EP1S60F1508C7 - Stratix FPGA 5712 LABs 1022 IO BGA-1508 | Intel
料号： EP1S60F1508C7 ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
EP1S60F1508C7 概述
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit containing programmable logic blocks, interconnect, and I/O resources that an engineer can configure after manufacture. Stratix devices, sitting in the high-performance tier of Intel's programmable logic hierarchy (Stratix > Cyclone > MAX), target applications requiring high logic density, fast parallel processing, and dedicated hardware acceleration for DSP and memory operations. The TriMatrix memory architecture and DSP blocks distinguish Stratix from simple programmable logic devices (PLDs/CPLDs) and from generic microcontrollers.
Key features of the EP1S60F1508C7 include 6,570 logic cells per the Stratix family datasheet block definitions, embedded multiplier blocks for DSP, dedicated high-speed transceivers in related package options, and support for external memory interfaces including DDR, DDR2, and QDR. The TriMatrix memory provides three sizes of RAM blocks (M512, M4K, M-RAM) optimized for different data widths and depths, enabling designers to balance memory utilization with performance.
From a technical depth perspective, the Stratix architecture combines lookup-table (LUT) based logic, dedicated carry chains for fast arithmetic, embedded SRAM, and high-speed I/O capable of LVDS signaling up to 840 Mbps per channel. The device supports configuration via passive serial, passive parallel synchronous, passive parallel asynchronous, and JTAG modes, with optional configuration via Altera (now Intel) EPC configuration devices.
Typical applications include telecommunications baseband processing, high-speed image and video pipelines, ASIC prototyping, networking equipment, and test and measurement instrumentation. The 1022 user I/O pins in the F1508 package support wide parallel buses and many high-speed serial channels in a single device.
When designing with this device, plan the PCB layout carefully - the F1508 FineLine BGA has a 1.0 mm or 1.27 mm ball pitch and requires microvia or via-in-pad technology. The device is now in the legacy / last-time-buy category per Intel's product lifecycle notices; confirm long-term supply with the manufacturer before designing into a new product. A modern successor such as Cyclone IV/V or Stratix IV/V should be evaluated for new designs.
This page consolidates distributor pricing snapshots, drop-in Stratix-family alternatives, and PCB layout considerations not found in a single datasheet, giving procurement and hardware engineers a one-stop reference for the EP1S60F1508C7.
直接替换替代料： EP1S60F1508C7 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1S60F1508C7 （相同外形与封装尺寸） ——差异在于 Family, Operating Temperature, PLLs, Package, Process Technology.
快速对比工具——选择替代料号进行并排对比：
EP1S60F1508C6
✅ 直接替换📋 参考替代料（不在目录中）
EP1S60F1508C5
✅ 直接替换📋 参考替代料（不在目录中）
EP1S60F1508C7N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$350 / 个
查看数据手册 →EP1S60F1508I7
✅ 直接替换📋 参考替代料（不在目录中）
EP2S60F1508C5
✅ 直接替换📋 参考替代料（不在目录中）
EP1S60F1508C6N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP1S60F1508C7 最大额定值与电气特性
| Family | Stratix |
| Series | Stratix I (EP1S) |
| Logic Elements (LE) | 57,120 |
| Logic Array Blocks (LABs) | 5,712 |
| Logic Cells (per datasheet definition) | 6,570 |
| Maximum User I/O | 1,022 |
| 封装 | FBGA-1508 (F1508) 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| 工作温度 | 0C to 85C (Commercial) |
| Speed Grade | 7 |
| Process Technology | 0.13 micron CMOS |
| Embedded Memory | TriMatrix (M512, M4K, M-RAM blocks) |
| DSP Blocks | Dedicated multiplier blocks |
| PLLs | Up to 12 |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG |
| 安装类型 | Surface Mount (BGA) |
| RoHS 状态 | Compliant (lead-free F1508 package) |
EP1S60F1508C7 fbga-1508 (f1508) 33 x 33 mm 引脚配置指南
EP1S60F1508C7（fbga-1508 (f1508) 33 x 33 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1S60F1508C7.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1S60F1508C7 适用于 6 应用s: Telecommunications Baseband Processing, High-Speed Image and Video Processing Pipelines, ASIC Prototyping and Emulation, Networking Equipment (Routers / Switches), Test and Measurement Instrumentation, Industrial Control and Automation.
