DSPIC33EP256GP504T-E/ML - 16-bit 60MIPS 256KB DSC | Microchip
料号： DSPIC33EP256GP504T-E/ML ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $8.95 | $8.95 |
| 10 | $8.05 | $80.50 |
| 100 | $7.15 | $715.00 |
| 500 | $6.4 | $3,200.00 |
| 1,000 | $5.75 | $5,750.00 |
DSPIC33EP256GP504T-E/ML 概述
A digital signal controller is a hybrid device that combines the computational throughput of a digital signal processor with the peripheral integration and ease of use of a microcontroller. Within the power-management hierarchy of embedded systems, the DSC sits above general-purpose MCUs for math-intensive control loops, and the dsPIC33EP family is Microchip's general-purpose 16-bit DSC series for high-performance embedded control.
Key features include 60 MIPS core performance for deterministic control, 256KB self-programming FLASH, an enhanced CAN 2.0B module for automotive and industrial networking, three on-chip operational amplifiers, four comparators, a Charge Time Measurement Unit (CTMU), and a Peripheral Trigger Generator (PTG) for autonomous peripheral sequencing.
The dsPIC33EP core uses a modified Harvard architecture with a 24-bit instruction word and DSP engine supporting single-cycle MAC operations. Four DMA channels offload data movement, while the multiple internal bus architecture keeps data and instruction fetches from stalling math loops. CMOS process technology delivers low active current for motor control and digital power workloads.
Typical applications include BLDC and PMSM motor control, automotive body and powertrain auxiliary modules (the -E grade is AEC-Q100 qualified), digital power supplies, and industrial sensor acquisition using the CTMU for capacitive or time-of-flight measurements.
Design consideration: the -E/ML grade is rated for extended ambient temperature operation; verify total power dissipation in the 8x8 QFN thermally enhanced pad layout, and route the CAN transceiver close to the CANTX/CANRX pins.
This page synthesizes distributor pricing, drop-in alternatives, pinout guidance, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： DSPIC33EP256GP504T-E/ML ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： DSPIC33EP256GP504T-E/ML （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, RAM, Core, Packaging.
快速对比工具——选择替代料号进行并排对比：
DSPIC33EP256GP504T-I/ML
✅ 直接替换✓ 有现货
$3.9 / 个
查看数据手册 →DSPIC33EP256GP504T-E/MV
✅ 直接替换📋 参考替代料（不在目录中）
DSPIC33EP256GP504-E/ML
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →DSPIC33EP256GM604-E/ML
✅ 直接替换✓ 有现货
$6.55 / 个
查看数据手册 →DSPIC33EP256GP504T-E/ML 最大额定值与电气特性
| Core Processor | dsPIC33EP (16-bit DSC core) |
| Core Size | 16-bit |
| Speed (MIPS) | 60 MIPS |
| Program Memory Size | 256KB (85.5K x 24) FLASH |
| RAM Size | 32KB (16K x 16) |
| Connectivity | CANbus, I2C, IrDA, LINbus, SPI, UART/USART |
| 封装 | 44-QFN (8x8 mm) |
| 安装类型 | Surface Mount |
| Supply Voltage Range | 3V to 3.6V |
| 工作温度 | -40C to +125C (E grade, AEC-Q100 qualified) |
| Qualification | AEC-Q100 (automotive grade) |
| Op Amps | 3 integrated operational amplifiers |
| Comparators | 4 |
| CTMU | Charge Time Measurement Unit included |
| PTG | Peripheral Trigger Generator included |
| DMA Channels | 4 |
| Technology | CMOS |
| Packaging | Tape & Reel (T suffix) |
DSPIC33EP256GP504T-E/ML 44-qfn (8x8 mm) 引脚配置指南
DSPIC33EP256GP504T-E/ML（44-qfn (8x8 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： DSPIC33EP256GP504T-E/ML.
请参阅 数据手册 以查看完整引脚配置。
典型应用
DSPIC33EP256GP504T-E/ML 适用于 6 应用s: Automotive Auxiliary Modules, BLDC and PMSM Motor Control, Digital Power Supplies, Industrial Sensing and CTMU Measurement, CAN-Based Industrial Networking Nodes, Portable and Battery-Powered Instrumentation.
