DSPIC33EP128GM710-H/BG - 70MIPS 128KB DSC TFBGA-121 | Microchip
料号： DSPIC33EP128GM710-H/BG ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1 | $1.00 |
| 10 | $1 | $10.00 |
| 100 | $1 | $100.00 |
| 500 | $1 | $500.00 |
| 1,000 | $1 | $1,000.00 |
DSPIC33EP128GM710-H/BG 概述
A digital signal controller combines the compute architecture of a microcontroller with the arithmetic acceleration of a DSP. In the semiconductor hierarchy, a DSC sits between a general-purpose MCU and a dedicated DSP: it executes deterministic real-time control loops like an MCU while performing high-speed multiply-accumulate operations for filtering, transforms and control algorithms. The dsPIC33EP family implements a modified Harvard architecture with a 16-bit datapath and 24-bit instruction words.
Key features of this part include the 70 MIPS dsPIC DSC core with DSP engine, dual on-chip operational amplifiers, a CAN 2.0B module for automotive and industrial networking, multiple UART, SPI and I2C peripherals, quadrature encoder interface (QEI) inputs and motor-control PWM peripherals. Data from distributor listings confirms 12 motor-control channels, 8 input capture and 8 output compare channels, suiting closed-loop motor and power-conversion designs.
Technically, the device operates from a single 3.3V supply and is offered in automotive-grade, AEC-Q100-qualified variants. The GM710 variant provides 128 KB Flash; pin-compatible family members extend or reduce memory to fit firmware growth or cost targets within the same 121-TFBGA footprint.
Typical applications include precision motor control (BLDC, PMSM, stepper), automotive body and powertrain auxiliary nodes, digital power supplies, industrial automation and sensor signal processing where the integrated op-amps condition signals before the ADC.
Design consideration: the TFBGA package requires careful BGA land-pattern design and X-ray-capable inspection in production; the -H temperature variant should be verified against your thermal environment since the -I variant covers a wider range.
This page synthesizes distributor availability data, drop-in family alternatives and practical design notes beyond the manufacturer datasheet.
直接替换替代料： DSPIC33EP128GM710-H/BG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： DSPIC33EP128GM710-H/BG （相同外形与封装尺寸） ——差异在于 Core, On-chip Op-Amps, Supply Voltage, Operating Temperature, Qualification.
快速对比工具——选择替代料号进行并排对比：
DSPIC33EP128GM710-I/BG
✅ 直接替换📋 参考替代料（不在目录中）
DSPIC33EP128GM710-E/BG
✅ 直接替换✓ 有现货
$5.71 / 个
查看数据手册 →DSPIC33EP256GM710-H/BG
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33EP64GM710-H/BG
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33EP256GM710-E/BG
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33EP128GM710-H/BG 最大额定值与电气特性
| Core | dsPIC 33EP 16-bit DSC |
| Max CPU Speed | 70 MIPS |
| Program Memory (Flash) | 128 KB (43K x 24) |
| RAM | 16 KB |
| 电源电压 | 3.3 V |
| 封装 | 121-TFBGA (10x10 mm) |
| 安装类型 | Surface Mount |
| CAN Module | Yes (CAN 2.0B) |
| On-chip Op-Amps | 2 |
| Motor Control Channels | 12 |
| Input Capture / Output Compare | 8 / 8 |
| QEI (Quadrature Encoder Interface) | Yes (4 units per distributor listing) |
| Qualification | Automotive, AEC-Q100 (family) |
| Packaging | Tray |
DSPIC33EP128GM710-H/BG 121-tfbga (10x10 mm) 引脚配置指南
DSPIC33EP128GM710-H/BG（121-tfbga (10x10 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： DSPIC33EP128GM710-H/BG.
请参阅 数据手册 以查看完整引脚配置。
典型应用
DSPIC33EP128GM710-H/BG 适用于 6 应用s: Precision Motor Control, Automotive Auxiliary ECUs, Digital Power Conversion, Industrial Automation and Sensing, Embedded Audio and Signal Processing, Robotics and Servo Drives.
Precision Motor Control
The DSPIC33EP128GM710-H/BG fits precision motor control because its 70 MIPS DSP core executes field-oriented control (FOC) loops with multiply-accumulate throughput, while 12 motor-control PWM channels, 8 input captures and 4 quadrature encoder interfaces provide the sensing and actuation fabric needed for BLDC, PMSM and stepper drives. The dual on-chip operational amplifiers condition shunt-resistor current feedback before the ADC, reducing external component count. In use, the DSC runs the current loop at PWM frequency with deterministic interrupt latency, and the CAN 2.0B module links the drive to a higher-level controller. The trade-off versus a dedicated motor-control ASIC is flexibility: control parameters, protection schemes and communication protocols are all firmware-defined.
推荐
Automotive Auxiliary ECUs
The dsPIC33EP GM710 family carries automotive AEC-Q100 qualification and integrates a CAN 2.0B controller with up to 2 KB of DMA-buffered message handling, making the DSPIC33EP128GM710-H/BG suitable for automotive body electronics, pump/fan control and auxiliary ECU nodes that must communicate on a vehicle CAN bus. Its 128 KB Flash holds firmware plus a CAN stack and diagnostic (UDS/OBD-style) layers with headroom, and the 16 KB RAM supports buffered communication and control state. The 3.3V single-supply operation simplifies integration with vehicle low-voltage regulators with appropriate transient protection. Designers should verify the exact ordering-code temperature grade required for the mounting location, choosing the -E variant for underhood environments.
