APA300-FG256 - ProASICPLUS 300K Gates FPGA, 256-LBGA | Microchip
MPN: APA300-FG256 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $257.08 | $257.08 |
| 10 | $240.5 | $2,405.00 |
| 100 | $215 | $21,500.00 |
| 500 | $188.75 | $94,375.00 |
| 1,000 | $162.4 | $162,400.00 |
APA300-FG256 Overview
A ProASICPLUS device is a Flash-based field programmable gate array that combines the convenience of SRAM-based FPGAs with the non-volatility of one-time-programmable devices. It sits in the broader programmable-logic hierarchy between low-density CPLDs and high-density SRAM FPGAs; the Flash configuration cell removes the need for external boot PROMs while still allowing unlimited in-system reprogramming through JTAG.
Key features of the APA300 include up to 350 MHz internal system performance and 150 MHz external performance, 32-bit/33 MHz PCI compliance, built-in Schmitt trigger and slew-rate options on every I/O, dedicated SRAM blocks with two-port access, and Live at Power-Up operation that guarantees defined logic state on every power rail transition without external configuration logic. The FlashFreeze mode further reduces standby current while retaining SRAM and register state.
Architecturally, the device uses a fine-grained sea-of-tiles structure with a four-input lookup table per logic tile and dedicated routing tracks, paired with dedicated two-port SRAM blocks placed along the tile rows. The Flash configuration is in-system programmable through IEEE 1149.1 JTAG, eliminating external boot memory and supporting field upgrades without hardware rework.
Typical applications include glue-logic replacement on industrial controllers, low-volume ASIC replacement for telecom line cards, secure cryptographic key storage in payment and access systems, avionics and military prototypes requiring live-at-power-up determinism, and PCI target devices on embedded computing platforms. The 256-ball LBGA footprint and I/O count make it suitable for medium-complexity bus-bridging designs.
When designing with this part, allocate at least one decoupling capacitor per VCC/IO power pin pair and follow Microsemi/Microchip recommended JTAG chain ordering if multiple ProASICPLUS devices share the boundary-scan bus. Designers migrating from the legacy APA300-FG144 should verify BGA ball-mapping compatibility because the 256-ball package adds power and ground pins that are absent on the smaller FG144 footprint.
This page synthesizes distributor pricing, same-family alternatives, and practical layout notes not consolidated in the manufacturer datasheet, complementing the official documentation with sourcing and design guidance.
Drop-in alternatives for APA300-FG256 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
APA450-FG256
✅ Drop-In📋 Reference alternative (not in catalog)
APA600-FG256
✅ Drop-In📋 Reference alternative (not in catalog)
APA1000-FG256
✅ Drop-In📋 Reference alternative (not in catalog)
APA750-FG256
✅ Drop-In📋 Reference alternative (not in catalog)
APA300-FG256 Maximum Ratings & Electrical Characteristics
| Family | ProASICPLUS (APA300) |
| System Gates | 300,000 |
| Embedded SRAM | 73,728 bits (two-port) |
| User I/Os (max) | 186 |
| Package | 256-ball LBGA (FG256) |
| Core Supply Voltage | 2.5 V |
| I/O Supply Voltage | 3.3 V (PCI compatible) |
| Internal Performance | up to 350 MHz |
| External Performance | up to 150 MHz |
| PCI Support | 32-bit, 33 MHz |
| Configuration Method | Flash, in-system JTAG (IEEE 1149.1) |
| Live at Power-Up | Yes |
| Operating Temperature | 0 C to 70 C (commercial) |
| Schmitt Trigger Option | Yes (per I/O) |
| Slew-Rate Control | Yes (per I/O) |
| RoHS Status | Compliant |
APA300-FG256 256-ball lbga (fg256) Pin Configuration Guide
Pin configuration for APA300-FG256 (256-ball lbga (fg256) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for APA300-FG256.
Refer to the datasheet for full pin configuration.
Typical Applications
APA300-FG256 is suitable for 6 applications: Industrial Glue Logic Replacement, Low-Volume ASIC Replacement, Secure Cryptographic Key Storage, Avionics and Military Prototypes, PCI Target Devices on Embedded Platforms, Medical Imaging and Diagnostic Equipment.
Industrial Glue Logic Replacement
The APA300-FG256 is widely used to replace discrete glue logic on industrial controllers because its 300,000 system gates, 186 I/Os, and Flash-based configuration allow designers to consolidate multiple 74-series bus-bridging chips into a single BGA. The device is Live at Power-Up, so industrial machines boot into a deterministic state without external PROMs - critical for factory-automation PLCs that must initialize within milliseconds of power-on. Its 2.5 V core and 3.3 V I/O banks also mate directly with legacy 3.3 V peripherals, while the Schmitt-trigger I/O option debounces noisy sensor inputs.
Recommended
Low-Volume ASIC Replacement
The APA300-FG256 is ideal for low-volume ASIC replacement in telecom line cards and industrial gateways where NRE costs preclude a custom mask set. With 300K gates, 73,728 bits of two-port SRAM, and 350 MHz internal performance, it can implement custom serial-protocol engines or bus adapters while remaining in-system reprogrammable through JTAG. Compared with SRAM-based FPGAs, its Flash-based configuration also removes the need for a separate boot PROM, reducing BOM count and board area - important when the line card has tight height constraints.
