EP1S20F780I6 - Stratix FPGA 18,460 LEs 586 I/O 780-BGA | Intel
料号： EP1S20F780I6 ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $974.02 | $974.02 |
| 10 | $925.32 | $9,253.20 |
| 25 | $876.62 | $21,915.50 |
| 100 | $779.22 | $77,922.00 |
| 250 | $720.38 | $180,095.00 |
EP1S20F780I6 概述
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that lets engineers implement custom digital logic, memory blocks, DSP pipelines, and high-speed serial interfaces after fabrication. The Stratix family sits within Intel's (formerly Altera's) high-performance FPGA portfolio, between the lower-density Cyclone series and the higher-end Stratix GX / Stratix II / Stratix III tiers. Stratix devices use a 1.5 V core, embedded TriMatrix memory, dedicated DSP blocks, and high-speed I/O standards including LVDS, HSTL, SSTL, and LVTTL, making them well suited for parallel DSP, video/ imaging pipelines, communications backplanes, and prototype ASIC verification.
Key features of the EP1S20F780I6 include 18,460 logic elements distributed across 1,846 LABs (Logic Array Blocks), 14 embedded memory blocks (M-RAM, M4K, M512) totaling 1,669,248 RAM bits, 60 embedded 18x18 multipliers, four phase-locked loops (PLLs), and support for up to 586 user I/O pins via 29 I/O banks. The 780-ball FCBGA package exposes LVDS, HSTL, and SSTL I/O standards. Configuration is supported through passive serial, fast passive parallel, and JTAG modes, with optional on-chip encryption via the Stratix security feature.
Architecturally, the EP1S20F780I6 uses a 0.13 μm 1.5 V SRAM-based logic fabric with embedded RAM (M-RAM 4 Kb blocks plus M4K 4 Kb and M512 512-bit blocks), which avoids the long compile and re-spin costs of ASIC development. Compared with Stratix GX, the EP1S20 omits dedicated 3.125 Gbps transceivers; designs needing multi-gigabit serial should step up to Stratix GX. Compared with Cyclone II, the Stratix line adds TriMatrix memory, more multipliers, more PLLs, and richer I/O standard support, which translates to higher throughput for DSP, video, and communications front ends.
Typical applications include ASIC prototyping, parallel DSP (FFT, FIR, modulation/demodulation), video and image processing frames, industrial control and factory automation, telecom baseband and backplane bridging, and military/aerospace signal processing. The wide I/O count (586 pins) and abundant multipliers (60) make it attractive for multi-channel baseband cards and high-lane-count imaging arrays.
When designing with the EP1S20F780I6, allocate at least two PCB layers for power and ground planes, use a minimum of six dedicated 0.1 μF + bulk decoupling capacitors per VCC pin group, and follow Altera's Stratix Hardware Design Guidelines for high-speed transceiver-less I/O. JTAG and EPC configuration devices should be referenced to the same 1.5 V core supply plane to avoid inrush glitches.
This page synthesizes Stratix family datasheet data, current distributor pricing, drop-in same-package alternatives (including EP1S20F780C6 / C7 / I5 / I6N), and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： EP1S20F780I6 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1S20F780I6 （相同外形与封装尺寸） ——差异在于 Operating Temperature, Process Technology, Speed Grade, Configuration Method, Package.
