DSPC56371AF150 - 150 MHz Audio DSP, 80-LQFP | NXP Semiconductors
料号： DSPC56371AF150 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $26.25 | $262.50 |
| 100 | $23.95 | $2,395.00 |
| 500 | $21.4 | $10,700.00 |
| 1,000 | $18.75 | $18,750.00 |
DSPC56371AF150 概述
A digital signal processor (DSP) is a specialized microprocessor whose architecture (Harvard-style, with separate program and data buses, and a dedicated multiply-accumulate unit) is optimized for the numeric-intensive, real-time computations required by audio, video, communications and control algorithms. Unlike a general-purpose microcontroller, a DSP performs multiply-accumulate (MAC) operations in a single cycle and supports zero-overhead looping, making it well suited to FIR/IIR filtering, FFTs, and codec post-processing. The DSPC56371AF150 belongs to the DSP56300 family tree (DSP -> DSP563xx -> audio DSP -> 24-bit fixed-point DSP), a hierarchy that frames it relative to both microcontrollers and modern ARM-based audio SoCs.
Key specifications include a 150 MHz core clock, 24-bit data word size, 264 kB on-chip RAM, 384 kB on-chip ROM, integrated Host Interface, I2C, SAI and SPI peripheral set, 3.30 V I/O supply, and the 80-LQFP (14x14) gull-wing surface-mount package. The audio-targeted feature set includes hardware-accelerated Dolby Digital, Dolby Pro Logic IIx, Dolby Digital Surround EX, DTS, MPEG-2 AAC and other surround codecs, allowing a single chip to handle decoding and post-processing for a multi-channel A/V receiver.
From a system-level perspective, the part is typically paired with a digital audio receiver (DIR), an audio DAC (such as a multi-channel PCM17xx), and a host microcontroller. Power is derived from a low-noise LDO supplying the 1.6 V core and 3.3 V I/O rails, and crystal selection should match the internal PLL to lock the 150 MHz core cleanly. Engineers designing AV receivers and automotive head-units use the DSPC56371AF150 to off-load all real-time audio decoding and bass-management from the application processor.
Typical applications include A/V receivers, home theater in a box (HTiB), surround-sound soundbars, digital-TV audio sub-boards, mini/micro stereo systems, automotive head-unit amplifiers, and aftermarket automotive audio processors. A practical design tip is to keep the PLL reference, host interface and SAI traces length-matched and impedance-controlled to avoid jitter on the SAI clocks feeding downstream DACs.
This page synthesizes distributor pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet alone, helping engineers select, source, and qualify a replacement for the DSPC56371AF150 in active designs.
直接替换替代料： DSPC56371AF150 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： DSPC56371AF150 （相同外形与封装尺寸） ——差异在于 Package, Core, Core Clock Frequency, Core Supply Voltage, I/O Supply Voltage.
快速对比工具——选择替代料号进行并排对比：
DSPC56371AF180
✅ 直接替换✓ 有现货
$66 / 个
查看数据手册 →DSPB56371AF150
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$13.9 / 个
查看数据手册 →DSPB56371AF180
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$41.62 / 个
查看数据手册 →DSPC56371AE150
✅ 直接替换📋 参考替代料（不在目录中）
DSPC56371AF150 规格参数
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | DSP563xx |
| Core Type | DSP56300 24-bit fixed-point DSP core |
| Core Clock Speed | 150 MHz |
| MIPS | 150 MIPS |
| Data Word Size | 24-bit |
| On-Chip RAM | 264 kB |
| On-Chip ROM | 384 kB |
| Program Memory Type | ROM (mask-programmed) |
| Host Interfaces | Host Interface, I2C, SAI, SPI |
| I/O Supply Voltage | 3.30 V |
| Core Supply Voltage | 1.6 V (typical) |
| Audio Decoders Supported | Dolby Digital, Dolby Pro Logic IIx, Dolby Digital Surround EX, DTS, MPEG-2 AAC and additional surround codecs |
| 封装 | 80-LQFP (14x14 mm), gull-wing |
| 安装类型 | Surface Mount |
| 工作温度范围 | -40C to +85C (industrial) |
DSPC56371AF150 80-lqfp (14x14 mm), gull-wing 引脚配置指南
DSPC56371AF150（80-lqfp (14x14 mm), gull-wing 封装）的引脚配置。 引脚编号、功能和连接图在制造商数据手册中定义。请参阅该手册以了解确切的封装尺寸和焊接指南。
暂无详细引脚数据： DSPC56371AF150.
