DSPIC33CK128MP503T-I/M5 - 100MHz 16-bit DSC 128KB Flash | Microchip
料号： DSPIC33CK128MP503T-I/M5 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $3.35 | $3.35 |
| 10 | $3.02 | $30.20 |
| 100 | $2.65 | $265.00 |
| 500 | $2.3 | $1,150.00 |
| 1,000 | $2.04 | $2,040.00 |
DSPIC33CK128MP503T-I/M5 概述
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and deterministic behavior of a microcontroller. Within the power-management hierarchy of embedded processors, the dsPIC33CK sits above general-purpose MCUs for control-loop tasks and below application processors, targeting closed-loop systems where fast, mathematically intensive feedback is required.
Key features include a 16-bit pipelined core with DSP engine running at 100 MHz, three integrated operational amplifiers, three analog comparators, CAN-FD connectivity, and a Programmable Switching Regulator (PTG) hardware sequencer. DigiKey also lists the part as Functional Safety (FuSa) supported, simplifying ISO 26262 and IEC 61508 design workflows.
The dsPIC33CK architecture pairs the 16-bit CPU with a 24-bit instruction word, hardware multiply-accumulate, and single-cycle MAC operations, which shortens control-loop execution for current shaping and power-conversion algorithms. High-resolution PWM peripherals support fine duty-cycle resolution essential for digitally controlled power supplies.
Typical applications include digital power supplies, motor control (BLDC, PMSM, ACIM), advanced sensing and control, and industrial CAN-FD networking nodes. The three on-chip op-amps reduce external component count in current-sense front ends for motor inverters.
Design consideration: the M5 UQFN package has an exposed thermal pad that must be soldered to a grounded copper pour for both heat dissipation and signal-integrity; follow Microchip layout guidance for decoupling each VDD pin.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： DSPIC33CK128MP503T-I/M5 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： DSPIC33CK128MP503T-I/M5 （相同外形与封装尺寸） ——差异在于 Package, Core, Program Memory Size, RAM Size, Supply Voltage Range.
快速对比工具——选择替代料号进行并排对比：
DSPIC33CK128MP503T-E/M5
✅ 直接替换📋 参考替代料（不在目录中）
DSPIC33CK128MP503T-H/M5
✅ 直接替换📋 参考替代料（不在目录中）
DSPIC33CK128MP503-I/M5
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33CK64MP503-I/M5
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2.12 / 个
查看数据手册 →DSPIC33CK128MC503T-I/M5
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3 / 个
查看数据手册 →DSPIC33CK128MP503T-I/M5 最大额定值与电气特性
| Core | dsPIC33CK 16-bit DSC core with DSP engine |
| 最大时钟频率 | 100 MHz |
| Program Memory Size | 128KB (128K x 8) Flash |
| RAM Size | 16KB |
| 电源电压 | 3.3 V |
| 封装 | 36-UQFN (5x5 mm), exposed pad (M5) |
| 引脚数 | 36 |
| On-chip Operational Amplifiers | 3 |
| Analog Comparators | 3 |
| CAN | CAN-FD |
| Special Peripherals | PTG (Programmable Time Generator / hardware sequencer) |
| Functional Safety Support | Yes (FuSa package per DigiKey listing) |
| 工作温度范围 | -40C to +85C (I grade) |
| 安装类型 | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| Product Family | dsPIC33CK (digital power, motor control, advanced sensing) |
| RoHS 状态 | Compliant |
DSPIC33CK128MP503T-I/M5 36-uqfn (5x5 mm), exposed pad (m5) 引脚配置指南
DSPIC33CK128MP503T-I/M5（36-uqfn (5x5 mm), exposed pad (m5) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： DSPIC33CK128MP503T-I/M5.
请参阅 数据手册 以查看完整引脚配置。
典型应用
DSPIC33CK128MP503T-I/M5 适用于 6 应用s: Digital Power Supplies, Brushless Motor Control, CAN-FD Industrial Networking Nodes, Advanced Sensing and Control, USB-PD and Wireless Charging Power Stages, Test and Measurement Instrumentation.
Digital Power Supplies
The DSPIC33CK128MP503T-I/M5 is purpose-built for digitally controlled power converters such as LLC resonant, buck, boost, and totem-pole PFC stages. Its 100 MHz DSP-accelerated core closes current and voltage loops fast enough for switching frequencies in the several-hundred-kHz range, while three on-chip comparators provide cycle-by-cycle overcurrent protection with no CPU latency. The three integrated op-amps amplify shunt-current signals directly on-chip, cutting BOM cost and board area versus external amplifiers. In a typical design the DSC sits between the feedback dividers and the power stage gate drivers, running PI or predictive control firmware. Unlike analog controllers, firmware enables soft-start profiles, adaptive dead-time, and CAN-FD telemetry in telecom rectifiers and server PSUs.
推荐
Brushless Motor Control
For BLDC, PMSM, and ACIM motor drives, the DSPIC33CK128MP503T-I/M5 combines field-oriented-control (FOC) execution throughput with an analog front end tailored to current sensing. The 100 MHz core with hardware MAC accelerates the Clarke/Park transforms and PI current loops, while the three op-amps condition low-side or in-line shunt signals and the three comparators gate PWM outputs on overcurrent events within one switching cycle. High-resolution PWM peripherals generate center-aligned six-channel drive with adjustable dead time. In a typical FOC inverter the DSC reads shunt amplifiers through its ADC, executes the control loop each PWM period, and handles CAN-FD commands for industrial automation or e-mobility auxiliary drives, all within the 5x5 mm UQFN footprint.
