ATSAME70Q19B-CN - 300MHz Cortex-M7 MCU 512KB Flash | Microchip
料号： ATSAME70Q19B-CN ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.95 | $169.50 |
| 100 | $14.85 | $1,485.00 |
| 500 | $13.2 | $6,600.00 |
| 1,000 | $11.95 | $11,950.00 |
ATSAME70Q19B-CN 概述
An ARM Cortex-M7 microcontroller is a 32-bit RISC processor core designed for embedded applications requiring high computational throughput, deterministic interrupt latency, and DSP-class signal processing. The M7 architecture supersedes earlier Cortex-M4/M3 cores by adding a six-stage superscalar pipeline, dual-issue capability, branch prediction, and a single-precision FPU that together deliver roughly twice the CoreMark/mW efficiency of an M4. Within Microchip's wider hierarchy, the SAM E70 series sits between the Cortex-M4-based SAM S70/SAM E70 siblings and the Cortex-M7 high-end portfolio, bridging motor control, industrial automation, and high-speed connectivity.
Key features include 300MHz core frequency, 512KB Flash with ECC, 256KB SRAM, an integrated 12-bit ADC, a 12-bit DAC, multiple UART/SPI/TWI interfaces, HS USB, dual CAN-FD controllers, and an Ethernet MAC. The 144-LFBGA package provides a small footprint suitable for space-constrained designs while exposing a rich peripheral set for system integration. The device operates from a 1.2V internal core supply with wide I/O tolerance.
Architecturally, the SAME70Q19B-CN uses the M7's tightly-coupled memory (TCM) interface with configurable wait states, supports cryptographic accelerators in related family members, and integrates a high-speed bus matrix. Performance analysis shows the device achieves over 1500 CoreMark while maintaining deterministic interrupt response under 12 cycles, making it suitable for hard-real-time control loops.
Typical applications include industrial motor control (BLDC/PMSM drives), factory automation PLCs, automotive body and chassis subsystems, audio processing with the integrated DAC, high-speed connectivity gateways, and graphical HMI terminals. Designers appreciate the SAM E70 family for offering Cortex-M7 performance with mature Microchip ecosystem support (MPLAB X, Harmony 3, ASF).
When designing with this device, ensure the PCB layout adheres to the LFBGA-144 escape routing guidelines and that the 1.2V core is supplied by an internal LDO that requires adequate bulk capacitance on VDDCORE pins. Decoupling must follow the reference schematic in the datasheet.
This page synthesizes distributor pricing, drop-in alternatives within the SAME70 family, and practical design notes that complement the Microchip datasheet with cross-brand sourcing intelligence.
直接替换替代料： ATSAME70Q19B-CN ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： ATSAME70Q19B-CN （相同外形与封装尺寸） ——差异在于 ADC, Package, USB, Operating Temperature, Ethernet.
快速对比工具——选择替代料号进行并排对比：
ATSAME70Q19A-CN
✅ 直接替换✓ 有现货
$6.68 / 个
查看数据手册 →ATSAME70Q19B-CNT
✅ 直接替换📋 参考替代料（不在目录中）
ATSAME70N21B-CN
✅ 直接替换✓ 有现货
$12.1 / 个
查看数据手册 →ATSAME70N20A-CN
✅ 直接替换✓ 有现货
$7.75 / 个
查看数据手册 →ATSAME70N19B-AN
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$11.04 / 个
查看数据手册 →ATSAME70Q19B-CN 最大额定值与电气特性
| Core Architecture | ARM Cortex-M7 with FPU |
| 最大时钟频率 | 300 MHz |
| Flash Memory | 512 KB (512K x 8) |
| SRAM | 256 KB |
| 封装 | 144-LFBGA (10x10 mm) |
| Operating Voltage (Core) | 1.2 V |
| 工作温度 | -40C to +85C (commercial) |
| ADC | 12-bit |
| DAC | 12-bit |
| CAN-FD | 2 controllers |
| USB | High-Speed USB |
| Ethernet | 10/100 MAC |
| 安装类型 | Surface Mount (BGA) |
| MSL 等级 | 3 (per JEDEC J-STD-020) |
| RoHS 状态 | Compliant |
ATSAME70Q19B-CN 144-lfbga (10x10 mm) 引脚配置指南
ATSAME70Q19B-CN（144-lfbga (10x10 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： ATSAME70Q19B-CN.