Telecommunications Baseband Processing
The EP1S60F1508C7 fits telecommunications baseband processing because its 57,120 logic elements, dedicated DSP multiplier blocks, and 12 PLLs support high-rate baseband datapaths such as 3G/4G channel cards, turbo decoding, and FFT engines. The 1,022 user I/O in the F1508 package provides wide parallel buses to analog front ends and backplane interfaces without external multiplexing. The TriMatrix embedded memory (M512/M4K/M-RAM blocks totaling approximately 5.2 Mbits) supports deep packet FIFOs and constellation buffers. Compared with DSP processor solutions, the Stratix I silicon delivers deterministic latency in the microsecond range for symbol-rate processing.
推荐
High-Speed Image and Video Processing Pipelines
The EP1S60F1508C7 is well suited to high-speed image and video processing because the 1,022 user I/O accept wide parallel sensor buses (Camera Link, LVDS, RGB) and route pixel data into the 5,712 LAB fabric. The dedicated DSP blocks implement convolution, motion estimation, and color-space conversion in hardware at full pixel rate, while TriMatrix memory buffers line-scan or multi-frame video without external SDRAM. The -7 speed grade delivers the fastest logic and DSP timing in the Stratix I family, which is critical for 1080p60 throughput. Compared with CPU/GPU solutions, the FPGA approach removes software overhead and provides deterministic frame latency for machine-vision quality control.
推荐
ASIC Prototyping and Emulation
The EP1S60F1508C7 is widely used for ASIC prototyping and emulation because its 57,120 LEs, large TriMatrix memory, and high I/O count can map moderate-size ASIC RTL into a single device. The F1508 1508-ball BGA exposes many LVDS pairs to daughter-card interconnect, allowing multi-FPGA partitioning for larger ASICs. The Quartus II toolchain supports fast synthesis and incremental place-and-route, which is essential for iterative ASIC verification. The -7 speed grade minimizes timing closure friction, and the deterministic interconnect fabric gives ASIC designers cycle-accurate behavior.
推荐
Networking Equipment (Routers / Switches)
The EP1S60F1508C7 fits networking equipment designs because the TriMatrix M-RAM blocks provide large packet buffers, and the 1,022 user I/O support multi-port 1 Gbps Ethernet MACs, SPI-4.2, and CSIX interfaces. The 12 PLLs synthesize independent clocks for each network port, while the DSP blocks accelerate IPsec / IPSec offload, packet classification, and QoS policing. Compared with general-purpose network processors, the Stratix I silicon delivers deterministic line-rate forwarding at lower BOM cost. The F1508 package supports 1 GB+ of external memory bandwidth via DDR/DDR2 controller soft cores.
推荐
Test and Measurement Instrumentation
The EP1S60F1508C7 supports test and measurement instrumentation because the 1,022 user I/O accept multiple high-speed ADC/DAC data streams, while the DSP blocks implement digital down-conversion, FIR filters, and FFT in real time. The TriMatrix memory buffers long acquisition records, and the 12 PLLs generate independent sample clocks for each instrument channel. The -7 speed grade preserves timing margin in 200+ MHz instrument designs. The FPGA replaces discrete DSP processors and FPGAs in legacy instruments, simplifying the BOM and improving time-to-market.
推荐
Industrial Control and Automation
The EP1S60F1508C7 fits industrial control applications where parallel I/O, deterministic logic, and long-term supply are required. The 1,022 user I/O directly drive stepper drivers, servo controllers, and high-speed encoder inputs, while the embedded DSP blocks implement PID control loops and motor commutation in hardware. The F1508 package supports industrial backplane standards such as VME and CompactPCI. The Stratix I family is now in last-time-buy, but the device remains in service for legacy industrial controllers; for new industrial designs, the Cyclone IV/V family is recommended.