快速对比工具——选择替代料号进行并排对比：
EP1S20F780I5N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$150 / 个
查看数据手册 →EP1S20F780C7N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$158.4 / 个
查看数据手册 →EP1S20F780C7
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$98.5 / 个
查看数据手册 →EP1S20F780C6N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$188.75 / 个
查看数据手册 →EP1S20F780C6
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
联系询价
查看数据手册 →EP1S20F780C5N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$92 / 个
查看数据手册 →EP1S20F780I6 最大额定值与电气特性
| Manufacturer | Intel (formerly Altera) |
| Series | Stratix |
| Family | Stratix FPGA |
| Logic Elements (LEs) | 18,460 |
| Logic Array Blocks (LABs) | 1,846 |
| Total RAM Bits | 1,669,248 bits |
| User I/O Pins | 586 |
| Number of I/O Banks | 29 |
| Embedded Multipliers (18x18) | 60 |
| Phase-Locked Loops (PLLs) | 4 |
| Package Type | 780-ball FCBGA (FineLine BGA) |
| 安装类型 | Surface Mount (BGA) |
| 工作温度 | -40C to +100C (industrial) |
| Speed Grade | -6 |
| Core Voltage | 1.5 V |
| Process Technology | 0.13 μm SRAM |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG |
| RoHS 状态 | Compliant |
| Lifecycle | Last Time Buy / NRND (Stratix legacy family) |
EP1S20F780I6 780-ball fcbga (fineline bga) 引脚配置指南
EP1S20F780I6（780-ball fcbga (fineline bga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1S20F780I6.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1S20F780I6 适用于 6 应用s: ASIC Prototyping and Verification, Parallel DSP and FFT Pipelines, Video and Image Processing, Telecom Baseband and Backplane Bridging, Industrial Control and Factory Automation, Military and Aerospace Signal Processing.
ASIC Prototyping and Verification
The EP1S20F780I6 is well suited for ASIC prototyping, where it provides 18,460 logic elements and 1,669,248 RAM bits to map complex ASIC designs 1:1 into a programmable fabric. Its 586 user I/Os in the 780-ball FCBGA package expose LVDS, HSTL, and SSTL I/O standards, allowing direct pin-level connection to the ASIC's external interface. Industrial temperature grade (-40C to +100C) supports pre-silicon validation in automotive and defense labs. Designers use Quartus II with the SOPC Builder flow to instantiate soft cores such as Nios II for control-plane emulation, then re-target the verified RTL to silicon.
推荐
Parallel DSP and FFT Pipelines
The EP1S20F780I6's 60 embedded 18x18 multipliers and 1,669,248 RAM bits make it ideal for parallel DSP workloads such as FFT, FIR filtering, and modulation/demodulation. A 1024-point radix-4 FFT fits comfortably within the device's logic and multiplier budget, and the TriMatrix memory (M-RAM, M4K, M512) provides flexible buffer sizing for coefficient tables and ping-pong sample buffers. The 4 PLLs allow independent clock domain generation for ADC/DAC sample clocks, FFT engine clocks, and backplane interface clocks, all within the same fabric.
推荐
Video and Image Processing
With 586 user I/Os and 18,460 LEs, the EP1S20F780I6 supports real-time video pipelines such as SD-SDI/HD-SDI capture, scaling, deinterlacing, and overlay compositing. The wide I/O count accommodates parallel RGB or YCbCr buses at full HD resolution (1920x1080) without multiplexing, while the 60 multipliers handle pixel-level math for color space conversion and scaling kernels. Industrial temperature grade and the high-BGA pin count fit mid-range video broadcast equipment chassis where thermal margins matter.
推荐
Telecom Baseband and Backplane Bridging
The EP1S20F780I6 serves in telecom baseband cards as a glue-logic bridge between line-card FPGAs, NPUs, and switch-fabric ASICs. Its 586 I/Os handle UTOPIA, POS-PHY, SPI-4.2, or CSIX-style parallel interfaces, while 60 multipliers accelerate channel coding (Viterbi, Turbo, LDPC) at moderate rates up to several hundred Mbps. Industrial temperature grade allows deployment in CO (central office) environments where ambient temperatures can exceed 70C. For multi-gigabit serial backplanes, however, designers should migrate to Stratix GX or Stratix II GX with built-in transceivers.
推荐
Industrial Control and Factory Automation
The EP1S20F780I6 is used in PLC controllers, motion controllers, and high-channel-count industrial data acquisition systems. Its 60 multipliers accelerate closed-loop PID computation across hundreds of axes, while the 586 I/Os support parallel encoder interfaces, opto-isolated GPIO, and fieldbus bridges (EtherCAT, Profibus, Modbus). The industrial temperature range (-40C to +100C) and the rugged 780-BGA package suit harsh factory-floor environments with high vibration and ambient temperature variation.