请参阅 数据手册 以查看完整引脚配置。
典型应用
ATSAME70Q19B-CN 适用于 6 应用s: Industrial Motor Control (BLDC / PMSM Drives), Industrial Automation PLCs and Gateways, Automotive Body and Chassis ECUs, Audio Processing with Integrated DAC, High-Speed Connectivity Gateways, Graphical HMI Terminals.
Industrial Motor Control (BLDC / PMSM Drives)
The ATSAME70Q19B-CN is well-suited for industrial BLDC and PMSM motor control where 300MHz Cortex-M7 performance drives field-oriented control (FOC) algorithms in real time. Its dual CAN-FD controllers enable multi-axis coordination across factory floor drives, while the 12-bit ADC with up to 24 channels samples phase currents at sufficient rates for sinusoidal commutation. Unlike Cortex-M4-based MCUs, the M7's dual-issue pipeline and hardware FPU accelerate Park/Clarke transforms so the same 300MHz budget leaves margin for predictive maintenance diagnostics. The 144-LFBGA footprint is small enough to fit inside an integrated servo drive enclosure, and the SAM E70 family's deterministic 12-cycle interrupt latency ensures the FOC loop closes within a single PWM period at 20kHz switching frequency.
推荐
Industrial Automation PLCs and Gateways
In PLC and industrial gateway designs, the ATSAME70Q19B-CN integrates Ethernet MAC, dual CAN-FD, and HS USB so it can terminate fieldbus and industrial Ethernet protocols in a single IC. The 300MHz Cortex-M7 runs full protocol stacks (Modbus TCP, EtherCAT slave, CANopen) while leaving headroom for IEC 61131-3 soft-PLC runtimes. The 256KB SRAM and 512KB Flash accommodate binary ladder-logic images plus firmware updates via Microchip's dual-bank OTA boot scheme. Drop-in compatibility with the ATSAME70N21B-CN enables the same hardware platform to scale from 512KB Flash up to 2MB Flash when customers need richer protocol support. The 144-LFBGA package fits 4-layer PCBs typical of compact industrial controllers without requiring HDI stackups.
推荐
Automotive Body and Chassis ECUs
The ATSAME70Q19B-CN powers automotive body and chassis ECUs such as body control modules, HVAC controllers, and lighting drivers. Its dual CAN-FD interfaces terminate modern vehicle networks at 5 Mbps while supporting backward compatibility with classical CAN 2.0B. The 300MHz Cortex-M7 runs AUTOSAR-style real-time kernels, and the 512KB Flash with ECC plus 256KB SRAM support OTA firmware updates and diagnostic service handlers (UDS/KWP2000). While the ATSAME70Q19B-CN is not AEC-Q100 qualified (the automotive -AN/-MBN suffix variants are), it serves as the engineering reference for designing the AEC-Q100 qualified derivatives. The 144-LFBGA package withstands automotive thermal and vibration profiles when paired with appropriate underfill.
推荐
Audio Processing with Integrated DAC
The ATSAME70Q19B-CN drives cost-sensitive audio applications via its integrated 12-bit DAC running at up to 1 MSPS, suitable for voice prompts, beep generators, and entry-level DAC line outputs. The Cortex-M7 DSP extensions accelerate FFT-based audio processing and FIR filtering without burdening the CPU. Combined with HS USB, the device doubles as a USB audio streaming endpoint at 48kHz/16-bit. The 256KB SRAM serves as audio buffer space for multiple simultaneous streams. Designers appreciate that the SAM E70 family audio middleware in MPLAB Harmony 3 abstracts the I2S/TDM interfaces used for external CODECs, allowing software reuse from the SAME70 Xplained Ultra reference design.
推荐
High-Speed Connectivity Gateways
The ATSAME70Q19B-CN serves as the protocol-conversion brain of connectivity gateways bridging CAN-FD, Ethernet, HS USB, and UART buses. Its 300MHz Cortex-M7 with FPU handles protocol parsing and routing without offloading to a host processor. The 144-LFBGA package integrates this connectivity in a small footprint suitable for DIN-rail gateway enclosures. The 256KB SRAM buffers transient message bursts between buses, while the 512KB Flash holds multiple protocol stacks simultaneously. Designers using the SAM E70 family can leverage MPLAB Harmony 3 networking middleware (TCP/IP, MQTT, HTTP) to reduce time-to-market for IoT-edge gateway products.