推荐
Digital Power Conversion
In digital power supplies, PFC stages and DC-DC converters, the DSPIC33EP128GM710-H/BG provides the fast control-loop execution (70 MIPS) and high-resolution PWM generation that digital power demands. The 8 output-compare and 12 motor-control channels can be configured for complementary PWM pairs with dead-time control, while input captures timestamp feedback events. The dual op-amps can amplify current-sense signals on-chip before ADC conversion, tightening control-loop accuracy. Because the control law is firmware-based, engineers can implement nonlinear compensation, soft-start, burst mode and fault management without analog redesign. The 121-TFBGA layout allows short high-frequency PWM traces to gate drivers, improving signal integrity versus larger pinout packages.
推荐
Industrial Automation and Sensing
Factory automation nodes benefit from the DSPIC33EP128GM710-H/BG's combination of DSP math throughput and rich serial connectivity: multiple UART, SPI and I2C peripherals interface with drives, sensors, displays and industrial transceivers, while the DSP engine runs FFT- or filter-based condition-monitoring algorithms on vibration and current signatures. Quadrature encoder interfaces decode position feedback from incremental encoders, and the CAN module bridges to factory fieldbus gateways. With 128 KB Flash, one firmware image can integrate sensing, local control and communication. The 3.3V I/O eases interfacing with modern 3.3V logic and isolated transceivers. The 121-ball BGA format keeps board area small for dense I/O modules and compact sensor heads.
推荐
Embedded Audio and Signal Processing
The 70 MIPS DSP core with single-cycle MAC, DSP instruction set and bit-reversed addressing makes the DSPIC33EP128GM710-H/BG capable of real-time audio filtering, tone generation and acoustic signal analysis in cost-sensitive embedded products. The dual on-chip op-amps can act as input biasing or output buffering stages for small analog front ends, feeding the ADCs for processing. With 16 KB of RAM, moderate-length FIR/IIR filters and buffers fit on-chip, and 128 KB Flash stores coefficient tables and a communication stack for host interfacing over UART or SPI. Typical uses include intercoms, alarm sounders, adaptive lighting feedback and sensor-conditioning front ends where a full audio DSP would be excessive.
推荐
Robotics and Servo Drives
Robot joint and servo drive controllers exploit the DSPIC33EP128GM710-H/BG's four quadrature encoder interfaces (per distributor data: QEI4) and 12 motor-control channels, allowing multiple-axis coordination on a single DSC or tightly coupled multi-DSC designs over the CAN 2.0B bus. The 70 MIPS core closes position, velocity and current loops per axis with headroom for trajectory interpolation and profile generation. The dual op-amps support per-phase current sensing, and input captures decode hall-sensor or ultrasonic ranging events. Firmware-based control lets designers tailor compliance, backlash compensation and fault recovery per joint. The compact 10x10 mm TFBGA suits the constrained PCB area typical of robot actuator housings and joint modules.
推荐
推荐产品汇总
工程参考数据： DSPIC33EP128GM710-H/BG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | DSPIC33EP128GM710-I/BG | DSPIC33EP128GM710-E/BG | DSPIC33EP256GM710-H/BG | DSPIC33EP64GM710-H/BG |
|---|---|---|---|---|---|
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 128 KB (43K x 24) | 128 KB | 128 KB | 256 KB | 64 KB |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Temperature Grade | -H (reduced range) | -40C to +85C | -40C to +125C | -H (reduced range) | -H (reduced range) |
| CAN Module | CAN 2.0B | CAN 2.0B | CAN 2.0B | CAN 2.0B | CAN 2.0B |
| On-chip Op-Amps | 2 | 2 | 2 | 2 | 2 |
关键差异点
- Integrated dual on-chip op-amps ahead of the ADC （对比 DSPIC33CK64MC105T-I/M4)
- CAN 2.0B controller integrated （对比 DSPIC33EP64GM710-H/BG)
- Trade-off: reduced -H temperature grade （对比 DSPIC33EP128GM710-I/BG)
设计说明
The 121-ball TFBGA (10x10 mm) requires a controlled BGA land pattern with via-in-pad or dog-bone fanout; microvias filled and capped are recommended for the inner ball rows. Plan power/ground balls for solid via stitching to internal planes, and verify the vendor's assembly capability for 0.8 mm-pitch BGA reflow and X-ray inspection. Estimated: with a 10x10 mm body, a 4-layer minimum stack-up is strongly advised to fan out 121 balls while retaining plane integrity for the 3.3V rail.
Decouple each VDD/VDDCORE ball pair with 100 nF ceramics placed as close as possible to the ball, plus bulk capacitance near the package; follow the Microchip dsPIC33EP hardware design guidelines for the on-chip regulator external capacitor on VDDCORE, which must not be omitted or the core will not start reliably. Estimated: allow roughly 10 uF bulk per supply domain in addition to per-ball 100 nF decoupling. Verify VDDCORE capacitor value and ESR requirements against the family datasheet electrical characteristics section.
Confirm the -H temperature grade against your worst-case ambient and self-heating before committing; in a sealed motor-drive enclosure the -I (-40C to +85C) or -E (-40C to +125C) variants of the same die are safer and pin-identical. Also, secondary programming-tool chain: the dsPIC33EP requires MPLAB X with PICkit 3/4 or ICD 3/4-class programmers; legacy dsPIC30F tools do not program this family. Finally, do not exceed the CAN bus electrical spec - the internal module needs an external transceiver (e.g., MCP2551-class).
合规信息
Distributor listings (Hotenda, Jotrin) describe the part as Automotive, AEC-Q100 for the dsPIC33EP GM710 family. RoHS/REACH/lead-free status for this exact -H/BG ordering code was not stated in the provided data.
