DSPIC33EP128GM310-E/BG - 16-bit 60 MIPS DSC 128KB Flash | Microchip
料号： DSPIC33EP128GM310-E/BG ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $6.98 | $6.98 |
| 10 | $6.28 | $62.80 |
| 100 | $5.62 | $562.00 |
| 500 | $5.06 | $2,530.00 |
| 1,000 | $4.55 | $4,550.00 |
DSPIC33EP128GM310-E/BG 概述
A digital signal controller combines the compute architecture of a microcontroller with the DSP capability of a digital signal processor. In the system hierarchy, a DSC sits above general-purpose MCUs within the power management and motor control semiconductor domain: it is a Harvard-architecture processor that executes both MCU control code and math-intensive DSP algorithms such as transforms, filters, and field-oriented control loops on a single die. Microchip's dsPIC33E family is a widely deployed 16-bit DSC platform for precision embedded control.
Key features of the GM310 variant include 12 motor-control PWM channels, 8 input capture and 8 output compare peripherals, 4 quadrature encoder interface modules, and 4 integrated operational amplifiers for direct current-sense signal conditioning. Four DMA channels offload data movement, and a barrel shifter accelerates bit manipulation. The -E temperature grade supports full industrial operation to +125C junction, and the 121-TFBGA footprint maximizes I/O density in a 10x10 mm outline.
Architecturally, the dsPIC33E core executes an enhanced Harvard instruction set with DSP multiply-accumulate, modulo and bit-reversed addressing, plus boundary-scan (JTAG) debug capability. Operation from a single 3.3V supply simplifies power design, and the on-chip op amps reduce external component count in current-sense paths for FOC and sensorless motor drives.
Typical applications include precision motor control (BLDC, PMSM, stepper) for industrial drives and robotics, digital power supplies and inverters, and embedded sensing systems that benefit from the analog front-end integration and DSP engine.
Design consideration: at 60 MIPS the device typically requires a favorable clock configuration; verify Flash wait-state settings and 3.3V supply decoupling on all power balls, and plan BGA rework capability given the 0.8 mm-class ball pitch.
This page synthesizes distributor pricing context, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： DSPIC33EP128GM310-E/BG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： DSPIC33EP128GM310-E/BG （相同外形与封装尺寸） ——差异在于 Core, Input Capture / Output Compare, Operating Temperature, Quadrature Encoder Interfaces, Supply Voltage.
快速对比工具——选择替代料号进行并排对比：
DSPIC33EP256GM310-E/BG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$6.05 / 个
查看数据手册 →DSPIC33EP64GM310-E/BG
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33EP128GM710-E/BG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$5.71 / 个
查看数据手册 →DSPIC33EP128GM310-E/BG 最大额定值与电气特性
| Core | dsPIC33E 16-bit DSC |
| CPU Speed | 60 MIPS |
| Program Memory | 128KB (43K x 24) Flash |
| RAM | 16KB |
| 电源电压 | 3.3 V |
| 工作温度 | -40C to +125C (E grade) |
| 封装 | 121-TFBGA (10x10 mm) |
| Motor Control PWM Channels | 12 MC |
| Input Capture / Output Compare | 8 / 8 |
| Quadrature Encoder Interfaces | 2 QEI |
| Operational Amplifiers | 4 on-chip op amps |
| DMA Channels | 4 |
| Barrel Shifter | Yes |
| Boundary Scan / JTAG | Yes |
| Architecture | Harvard, CMOS |
| Packaging | Tray |
| RoHS 状态 | Compliant |
| Target Market | Automotive-suitable per distributor listing |
DSPIC33EP128GM310-E/BG 121-tfbga (10x10 mm) 引脚配置指南
DSPIC33EP128GM310-E/BG（121-tfbga (10x10 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： DSPIC33EP128GM310-E/BG.
请参阅 数据手册 以查看完整引脚配置。
典型应用
DSPIC33EP128GM310-E/BG 适用于 6 应用s: Precision BLDC/PMSM Motor Control, Digital Power Supplies and Inverters, Industrial Automation and Robotics, Automotive-Adjacent Industrial Systems, Embedded Sensing and Signal Processing, Compact High-Density Controller Boards.
Precision BLDC/PMSM Motor Control
The DSPIC33EP128GM310-E/BG fits field-oriented control (FOC) drives because its 12 motor-control PWM channels generate complementary, dead-time-managed gate signals while the 60 MIPS DSP core executes current-loop mathematics with multiply-accumulate instructions. The 4 on-chip operational amplifiers condition low-side shunt currents without external op amps, and the 2 quadrature encoder interfaces resolve rotor position from incremental encoders. In a typical topology the device reads phase currents through the integrated op amps, runs Clarke/Park transforms at PWM rate, and updates the PWM duty cycle each cycle. Deterministic DMA transfer of ADC results preserves loop timing; the trade-off versus a discrete solution is lower analog flexibility but far fewer components and a tightly coupled, jitter-free control path.
推荐
Digital Power Supplies and Inverters
Switching power converters such as LLC resonant supplies, solar micro-inverters, and PFC stages benefit from the DSPIC33EP128GM310-E/BG's combination of 60 MIPS control throughput and 12 high-resolution PWM channels capable of phase-shifted and complementary drive. The on-chip op amps amplify current-transformer or shunt signals for cycle-by-cycle protection, and the 4 DMA channels stream ADC samples without disturbing the compensation-loop interrupt. Firmware implements voltage-mode or current-mode compensation digitally, enabling adaptive dead-time and nonlinear control impossible with analog controllers. The 3.3V single-supply operation simplifies bias rail design. Engineers should budget Flash headroom - the 128KB program space accommodates full state machines plus diagnostics, with the 256KB drop-in variant available when telemetry grows.