推荐
Graphical HMI Terminals
The ATSAME70Q19B-CN drives graphical HMI terminals with TFT LCD displays up to WVGA resolution via its external bus interface. The 300MHz Cortex-M7 sustains 60fps UI rendering for menu navigation, gauge animations, and alarm screens. The 256KB SRAM stores framebuffer tiles plus UI state, while 512KB Flash holds icon sets and translations. The integrated 12-bit ADC reads resistive touchscreens and rotary encoders without external components. Compared with Cortex-M4 HMI controllers, the M7's dual-issue pipeline handles JPEG decode and vector rendering without breaking a sweat. The 144-LFBGA package fits compact HMI panel designs behind 3.5" to 5" displays.
推荐
推荐产品汇总
工程参考数据： ATSAME70Q19B-CN ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | ATSAME70Q19A-CN | ATSAME70Q19B-CNT | ATSAME70N21B-CN | ATSAME70N20A-CN | ATSAME70N19B-AN |
|---|---|---|---|---|---|---|
| Package | 144-LFBGA (10x10) | 144-LFBGA (10x10) - same | 144-LFBGA (10x10) - same | 144-LFBGA (10x10) - same | 144-LFBGA (10x10) - same | 144-LFBGA (10x10) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU |
| Maximum Clock Frequency | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 2 MB | 1 MB | 512 KB |
| SRAM | 256 KB | 256 KB | 256 KB | 384 KB | 256 KB | 256 KB |
| Silicon Revision | B | A | B | B | A | B |
| Packaging Form | Tray | Tray | Tape & Reel | Tray | Tray | Tray |
关键差异点
- B-silicon revision with errata fixes versus A-revision （对比 ATSAME70Q19A-CN)
- Lower unit cost and 256KB SRAM fit versus N21 family （对比 ATSAME70N21B-CN)
- Standard 144-LFBGA footprint versus QFP variant （对比 ATSAME70N19B-AN)
设计说明
The 144-LFBGA package uses 0.8 mm ball pitch. PCB escape routing requires microvia HDI stackup or dog-bone fanout on the top layer; 4-layer PCBs without HDI risk signal integrity loss on high-speed traces. Match the BGA pad diameter and NSMD land pattern to Microchip's reference design. Use a reflow profile consistent with MSL-3 moisture sensitivity (JEDEC J-STD-020).
The 1.2V core is supplied by an internal LDO fed from VDDCORE pins. Place 100nF decoupling capacitors adjacent to every VDDCORE/VDDIO pair and a 4.7uF bulk capacitor on the main VDD rail. Estimated: at 300MHz active CPU, core current peaks at ~120 mA, so the LDO must dissipate (VIN-1.2V) * 0.12A = roughly 0.5W at VIN=5V. Provide adequate copper pour or thermal vias under the die area.
For HS USB and Ethernet signals, maintain 90-ohm differential impedance on the USB pair and 100-ohm on the Ethernet pair. Keep high-speed traces short and reference them to a continuous ground plane. Series ferrite beads on VDDIO near the PHY area reduce common-mode emissions.
Do not confuse the commercial ATSAME70Q19B-CN with the industrial ATSAME70Q19B-MN or automotive AEC-Q100 qualified variants - the operating temperature range and qualification status differ. Also, the A-silicon (ATSAME70Q19A-CN) and B-silicon (ATSAME70Q19B-CN) revisions differ in errata status; review the silicon errata document before committing to a revision in production.
Place the 12 MHz crystal as close as possible to the XIN/XOUT pins with short, symmetric traces surrounded by a ground guard ring. The PLL input impedance is sensitive to stray capacitance; route the crystal traces over a continuous ground plane and avoid crossing other signal traces.
合规信息
RoHS and REACH compliant per Microchip product page. The ATSAME70Q19B-CN is the commercial -CN variant (not AEC-Q100 qualified); for automotive applications use the ATSAME70Q19B-MN industrial-grade or ATSAME70Q19B-AN/-MBN AEC-Q100 qualified variants.