推荐
推荐产品汇总
工程参考数据： EP1S60F1508C7 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1S60F1508C6 | EP1S60F1508C5 | EP1S60F1508C7N | EP1S60F1508I7 | EP2S60F1508C5 | EP1S60F1508C6N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FBGA-1508 (F1508) 33x33 mm | FBGA-1508 (F1508) - same | FBGA-1508 (F1508) - same | FBGA-1508 (F1508) - same | FBGA-1508 (F1508) - same | FBGA-1508 (F1508) - same | FBGA-1508 (F1508) - same |
| Logic Elements | 57,120 | 57,120 | 57,120 | 57,120 | 57,120 | 60,440 | 57,120 |
| Speed Grade | 7 (fastest Stratix I commercial) | 6 (slower) | 5 (slowest) | 7 (same) | 7 (same) | 5 (Stratix II generation) | 6 |
| Operating Temperature | 0C to 85C (Commercial) | 0C to 85C | 0C to 85C | 0C to 85C | -40C to 100C (Industrial) | 0C to 85C | 0C to 85C |
| Family / Generation | Stratix I (0.13 um CMOS) | Stratix I | Stratix I | Stratix I | Stratix I | Stratix II (90 nm) | Stratix I |
| Maximum User I/O | 1,022 | 1,022 | 1,022 | 1,022 | 1,022 | 1,022 | 1,022 |
| Process / Power | 0.13 um, higher power | 0.13 um, same | 0.13 um, same | 0.13 um, same | 0.13 um, same | 90 nm, lower power | 0.13 um, same |
| Lifecycle Status | Last-time-buy / Mature | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Mature | Last-time-buy |
关键差异点
- Highest logic density in the original Stratix I family （对比 EP1S40F1020C7)
- Largest user I/O count in the F1508 package （对比 EP1S60F1020C7)
- Fastest speed grade available for Stratix I commercial temperature （对比 EP1S60F1508C6)
- Compared with Stratix II successor （对比 EP2S60F1508C5)
设计说明
The F1508 FineLine BGA has a 1.0 mm ball pitch on a 33x33 mm substrate. Use microvia or via-in-pad technology (laser-drilled or plasma-etched) to fan out the 1508 balls. A 4-layer PCB with continuous power and ground planes under the device is mandatory; 6 or more layers are recommended for high-speed LVDS signal integrity. Use thermal vias under the BGA thermal balls to carry heat from the die to the bottom-side copper or heatsink. Estimated: at 25C ambient and 5 W device dissipation, junction-to-ambient thermal resistance must remain below 15 C/W to keep Tj below 100C, which typically requires at least 100 thermal vias and a 0.5 square inch copper pour on the opposite side.
Stratix I LVDS inputs support up to 840 Mbps per channel. Maintain differential pair length matching within 10 ps for clock pairs and 50 ps for data pairs. Reference each LVDS pair to a continuous ground plane; do not route over power plane splits. Use series termination resistors as specified in the Stratix Device Handbook, typically 100 ohm differential near the receiver. Estimated: total jitter budget for a 500 Mbps LVDS link is approximately 0.3 UI (600 ps) after subtracting PLL jitter, leaving 400 ps for PCB routing and source-synchronous clock skew.
Stratix I devices require multiple supply rails: VCCINT (core), VCCIO (I/O banks, one voltage per bank), VCCPD (pre-driver), VCC_PLL (PLL analog), and VREF. Each rail should be decoupled with a combination of 0.1 uF, 0.01 uF, and bulk capacitors placed as close to the balls as possible. The device supports power sequencing constraints - VCCINT, VCCPD, and VCCIO must rise monotonically; consult the Stratix Device Family Data Sheet for the recommended sequencing order. Estimated: a fully populated 57,120-LE Stratix I design at 100 MHz clock and 50% toggle rate may consume 5-8 W from VCCINT alone.
Do not confuse speed grade ordering across Stratix families: in Stratix I, lower numbers (e.g. -8) are faster than higher numbers (e.g. -7), but in Stratix II the convention reverses. Verify the speed grade convention in the target datasheet. Do not assume pin compatibility between Stratix I and Stratix II in the F1508 package - the Stratix II EP2S60F1508 has the same ball map but some power pins are relocated, so the PCB may need minor adjustments. Always re-validate power sequencing and pinout before reusing a Stratix I layout for a Stratix II design.
Place configuration flash (e.g. EPC16) within 4 inches of the FPGA to keep the passive-serial configuration link reliable. Route JTAG signals (TCK, TMS, TDI, TDO, TRST) as a daisy chain to all JTAG devices, with 10K pull-ups on TCK and TMS to VCCIO. Reserve a JTAG header on the PCB for in-system programming and boundary-scan debug. If using passive parallel configuration, the DATA[7:0] bus must be length-matched to within 100 ps to the DCLK signal.
合规信息
Per the Octopart and Mouser product pages, the EP1S60F1508C7 is supplied in a lead-free F1508 package and is RoHS compliant. The part is not AEC-Q100 qualified - the commercial 0C-85C rating excludes automotive use; the industrial EP1S60F1508I7 covers -40C to 100C. Halogen-free status is not explicitly stated in the verified data.
