EP1S20F780I6 - Stratix FPGA 18,460 LEs 586 I/O 780-BGA | Intel
MPN: EP1S20F780I6 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $974.02 | $974.02 |
| 10 | $925.32 | $9,253.20 |
| 25 | $876.62 | $21,915.50 |
| 100 | $779.22 | $77,922.00 |
| 250 | $720.38 | $180,095.00 |
Drop-in alternatives for EP1S20F780I6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S20F780I5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$150 / Unit
View Datasheet →EP1S20F780C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$158.4 / Unit
View Datasheet →EP1S20F780C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$98.5 / Unit
View Datasheet →EP1S20F780C6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$188.75 / Unit
View Datasheet →EP1S20F780C6
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →EP1S20F780C5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$92 / Unit
View Datasheet →EP1S20F780I6 Maximum Ratings & Electrical Characteristics
| Manufacturer | Intel (formerly Altera) |
| Series | Stratix |
| Family | Stratix FPGA |
| Logic Elements (LEs) | 18,460 |
| Logic Array Blocks (LABs) | 1,846 |
| Total RAM Bits | 1,669,248 bits |
| User I/O Pins | 586 |
| Number of I/O Banks | 29 |
| Embedded Multipliers (18x18) | 60 |
| Phase-Locked Loops (PLLs) | 4 |
| Package Type | 780-ball FCBGA (FineLine BGA) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | -40C to +100C (industrial) |
| Speed Grade | -6 |
| Core Voltage | 1.5 V |
| Process Technology | 0.13 μm SRAM |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG |
| RoHS Status | Compliant |
| Lifecycle | Last Time Buy / NRND (Stratix legacy family) |
EP1S20F780I6 780-ball fcbga (fineline bga) Pin Configuration Guide
Complete pinout information for EP1S20F780I6 (780-ball fcbga (fineline bga) package) with 586 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S20F780I6.
Refer to the datasheet for full pin configuration.
Estimated pin count: 586 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S20F780I6 is suitable for 6 applications: ASIC Prototyping and Verification, Parallel DSP and FFT Pipelines, Video and Image Processing, Telecom Baseband and Backplane Bridging, Industrial Control and Factory Automation, Military and Aerospace Signal Processing.
ASIC Prototyping and Verification
The EP1S20F780I6 is well suited for ASIC prototyping, where it provides 18,460 logic elements and 1,669,248 RAM bits to map complex ASIC designs 1:1 into a programmable fabric. Its 586 user I/Os in the 780-ball FCBGA package expose LVDS, HSTL, and SSTL I/O standards, allowing direct pin-level connection to the ASIC's external interface. Industrial temperature grade (-40C to +100C) supports pre-silicon validation in automotive and defense labs. Designers use Quartus II with the SOPC Builder flow to instantiate soft cores such as Nios II for control-plane emulation, then re-target the verified RTL to silicon.
Recommended
Parallel DSP and FFT Pipelines
The EP1S20F780I6's 60 embedded 18x18 multipliers and 1,669,248 RAM bits make it ideal for parallel DSP workloads such as FFT, FIR filtering, and modulation/demodulation. A 1024-point radix-4 FFT fits comfortably within the device's logic and multiplier budget, and the TriMatrix memory (M-RAM, M4K, M512) provides flexible buffer sizing for coefficient tables and ping-pong sample buffers. The 4 PLLs allow independent clock domain generation for ADC/DAC sample clocks, FFT engine clocks, and backplane interface clocks, all within the same fabric.
Recommended
Video and Image Processing
With 586 user I/Os and 18,460 LEs, the EP1S20F780I6 supports real-time video pipelines such as SD-SDI/HD-SDI capture, scaling, deinterlacing, and overlay compositing. The wide I/O count accommodates parallel RGB or YCbCr buses at full HD resolution (1920x1080) without multiplexing, while the 60 multipliers handle pixel-level math for color space conversion and scaling kernels. Industrial temperature grade and the high-BGA pin count fit mid-range video broadcast equipment chassis where thermal margins matter.
Recommended
Telecom Baseband and Backplane Bridging
The EP1S20F780I6 serves in telecom baseband cards as a glue-logic bridge between line-card FPGAs, NPUs, and switch-fabric ASICs. Its 586 I/Os handle UTOPIA, POS-PHY, SPI-4.2, or CSIX-style parallel interfaces, while 60 multipliers accelerate channel coding (Viterbi, Turbo, LDPC) at moderate rates up to several hundred Mbps. Industrial temperature grade allows deployment in CO (central office) environments where ambient temperatures can exceed 70C. For multi-gigabit serial backplanes, however, designers should migrate to Stratix GX or Stratix II GX with built-in transceivers.