推荐
Industrial Automation and Robotics
In robotics controllers and factory automation nodes, the DSPIC33EP128GM310-E/BG serves as the real-time motion and communication controller. Its 16KB RAM buffers multi-axis trajectories, the barrel shifter accelerates protocol bit manipulation, and boundary-scan/JTAG support eases in-system debug on dense BGA boards. The 121-ball 10x10 mm TFBGA packs the extensive I/O needed for encoders, limit switches, and drive interfaces into a small footprint, while the -40C to +125C E-grade rating survives panel and cabinet environments. Multi-QEI support tracks two motor axes simultaneously, and the DSP engine runs vibration or acoustic-condition-monitoring filters on the same die. Design consideration: plan BGA rework capability, as field replacement requires skilled reflow.
推荐
Automotive-Adjacent Industrial Systems
Distributor listings classify the DSPIC33EP128GM310-E/BG within an automotive-suitable category, and its -40C to +125C rating suits under-hood-adjacent industrial equipment: electric power steering test rigs, pump controllers, HVAC blowers, and battery-management supervisory units. The 12 PWM channels drive three-phase bridges, the quadrature encoder inputs handle rotor feedback, and the integrated op amps condition battery current shunts. The 3.3V supply and 60 MIPS core execute diagnostic state machines alongside control loops, supporting ISO-style functional monitoring in industrial implementations. Note this commercial-grade listing is not a substitute for the AEC-Q100-qualified variants - automotive production programs should verify the appropriate qualification grade with Microchip before design-in.
推荐
Embedded Sensing and Signal Processing
Sensor front-ends for vibration, acoustic, and power-quality monitoring exploit the DSP multiply-accumulate engine and modulo addressing of the DSPIC33EP128GM310-E/BG to run FIR/IIR filters and FFT routines directly on the captured data. The four on-chip op amps provide programmable-gain first-stage amplification of transducer outputs, and 4 DMA channels move ADC results to 16KB RAM continuously without CPU intervention. With 128KB Flash, full signal-processing libraries coexist with communication stacks in a single chip. The 60 MIPS throughput supports kHz-band spectral analysis in a 3.3V, -40C to +125C envelope appropriate to industrial monitoring equipment. A practical benefit: integrating amplification, processing, and I/O on one die reduces board area and analog noise pickup.
推荐
Compact High-Density Controller Boards
When board area is the binding constraint, the 121-ball TFBGA 10x10 mm package of the DSPIC33EP128GM310-E/BG delivers the GM3 peripheral set in the smallest available footprint for the family. Stacked PCB designs - controller boards, motion cards, and instrument modules - use the BGA to place the DSC beneath or beside other ICs, maximizing routing density with HDI microvia stackups. The 8 input-capture and 8 output-compare channels provide abundant timing I/O for multi-channel instrumentation without external timer logic. Trade-off: BGA inspection needs X-ray or boundary-scan methods, and the JTAG/boundary-scan capability on this device becomes the practical production-test interface. Verify the family datasheet ball-map and mandatory connections before committing to a first-spin layout.
推荐
推荐产品汇总
工程参考数据： DSPIC33EP128GM310-E/BG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | DSPIC33EP256GM310-E/BG | DSPIC33EP64GM310-E/BG | DSPIC33EP128GM710-E/BG |
|---|---|---|---|---|
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 128KB (43K x 24) | 256KB | 64KB | 128KB |
| RAM | 16KB | 16KB | 16KB | 16KB |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Drop-in Pin Compatibility | Reference | Yes - identical ball map | Yes - identical ball map | Yes - same footprint, verify peripheral map |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
关键差异点
- Integrated analog front-end （对比 DSPIC33EP256GM310-E/BG)
- Highest I/O density in the GM3 family （对比 DSPIC33EP128GM306-E/PT)
- Upgrade headroom without respin （对比 DSPIC33EP256GM310-E/BG)
设计说明
For the 121-TFBGA 10x10 mm BGA, use the Microchip dsPIC33EPXXXGM3XX/6XX/7XX family datasheet (document 70000689) pin connection section for mandatory connections: all VDD/VSS pairs, VCAP connection, AVDD/AVSS for the analog domain, and MCLR. Each power/ground ball pair should be locally decoupled with 100 nF ceramic capacitors placed on the opposite board side directly beneath the balls. The -E grade at +125C junction increases leakage and reduces timing margin; derate maximum frequency accordingly if operating continuously near the thermal limit.
Estimated: a 3.3V DSC at 60 MIPS typically dissipates roughly 100-200 mW depending on peripheral activity and clock configuration; with a TFBGA theta-JA around 30-40 C/W on a standard 4-layer board (typical BGA figures - confirm in the datasheet thermal section), junction rise stays well under 10C, leaving ample margin to the +125C limit in a +85C ambient. The dominant thermal risk is not the DSC itself but adjacent power stages; keep gate drivers and MOSFETs thermally separated and use copper pours on inner layers as heat spreaders beneath the BGA region.
BGA rework capability is the most common program risk with the /BG package: field repairs require controlled reflow and X-ray inspection, so consider the DSPIC33EP128GM306-E/PT TQFP variant for prototypes if rework access matters. Second, do not assume software portability equals drop-in: the DSPIC33EP128GM306-E/PT shares the core and peripherals but a different pin count/footprint, so firmware must be re-mapped to the new pin assignments. Finally, verify Flash programming voltage and configuration-bit settings (watchdog, oscillator selection) before first production build.
合规信息
RoHS compliant per Master Electronics listing (RoHS Compliant). Distributor listings categorize the part in an automotive-suitable category; AEC-Q100 qualification is not confirmed in the provided data.