Automotive Auxiliary Modules
The AEC-Q100 qualified -E/ML grade is purpose-built for automotive environments, tolerating -40C to +125C ambient under the automotive qualification standard. The dsPIC33EP core running at 60 MIPS handles deterministic control loops for window lift, HVAC flap actuators, pump control, and lighting modules, while the integrated CAN 2.0B module connects directly to in-vehicle networks through an external transceiver. LINbus and UART support sub-networks of smart actuators and sensors. The extended FLASH of 256KB leaves headroom for OEM-specific diagnostics stacks such as UDS-style bootloaders, and 32KB of RAM supports buffered message handling. Because the analog mix (3 op amps, 4 comparators, CTMU) is on-chip, BOM count stays low in cost-sensitive automotive body electronics.
推荐
BLDC and PMSM Motor Control
Motor control is a flagship dsPIC33EP use case: the 60 MIPS core executes single-cycle DSP MAC instructions for field-oriented control (FOC) current loops at multi-kHz rates. Four DMA channels stream ADC conversion results into RAM without CPU intervention, and the Peripheral Trigger Generator can sequence ADC sampling to PWM events autonomously, reducing loop jitter. The three integrated op amps condition low-side shunt current measurements, and the four comparators support hardware overcurrent trips without external amplifiers. The 44-QFN (8x8 mm) package exposes sufficient PWM-capable pins for three-phase bridges. With 256KB FLASH, sensorless observers and startup algorithms fit comfortably alongside the application code, making this part suitable for pumps, fans, traction auxiliaries, and industrial drives.
推荐
Digital Power Supplies
Switching power converters benefit directly from the DSPIC33EP256GP504T-E/ML architecture: the 60 MIPS core closes voltage- and current-mode compensation loops with deterministic latency, the PTG triggers ADC samples synchronized to PWM edges so mid-rail switching noise does not corrupt readings, and the four comparators implement cycle-by-cycle current limiting in hardware with microsecond response. The 256KB FLASH stores multiple converter profiles (CV/CC, constant power, soft-start ramps) and firmware-updatable via UART or CAN. On-chip op amps amplify shunt signals, removing external error amplifiers. The extended -E temperature grade suits power stages mounted near hot components such as PFC and LLC converters in industrial and telecom rectifier front ends.
推荐
Industrial Sensing and CTMU Measurement
The Charge Time Measurement Unit (CTMU) enables precise capacitive and time-of-flight measurements with sub-nanosecond charge-injection control, ideal for capacitive touch panels, liquid-level sensing, and proximity detection in industrial equipment. Combined with the 60 MIPS core, sampled data can be filtered (IIR/FIR using DSP MAC instructions) in real time while the CAN or UART links stream results to supervisory controllers. The three op amps and four comparators provide local analog conditioning for 4-20 mA receivers and threshold alarms. Housed in the robust 44-QFN (8x8 mm) package with the -40C to +125C E-grade rating, the device tolerates panel-mounted enclosures in factory automation, HVAC controllers, and process instrumentation exposed to wide thermal swings.
推荐
CAN-Based Industrial Networking Nodes
The enhanced CAN 2.0B module with up to 8 transmit/receive buffers makes this DSC a strong CANopen- and DeviceNet-style node controller in factory networks. At 60 MIPS it can service CAN message parsing, protocol stacks, and local control loops concurrently, while the PTG offloads repetitive peripheral triggering. LINbus and IrDA-capable UARTs bridge legacy sub-systems into the CAN backbone, and 256KB FLASH accommodates protocol stacks plus OTA-style firmware update bootloaders over CAN. The -E AEC-Q100 rating also suits mobile machinery and off-highway vehicle controllers that share automotive environmental demands. The 44-QFN (8x8 mm) footprint with 4 DMA channels keeps message buffering and sensor acquisition efficient without external glue logic.