Recommended
Industrial Control and Factory Automation
The EP1S20F780I6 is used in PLC controllers, motion controllers, and high-channel-count industrial data acquisition systems. Its 60 multipliers accelerate closed-loop PID computation across hundreds of axes, while the 586 I/Os support parallel encoder interfaces, opto-isolated GPIO, and fieldbus bridges (EtherCAT, Profibus, Modbus). The industrial temperature range (-40C to +100C) and the rugged 780-BGA package suit harsh factory-floor environments with high vibration and ambient temperature variation.
Recommended
Military and Aerospace Signal Processing
The EP1S20F780I6's industrial temperature grade and high logic density make it suitable for military and aerospace signal processing applications such as radar front-end preprocessing, electronic warfare (EW) channelization, and secure communications modems. Designers pair it with high-speed ADCs for wideband capture and use the embedded multipliers for channelization filters and FFT-based spectral analysis. The 586 I/Os accommodate parallel data paths to multiple DACs and front-end RF digitizers. Long-life-cycle and configuration memory support is essential - pair with an EPC configuration device for secure boot.
Recommended
Recommended Products Summary
Engineering reference data for EP1S20F780I6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S20F780I5N | EP1S20F780C7N | EP1S20F780C7 | EP1S20F780C6N | EP1S20F780C6 | EP1S20F780C5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FCBGA | 780-ball FCBGA (same) | 780-ball FCBGA (same) | 780-ball FCBGA (same) | 780-ball FCBGA (same) | 780-ball FCBGA (same) | 780-ball FCBGA (same) |
| Logic Elements | 18,460 | 18,460 | 18,460 | 18,460 | 18,460 | 18,460 | 18,460 |
| Total RAM Bits | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 |
| User I/Os | 586 | 586 | 586 | 586 | 586 | 586 | 586 |
| Embedded Multipliers (18x18) | 60 | 60 | 60 | 60 | 60 | 60 | 60 |
| Speed Grade | -6 | -5 | -7 | -7 | -6 | -6 | -5 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Key Differentiators
- Industrial temperature grade (-40C to +100C) for harsh environments (vs EP1S20F780C6)
- Speed grade -6 balanced performance for most designs (vs EP1S20F780C7)
- Same-package alternatives enable Last Time Buy planning (vs Cross-package alternatives)
Design Notes
Estimated: the EP1S20F780I6 requires multiple supply rails (VCCINT 1.5 V core, VCCIO bank-specific, VCC_PLL 1.5 V, VCCAUX 2.5 V). Each bank can be configured independently for LVTTL/LVCMOS/HSTL/SSTL/LVDS reference voltages. Decouple with one 0.1 μF X7R ceramic per VCC pin group plus a 47 μF tantalum or polymer bulk capacitor per supply rail. Per Stratix Hardware Design Guidelines, place bulk capacitors within 250 mil of the BGA via pads to suppress transient current spikes during configuration and simultaneous switching events.
Estimated: the 780-ball FCBGA package uses a 1.27 mm pitch ball grid array. Escape routing requires a minimum 6-layer PCB stackup with at least 4 routing layers (2 internal for power/ground planes, 2 surface layers for signal escape). Use microvia-in-pad or via-on-pad technology to escape signals from inner rows. Signal integrity simulations should be performed on all LVDS pairs and HSTL/SSTL memory interfaces. Maintain 100 Ω differential impedance for LVDS and 50 Ω single-ended for general-purpose I/O. Follow Altera's Stratix Hardware Design Guidelines for layer stack and impedance recommendations.
Do not confuse the EP1S20 (Stratix, 0.13 μm, 1.5 V core, no transceivers) with the Stratix GX (EP1SGX series) or Stratix II (EP2S series) families. The Stratix GX has integrated 3.125 Gbps transceivers; the EP1S20 does not. The Stratix II uses a different package footprint (BGA-484/672) and is not pin-compatible. For JTAG configuration, ensure TCK is pulled low and TMS pulled high during power-up to avoid inadvertent entry into JTAG boundary-scan mode. Always verify configuration mode pins MSEL[3:0] settings before applying power.
Compliance Information
RoHS and lead-free compliance per Altera/Intel product page. AEC-Q100 not applicable - FPGAs are not automotive-qualified discretes; the I6 industrial grade provides extended temperature but is not AEC-Q100 qualified. Halogen-free status not explicitly listed in available web data.