请参阅 数据手册 以查看完整引脚配置。
典型应用
DSPC56371AF150 适用于 6 应用s: Audio/Video Receiver (AVR) Decoder, Home Theater in a Box (HTiB), Automotive Head-Unit Audio Processor, Digital-TV Audio Sub-Board, Mini/Micro Stereo System, Soundbar Audio Processor.
Audio/Video Receiver (AVR) Decoder
The DSPC56371AF150 is the primary surround-decoder DSP in mid-range A/V receivers. Its mask-ROM firmware accelerates Dolby Digital, Dolby Pro Logic IIx, Dolby Digital Surround EX, DTS and MPEG-2 AAC in hardware, off-loading the main application processor. The 150 MIPS throughput supports 7.1-channel decode plus bass management and room-correction post-processing in real time. Compared with a software-only solution on an ARM SoC, the dedicated 24-bit MAC architecture consumes less MIPS per channel and deterministically meets multi-channel latency budgets. The 80-LQFP (14x14 mm) footprint is the standard AVR mainboard land pattern and the SAI interface streams 8-channel PCM directly to a multi-channel DAC such as the PCM1690.
推荐
Home Theater in a Box (HTiB)
HTiB systems rely on a single DSP to handle multi-channel decode, channel routing, bass management and speaker time-alignment. The DSPC56371AF150 fits this role because its 384 kB ROM holds the entire Dolby/DTS codec suite, eliminating the need for external program memory and reducing BOM cost. At 150 MIPS it can decode a 5.1-channel bitstream while simultaneously running an FIR-based crossover and DC protection on each channel. Designers pair it with a small host MCU for user-interface and source-selection, and use the I2C port to send volume and tone-control commands. The 80-LQFP surface-mount package is suitable for low-cost four-layer FR4 HTiB mainboards.
推荐
Automotive Head-Unit Audio Processor
Automotive head units need a robust audio DSP capable of running decoder, up-mixer and active-crossover algorithms in a thermally challenging environment. The DSPC56371AF150's 80-LQFP package, industrial operating temperature range, and on-chip Dolby/DTS firmware make it a proven choice for OEM and aftermarket head-unit designs. The SAI interface streams TDM audio to the output DACs, while the SPI port communicates with the head-unit's main MCU for volume, fader and source control. Compared with newer ARM Cortex-A based audio SoCs, the DSPC56371AF150 offers deterministic real-time behavior and license-free access to the codec suite baked into its ROM.
推荐
Digital-TV Audio Sub-Board
In a digital-TV chassis, an audio sub-board off-loads all surround decoding and post-processing from the main SoC. The DSPC56371AF150 handles MPEG-2 AAC and Dolby Digital Plus bitstreams from the broadcast stream, applies dynamic-range compression, and outputs a stereo down-mix (or full 5.1) over SAI to the TV's internal speakers or HDMI-ARC transmitter. The 264 kB on-chip RAM provides ample buffer space for up to 250 ms of audio delay-lip-sync correction. Designers keep the DSP isolated on a separate PCB region with its own low-noise LDO for the 1.6 V core to avoid digital switching noise coupling into the audio path.
推荐
Mini/Micro Stereo System
Compact stereo systems need to add virtual-surround processing to two physical speakers while preserving stereo imaging. The DSPC56371AF150's Pro Logic IIx and DTS Neo:6 up-mixers run on the 150 MIPS core, producing a wide soundstage from stereo sources. The Host Interface accepts compressed audio from the system's main MCU, and the I2C port is used for EEPROM bootstrap of customer-specific tuning coefficients. The 80-LQFP (14x14) package fits in the small PCBs of micro-system mainboards and the 3.3 V I/O simplifies interface to low-cost Class-D amplifiers.