推荐
Portable and Battery-Powered Instrumentation
Operating from a 3V to 3.6V supply, the DSPIC33EP256GP504T-E/ML runs directly from a single lithium-ion cell via a small LDO, and the CMOS process keeps active current low enough for handheld instruments. Sleep, idle, and doze modes trade 60 MIPS peak performance against microamp-level standby, letting designers duty-cycle acquisition bursts. The CTMU supports capacitive touch keys replacing mechanical buttons on waterproof instrument panels, while SPI/I2C connect displays, flash memory, and RF modules. The 44-QFN (8x8 mm) 0.5 mm-pitch package enables compact two-layer boards, and 256KB FLASH retains data logging, calibration tables, and GUI assets on-chip, removing external memory from the BOM of meters, portable analyzers, and field diagnostic tools.
推荐
推荐产品汇总
工程参考数据： DSPIC33EP256GP504T-E/ML ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | DSPIC33EP256GP504T-I/ML | DSPIC33EP256GP504T-E/MV | DSPIC33EP256GP504-E/ML | DSPIC33EP256GM604-E/ML |
|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (5x5 mm, MV) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Performance | 16-bit dsPIC33EP, 60 MIPS | 16-bit, 60 MIPS (DigiKey lists 70 MIPS max family speed) | 16-bit, 60 MHz | 16-bit, 60 MIPS | 16-bit, 60 MIPS |
| Program Memory | 256KB (85.5K x 24) FLASH | 256KB FLASH | 256KB FLASH | 256KB FLASH | 256KB FLASH |
| RAM | 32KB (16K x 16) | 32KB | 32KB | 32KB | 32KB |
| Temperature Grade | -40C to +125C (E, AEC-Q100) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +125C (E grade) |
| Automotive Qualification | AEC-Q100 qualified | No (industrial grade) | AEC-Q100 qualified | AEC-Q100 qualified | AEC-Q100 qualified |
关键差异点
- AEC-Q100 automotive qualification at extended temperature （对比 DSPIC33EP256GP504T-I/ML)
- Integrated analog signal chain (3 op amps + 4 comparators + CTMU) （对比 DSPIC33EP256GM604-E/ML)
- Same pin functions in a smaller footprint option （对比 DSPIC33EP256GP504T-E/MV)
设计说明
Supply the DSPIC33EP256GP504T-E/ML from a regulated 3.0V-3.6V rail (nominal 3.3V). Each VDD/VSS pin pair needs a 0.1uF ceramic capacitor placed within 2 mm of the pin, plus one bulk 4.7uF-10uF capacitor near the package. The dsPIC33EP integrates an on-chip 2.5V regulator for the core; connect the external regulator capacitor (typically 10uF, low-ESR) to the VCAP pin exactly as specified in the Microchip datasheet - omitting it or using the wrong value is one of the most common causes of erratic startup and brown-out resets on this family.
Estimated: the 44-QFN (8x8 mm) package on a typical 4-layer PCB has a theta_JA in the low tens of C/W; at 60 MIPS active operation the core current is modest (tens of mA), giving a junction rise of only a few tens of degrees above ambient - well inside the +125C E-grade limit. However, if the same board also drives motor gate drivers or digital power stages, verify that heat from adjacent MOSFETs does not raise the local ambient above the rating. Use thermal vias under the exposed pad tied to a ground plane to stabilize the die temperature.
Do not confuse package suffixes when sourcing: /ML is the 8x8 mm 44-QFN, /MV is a smaller 5x5 mm 44-QFN, and /PT is a TQFP - they are not footprint-interchangeable. Also note the I-grade vs E-grade temperature split: the -I/ML variant is not AEC-Q100 qualified and must not be substituted into automotive designs. Finally, the dsPIC33EP Peripheral Pin Select (PPS) remaps many digital functions; verify your PPS register map against the datasheet pin tables before layout freeze so peripheral pins do not collide.
For CAN applications, route CANTX/CANRX to the transceiver (e.g., MCP2551/MCP2562) with short, matched traces and place the transceiver's split-termination network (typically a 60 ohm split across a 120 ohm bus) away from the MCU's analog pins. Keep the CTMU/op-amp analog routing on the opposite side of the board from the PWM and CAN lines, and use a solid, unbroken ground plane under the QFN. Configure Programming/Debug (ICSP) header access to PGC/PGD pins before final layout, since PPS can reassign them away from the connector.
合规信息
AEC-Q100 qualification confirmed by Microchip USA and Xecor product listings for the -E grade. RoHS/REACH/lead-free certificates were not present in the verified data and must be confirmed on the Microchip product page environmental documents.