推荐
CAN-FD Industrial Networking Nodes
The integrated CAN-FD controller of the DSPIC33CK128MP503T-I/M5 makes it a compact networking node for industrial automation, building control, and vehicle auxiliary systems. CAN-FD raises payload capacity to 64 bytes per frame and supports faster data phases than classical CAN, which the 100 MHz core can service without dropping control-loop deadlines. Combined with the PTG hardware sequencer that automates timed peripheral actions independently of software, the device sustains deterministic behavior in multi-node networks. Typical deployments pair the DSC with an external CAN-FD transceiver on the 36-pin UQFN board, using the on-chip comparators and op-amps for local sensing while firmware handles protocol stacks, diagnostics, and OTA parameter updates across the network.
推荐
Advanced Sensing and Control
Sensor aggregation and closed-loop control tasks benefit directly from the analog integration of the DSPIC33CK128MP503T-I/M5. The three op-amps can be used as programmable-gain front ends for bridge, thermocouple, or current-shunt signals, and the three comparators create threshold alarms in hardware, offloading the CPU. The 100 MHz 16-bit core with DSP instructions filters and decimates sampled data quickly enough for vibration, pressure, and power-quality monitoring loops. Because the entire signal chain - amplification, comparison, conversion, and control - lives inside one 5x5 mm UQFN package, designers shrink sensing PCB area for compact industrial instruments. Functional Safety (FuSa) package support from Microchip further assists developers building certified monitoring equipment.
推荐
USB-PD and Wireless Charging Power Stages
Compact power-conversion accessories such as USB-PD adapters and Qi wireless chargers demand fast digital loops in minimal board area - exactly the profile of the DSPIC33CK128MP503T-I/M5. The 100 MHz core executes the control law for quasi-resonant or active-clamp flyback topologies, while the on-chip op-amps read primary current and the comparators provide sub-cycle protection against short-circuit and overload conditions. The PTG hardware sequencer automates startup and burst-mode timing without CPU intervention, improving light-load efficiency. The 36-pin UQFN 5x5 mm footprint fits tight adapter housings, and tape-and-reel packaging supports high-volume automated assembly. Firmware-based control also allows a single hardware platform to cover multiple power ratings and regional standards.
推荐
Test and Measurement Instrumentation
Bench and embedded instruments - electronic loads, programmable supplies, sensor calibrators - leverage the DSPIC33CK128MP503T-I/M5 for real-time feedback and communication. The 100 MHz DSP core implements averaging, RMS computation, and control-loop regulation with deterministic timing, while 128KB Flash accommodates protocol stacks, calibration tables, and command interpreters alongside the control firmware. The three op-amps buffer measurement inputs and the comparators generate hardware limits that protect the device under test faster than software could react. CAN-FD or UART links report readings to a host controller. Functional Safety documentation support and the industrial -40C to +85C rating allow deployment in factory-floor test stations with wide ambient swings.
推荐
推荐产品汇总
工程参考数据： DSPIC33CK128MP503T-I/M5 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | DSPIC33CK128MP503T-E/M5 | DSPIC33CK128MP503T-H/M5 | DSPIC33CK64MP503-I/M5 | DSPIC33CK128MC503T-I/M5 |
|---|---|---|---|---|---|
| Package | 36-UQFN (5x5 mm) M5 | 36-UQFN (5x5 mm) M5 - same | 36-UQFN (5x5 mm) M5 - same | 36-UQFN (5x5 mm) M5 - same | 36-UQFN (5x5 mm) M5 - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Max Clock Frequency | 100 MHz | 100 MHz | 64 MHz | 100 MHz | 100 MHz |
| Flash Memory | 128KB | 128KB | 128KB | 64KB | 128KB |
| RAM | 16KB | 16KB | 16KB | 16KB | 16KB |
| Operating Temperature | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (H) | -40C to +85C (I) | -40C to +85C (I) |
| Packaging | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) | Tray/Tube (non-T) | Tape & Reel (T) |
关键差异点
- Full 100 MHz execution speed （对比 DSPIC33CK128MP503T-H/M5)
- Extended-temperature pin-compatible upgrade path （对比 DSPIC33CK128MP503T-E/M5)
- Three integrated op-amps for sensorless current sensing （对比 DSPIC33CK128MC503T-I/M5)
设计说明
The M5 36-UQFN package includes an exposed thermal pad that must be connected to ground through an array of vias to the ground plane. This pad is not only the primary heat-removal path but also the return reference that keeps ADC noise low; skipping it degrades analog accuracy and thermal margin simultaneously. Use a solder-mask-defined opening per Microchip's UQFN landing-pattern recommendation and print sufficient paste to avoid voiding under the pad during reflow.
Decouple every VDD pin pair with 100 nF ceramic capacitors placed within 2 mm of the pin, plus at least one bulk 10 uF capacitor near the device. Separate AVDD from digital VDD with an RC or ferrite filter so the on-chip op-amps, comparators, and ADC see a quiet rail; noise on AVDD directly shifts conversion results. Verify VCAP stability - the internal regulator capacitor must be a low-ESR type of the value specified in the datasheet for reliable core operation.
Confirm the temperature grade suffix before assembly: -I/M5 parts are rated -40C to +85C, while -E and -H grades extend to +125C. Designs sealed in enclosures with power stages can exceed 85C ambient even when room temperature is modest; if in doubt, select the -E grade, which is pin-compatible. Also reserve the PGEC/PGED programming pins with test points or a Tag-Connect footprint so field firmware updates remain possible on the assembled 36-UQFN board.
合规信息
RoHS compliance and lead-free status per distributor listings (DigiKey/LCSC). REACH, halogen-free, and conflict-minerals declarations should be requested from Microchip via certificate of conformance.