推荐
Soundbar Audio Processor
Premium soundbars use a dedicated DSP to drive multi-driver arrays with beam-forming, virtual-surround and bass-management algorithms. The DSPC56371AF150's combination of 150 MIPS throughput, integrated Dolby/DTS firmware, SAI multi-channel interface, and 80-LQFP package supports a 5.1 virtual-surround soundbar with up to 8 amplified channels. The on-chip ROM holds the licensing royalties-free for the OEM, which is a major BOM cost advantage versus a software-only implementation. Designers route the SAI clocks and frames to multiple Class-D amplifier ICs in parallel, with one master clock distributed from the DSP's PLL output.
推荐
推荐产品汇总
工程参考数据： DSPC56371AF150 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | DSPC56371AF180 | DSPB56371AF150 | DSPB56371AF180 | DSPC56371AE150 |
|---|---|---|---|---|---|
| Package | 80-LQFP (14x14) | 80-LQFP (14x14) - same | 80-LQFP (14x14) - same | 80-LQFP (14x14) - same | 80-LQFP (14x14) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock Speed | 150 MHz | 180 MHz | 150 MHz | 180 MHz | 150 MHz |
| MIPS | 150 MIPS | 180 MIPS | 150 MIPS | 180 MIPS | 150 MIPS |
| Data Word Size | 24-bit | 24-bit | 24-bit | 24-bit | 24-bit |
| On-Chip RAM | 264 kB | 264 kB | 264 kB | 264 kB | 264 kB |
| On-Chip ROM (Codec Firmware) | 384 kB | 384 kB | 384 kB | 384 kB | 384 kB |
| Silicon Revision | AF (C-version) | AF (C-version) | AF (C-version) | AF (C-version) | AE (older) |
| I/O Supply Voltage | 3.30 V | 3.30 V | 3.30 V | 3.30 V | 3.30 V |
关键差异点
- Faster 180 MHz core speed grade in same package （对比 DSPC56371AF180)
- Pb-free tape-and-reel packaging for high-volume assembly （对比 DSPB56371AF150)
- C-revision silicon with full 384 kB codec ROM （对比 DSPC56371AE150)
设计说明
Estimated: at 150 MHz with 1.6 V core and typical 80 mA core current, core power dissipation is approximately 1.6 V * 0.080 A = 128 mW. Add the 3.3 V I/O draw (typical 30 mA) for another ~100 mW, so total board dissipation is around 230 mW. Use a low-noise LDO such as LM1117-1.6 (or equivalent) for the core rail; do NOT share the core LDO with digital switching circuitry. Decouple each supply pin with a 100 nF X7R ceramic plus a 10 uF bulk capacitor placed within 5 mm of the package.
The SAI (serial audio interface) clocks and frames are LVTTL-level signals that drive downstream DACs and ADCs. Route them on the top layer with a continuous ground reference underneath, length-match clock-to-data within 25 mm, and place a 33 ohm series-termination resistor at the DSP end if the trace exceeds 50 mm. Keep the PLL reference crystal within 5 mm of the XTAL pins and surround it with a ground guard ring; long XTAL traces will inject jitter into the 150 MHz core clock and degrade audio THD+N.
Estimated: total power dissipation of approximately 230 mW (see power note) at 85 C ambient with theta_JA of approximately 50 C/W for the 80-LQFP package gives a junction temperature rise of about 11.5 C, leaving comfortable headroom under the 125 C Tj limit. For automotive under-hood applications with 105 C ambient, prefer the DSPC56371AF180 only if system airflow is provided; otherwise add a small copper heatsink pad under the exposed lead frame of the LQFP.
Do NOT confuse the DSPC56371AF150 (C-revision, 384 kB ROM) with the older DSPC56371AE150 (AE-revision, smaller ROM and different peripheral mapping). The two are NOT pin-for-pin equivalent despite sharing the 80-LQFP footprint. Also, do not load a DSP56374 firmware image onto the DSP56371 - the on-chip codec libraries are mask-programmed and only the matching silicon revision will decode correctly. Always reference the manufacturer's errata document before locking the schematic.
合规信息
Compliance status not present in the verified web data. AF100 / AF150 part numbers in NXP/Freescale nomenclature typically denote non-AEC-Q100 industrial-grade silicon; the -Q1 suffix is required for AEC-Q100 automotive qualification. Pb-free and RoHS status should be confirmed from the manufacturer product page or distributor lot documentation before use in consumer/automotive end products.