推荐
Military and Aerospace Signal Processing
The EP1S20F780I6's industrial temperature grade and high logic density make it suitable for military and aerospace signal processing applications such as radar front-end preprocessing, electronic warfare (EW) channelization, and secure communications modems. Designers pair it with high-speed ADCs for wideband capture and use the embedded multipliers for channelization filters and FFT-based spectral analysis. The 586 I/Os accommodate parallel data paths to multiple DACs and front-end RF digitizers. Long-life-cycle and configuration memory support is essential - pair with an EPC configuration device for secure boot.
推荐
推荐产品汇总
工程参考数据： EP1S20F780I6 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1S20F780I5N | EP1S20F780C7N | EP1S20F780C7 | EP1S20F780C6N | EP1S20F780C6 | EP1S20F780C5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FCBGA | 780-ball FCBGA (same) | 780-ball FCBGA (same) | 780-ball FCBGA (same) | 780-ball FCBGA (same) | 780-ball FCBGA (same) | 780-ball FCBGA (same) |
| Logic Elements | 18,460 | 18,460 | 18,460 | 18,460 | 18,460 | 18,460 | 18,460 |
| Total RAM Bits | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 |
| User I/Os | 586 | 586 | 586 | 586 | 586 | 586 | 586 |
| Embedded Multipliers (18x18) | 60 | 60 | 60 | 60 | 60 | 60 | 60 |
| Speed Grade | -6 | -5 | -7 | -7 | -6 | -6 | -5 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
关键差异点
- Industrial temperature grade (-40C to +100C) for harsh environments （对比 EP1S20F780C6)
- Speed grade -6 balanced performance for most designs （对比 EP1S20F780C7)
- Same-package alternatives enable Last Time Buy planning （对比 Cross-package alternatives)
设计说明
Estimated: the EP1S20F780I6 requires multiple supply rails (VCCINT 1.5 V core, VCCIO bank-specific, VCC_PLL 1.5 V, VCCAUX 2.5 V). Each bank can be configured independently for LVTTL/LVCMOS/HSTL/SSTL/LVDS reference voltages. Decouple with one 0.1 μF X7R ceramic per VCC pin group plus a 47 μF tantalum or polymer bulk capacitor per supply rail. Per Stratix Hardware Design Guidelines, place bulk capacitors within 250 mil of the BGA via pads to suppress transient current spikes during configuration and simultaneous switching events.
Estimated: the 780-ball FCBGA package uses a 1.27 mm pitch ball grid array. Escape routing requires a minimum 6-layer PCB stackup with at least 4 routing layers (2 internal for power/ground planes, 2 surface layers for signal escape). Use microvia-in-pad or via-on-pad technology to escape signals from inner rows. Signal integrity simulations should be performed on all LVDS pairs and HSTL/SSTL memory interfaces. Maintain 100 Ω differential impedance for LVDS and 50 Ω single-ended for general-purpose I/O. Follow Altera's Stratix Hardware Design Guidelines for layer stack and impedance recommendations.
Do not confuse the EP1S20 (Stratix, 0.13 μm, 1.5 V core, no transceivers) with the Stratix GX (EP1SGX series) or Stratix II (EP2S series) families. The Stratix GX has integrated 3.125 Gbps transceivers; the EP1S20 does not. The Stratix II uses a different package footprint (BGA-484/672) and is not pin-compatible. For JTAG configuration, ensure TCK is pulled low and TMS pulled high during power-up to avoid inadvertent entry into JTAG boundary-scan mode. Always verify configuration mode pins MSEL[3:0] settings before applying power.
合规信息
RoHS and lead-free compliance per Altera/Intel product page. AEC-Q100 not applicable - FPGAs are not automotive-qualified discretes; the I6 industrial grade provides extended temperature but is not AEC-Q100 qualified. Halogen-free status not explicitly listed in available web data.