Recommended
Secure Cryptographic Key Storage
The APA300-FG256's Flash-based configuration cell supports secure key storage in payment terminals, hardware security modules, and access-control systems. Because the bitstream is held in on-chip Flash rather than external SRAM, designers can lock the JTAG port and prevent bitstream readback - achieving ASIC-grade security without an ASIC. The 256-ball LBGA footprint also makes reverse engineering more difficult than plastic QFP packages, while the 186 user I/Os are sufficient to interface with most smart-card and cryptographic co-processors.
Recommended
Avionics and Military Prototypes
The APA300-FG256 is often used in avionics and military prototypes that demand Live at Power-Up determinism and radiation-tolerant Flash cells. Because the bitstream is non-volatile, the FPGA enters a defined state immediately at every power-up - critical for flight-control and weapons-system prototypes where SRAM FPGAs would require an additional configuration controller. The ProASICPLUS family also supports extended temperature grades, and the 256-ball LBGA package fits the form factor of standard ruggedized mezzanine modules.
Recommended
PCI Target Devices on Embedded Platforms
The APA300-FG256 supports 32-bit/33 MHz PCI target mode, making it suitable for legacy PCI add-in cards, industrial PCs, and embedded single-board computers. With 186 user I/Os and 73 kbits of two-port SRAM, the device can implement PCI target state machines, DMA engines, and bus-bridging logic without external memory. The 2.5 V core and 3.3 V PCI-compliant I/O banks match the standard PCI signalling environment, while JTAG programming simplifies in-system firmware updates on installed cards.
Recommended
Medical Imaging and Diagnostic Equipment
The APA300-FG256 fits in medical imaging and diagnostic equipment such as ultrasound front-ends, patient monitors, and portable diagnostic carts where Live at Power-Up and deterministic boot behavior are essential for safety certifications. The 350 MHz internal performance and 73 kbits of two-port SRAM allow designers to implement custom beamforming or DSP pre-processing, while the Flash-based configuration streamlines IEC 62304 and FDA validation because the bitstream cannot drift like SRAM-based FPGAs. The 256-ball LBGA also supports the dense layouts of portable carts.
Recommended
Recommended Products Summary
Engineering reference data for APA300-FG256 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | APA450-FG256 | APA600-FG256 | APA1000-FG256 | APA750-FG256 |
|---|---|---|---|---|---|
| Package | 256-ball LBGA (FG256) | 256-ball LBGA (FG256) - same | 256-ball LBGA (FG256) - same | 256-ball LBGA (FG256) - same | 256-ball LBGA (FG256) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Family | ProASICPLUS | ProASICPLUS | ProASICPLUS | ProASICPLUS | ProASICPLUS |
| System Gates | 300,000 | 450,000 | 600,000 | 1,000,000 | 750,000 |
| Embedded SRAM | 73,728 bits | 108,000 bits | 126,000 bits | 198,000 bits | 147,000 bits |
| User I/Os (max) | 186 | 186 | 186 | 186 | 186 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| I/O Voltage | 3.3 V (PCI) | 3.3 V (PCI) | 3.3 V (PCI) | 3.3 V (PCI) | 3.3 V (PCI) |
| Internal Performance | 350 MHz | 350 MHz | 350 MHz | 350 MHz | 350 MHz |
| External Performance | 150 MHz | 150 MHz | 150 MHz | 150 MHz | 150 MHz |
Key Differentiators
- Pin-compatible upward migration to higher-density ProASICPLUS variants (vs APA450-FG256)
- Flash-based non-volatile configuration vs SRAM-based competitors (vs Xilinx Spartan-3 XC3S300A)
- Higher system gate count at the same price tier (vs APA1000-FG256)
Design Notes
The APA300-FG256 requires both a 2.5 V core rail and a 3.3 V I/O rail; power-up sequencing is not strictly required, but the datasheet recommends that VCC (core) reaches 90% of nominal before the I/O banks begin switching to avoid partial-configuration latch-up. Use a low-ESR bulk capacitor (>= 22 uF) on each rail plus a 0.1 uF ceramic per VCC/IOB pin pair; inrush current during JTAG programming can briefly exceed 200 mA on the 2.5 V rail, so size the regulator with margin.
The FG256 is a 1.0 mm-pitch fine-pitch LBGA that demands 4-6 layer PCB stackup with continuous ground and power planes under the device. Escape routing on the top layer should use 0.2 mm (8 mil) traces and 0.4 mm (16 mil) antipads on inner planes; pair every 2-3 signal balls with a stitching via to the ground plane to control impedance. Microchip recommends using the same footprint land pattern as the larger APA450-FG256/APA600-FG256 so that PCB artwork remains reusable across ProASICPLUS family migration.
Common pitfalls include (1) forgetting to connect all VCC and GND balls - missing a single power pin can prevent the Flash configuration cell from loading correctly; (2) tying JTAG TCK too long without a series-termination resistor, which can cause programming failures; (3) attempting to load a Spartan-3 bitstream into the ProASICPLUS device - the file formats are not compatible. Always use Microchip Libero IDE or FlashPro to generate the .bit or .stp file, and verify against the JTAG IDCODE 0x1E2F0023 in BSDL files.
Compliance Information
RoHS and REACH compliance per Microchip/Microsemi product declarations. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade qualified IC; industrial and commercial grade only.
