLCs that must initialize within milliseconds of power-on. Its 2.5 V core and 3.3 V I/O banks also mate directly with legacy 3.3 V peripherals, while the Schmitt-trigger I/O option debounces noisy sensor inputs.
推荐
Low-Volume ASIC Replacement
The APA300-FG256 is ideal for low-volume ASIC replacement in telecom line cards and industrial gateways where NRE costs preclude a custom mask set. With 300K gates, 73,728 bits of two-port SRAM, and 350 MHz internal performance, it can implement custom serial-protocol engines or bus adapters while remaining in-system reprogrammable through JTAG. Compared with SRAM-based FPGAs, its Flash-based configuration also removes the need for a separate boot PROM, reducing BOM count and board area - important when the line card has tight height constraints.
推荐
Secure Cryptographic Key Storage
The APA300-FG256's Flash-based configuration cell supports secure key storage in payment terminals, hardware security modules, and access-control systems. Because the bitstream is held in on-chip Flash rather than external SRAM, designers can lock the JTAG port and prevent bitstream readback - achieving ASIC-grade security without an ASIC. The 256-ball LBGA footprint also makes reverse engineering more difficult than plastic QFP packages, while the 186 user I/Os are sufficient to interface with most smart-card and cryptographic co-processors.
推荐
Avionics and Military Prototypes
The APA300-FG256 is often used in avionics and military prototypes that demand Live at Power-Up determinism and radiation-tolerant Flash cells. Because the bitstream is non-volatile, the FPGA enters a defined state immediately at every power-up - critical for flight-control and weapons-system prototypes where SRAM FPGAs would require an additional configuration controller. The ProASICPLUS family also supports extended temperature grades, and the 256-ball LBGA package fits the form factor of standard ruggedized mezzanine modules.
推荐
PCI Target Devices on Embedded Platforms
The APA300-FG256 supports 32-bit/33 MHz PCI target mode, making it suitable for legacy PCI add-in cards, industrial PCs, and embedded single-board computers. With 186 user I/Os and 73 kbits of two-port SRAM, the device can implement PCI target state machines, DMA engines, and bus-bridging logic without external memory. The 2.5 V core and 3.3 V PCI-compliant I/O banks match the standard PCI signalling environment, while JTAG programming simplifies in-system firmware updates on installed cards.
推荐
Medical Imaging and Diagnostic Equipment
The APA300-FG256 fits in medical imaging and diagnostic equipment such as ultrasound front-ends, patient monitors, and portable diagnostic carts where Live at Power-Up and deterministic boot behavior are essential for safety certifications. The 350 MHz internal performance and 73 kbits of two-port SRAM allow designers to implement custom beamforming or DSP pre-processing, while the Flash-based configuration streamlines IEC 62304 and FDA validation because the bitstream cannot drift like SRAM-based FPGAs. The 256-ball LBGA also supports the dense layouts of portable carts.
推荐
推荐产品汇总
工程参考数据： APA300-FG256 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | APA450-FG256 | APA600-FG256 | APA1000-FG256 | APA750-FG256 |
|---|---|---|---|---|---|
| Package | 256-ball LBGA (FG256) | 256-ball LBGA (FG256) - same | 256-ball LBGA (FG256) - same | 256-ball LBGA (FG256) - same | 256-ball LBGA (FG256) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Family | ProASICPLUS | ProASICPLUS | ProASICPLUS | ProASICPLUS | ProASICPLUS |
| System Gates | 300,000 | 450,000 | 600,000 | 1,000,000 | 750,000 |
| Embedded SRAM | 73,728 bits | 108,000 bits | 126,000 bits | 198,000 bits | 147,000 bits |
| User I/Os (max) | 186 | 186 | 186 | 186 | 186 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| I/O Voltage | 3.3 V (PCI) | 3.3 V (PCI) | 3.3 V (PCI) | 3.3 V (PCI) | 3.3 V (PCI) |
| Internal Performance | 350 MHz | 350 MHz | 350 MHz | 350 MHz | 350 MHz |
| External Performance | 150 MHz | 150 MHz | 150 MHz | 150 MHz | 150 MHz |
关键差异点
- Pin-compatible upward migration to higher-density ProASICPLUS variants （对比 APA450-FG256)
- Flash-based non-volatile configuration vs SRAM-based competitors （对比 Xilinx Spartan-3 XC3S300A)
- Higher system gate count at the same price tier （对比 APA1000-FG256)
设计说明
The APA300-FG256 requires both a 2.5 V core rail and a 3.3 V I/O rail; power-up sequencing is not strictly required, but the datasheet recommends that VCC (core) reaches 90% of nominal before the I/O banks begin switching to avoid partial-configuration latch-up. Use a low-ESR bulk capacitor (>= 22 uF) on each rail plus a 0.1 uF ceramic per VCC/IOB pin pair; inrush current during JTAG programming can briefly exceed 200 mA on the 2.5 V rail, so size the regulator with margin.
The FG256 is a 1.0 mm-pitch fine-pitch LBGA that demands 4-6 layer PCB stackup with continuous ground and power planes under the device. Escape routing on the top layer should use 0.2 mm (8 mil) traces and 0.4 mm (16 mil) antipads on inner planes; pair every 2-3 signal balls with a stitching via to the ground plane to control impedance. Microchip recommends using the same footprint land pattern as the larger APA450-FG256/APA600-FG256 so that PCB artwork remains reusable across ProASICPLUS family migration.
Common pitfalls include (1) forgetting to connect all VCC and GND balls - missing a single power pin can prevent the Flash configuration cell from loading correctly; (2) tying JTAG TCK too long without a series-termination resistor, which can cause programming failures; (3) attempting to load a Spartan-3 bitstream into the ProASICPLUS device - the file formats are not compatible. Always use Microchip Libero IDE or FlashPro to generate the .bit or .stp file, and verify against the JTAG IDCODE 0x1E2F0023 in BSDL files.
合规信息
RoHS and REACH compliance per Microchip/Microsemi product declarations. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade qualified IC; industrial and commercial grade only.
