EP1S40F1020C7 - 41,250-Cell Stratix FPGA, 1020-BGA | Intel / Altera
MPN: EP1S40F1020C7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1595 | $159,500.00 |
| 500 | $1480 | $740,000.00 |
| 1,000 | $1380 | $1,380,000.00 |
Drop-in alternatives for EP1S40F1020C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S40F1020C6
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View Datasheet →EP1S40F1020C6N
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View Datasheet →EP1S40F1020C5
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View Datasheet →EP1S40F1020C5N
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View Datasheet →EP1S30F1020C7
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View Datasheet →EP1S40F1020C7 Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 41,250 |
| Typical Gates | 412,500 |
| CLBs | 4,697 |
| Embedded Memory Bits | 3,423,744 |
| Maximum User I/O | 773 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Operating Temperature | 0 C to 85 C (Commercial) |
| Package | 1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch) |
| Mounting Type | Surface Mount |
| Maximum Internal Clock | 420.17 MHz |
| DSP Blocks | Yes (dedicated 9x9 / 18x18 / 36x36 multipliers) |
| TriMatrix Memory | M512 / M4K / M-RAM blocks |
EP1S40F1020C7 1020-ball fc-fbga (33 x 33 mm, 1 mm pitch) Pin Configuration Guide
Complete pinout information for EP1S40F1020C7 (1020-ball fc-fbga (33 x 33 mm, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S40F1020C7.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S40F1020C7 is suitable for 6 applications: ASIC Prototyping and Emulation, High-Speed Digital Signal Processing, Telecommunications Backhaul and Protocol Bridging, Image and Video Processing Pipelines, Industrial Control and High-Speed Data Acquisition, Software-Defined Radio (SDR) Baseband.
ASIC Prototyping and Emulation
The EP1S40F1020C7's 41,250 logic elements, 3,423,744 bits of embedded memory, and 412,500 typical gates make it well suited to ASIC prototyping and logic emulation. Engineers can map large portions of an ASIC RTL into the Stratix fabric to validate functionality and timing before committing to a mask set. The 1020-ball FBGA exposes up to 773 user I/O pins, which is enough to bring out wide ASIC buses for parallel bring-up. Dedicated DSP blocks accelerate multiplier-heavy RTL paths. Use Quartus II synthesis and the SOPC Builder for IP integration; the device's high I/O count supports multiple probe buses for in-circuit emulation.
Recommended
High-Speed Digital Signal Processing
The EP1S40F1020C7 integrates dedicated DSP blocks capable of 9x9, 18x18, and 36x36-bit multiplications per clock cycle, making it well suited to FFT, FIR, and I/Q processing pipelines. Combined with 3.4 Mbits of TriMatrix memory, the device can hold coefficient tables and data buffers on-chip, eliminating external SRAM latency. The 420 MHz internal clock sustains real-time baseband processing for software-defined radio and radar front-ends. Designers can pipeline multiple DSP blocks for sustained throughput above 10 GMACs.
Recommended
Telecommunications Backhaul and Protocol Bridging
Telecom backhaul cards benefit from the EP1S40F1020C7's 773 user I/O and high-speed differential signaling support (LVDS, HSTL, SSTL). The device can bridge multiple telecom protocols (SONET/SDH framer, Ethernet MAC, custom serializer/deserializer) by mapping each protocol to a separate I/O bank. The TriMatrix memory allows deep FIFO buffering between asynchronous clock domains. Up to 420 MHz fabric clock enables wire-speed processing of OC-192/STM-64-class payloads with margin.
Recommended
Image and Video Processing Pipelines
The 41,250 logic elements and 3.4 Mbits of embedded memory enable real-time image processing pipelines such as HD-SDI capture, color-space conversion, scaling, and overlay composition. The 773 user I/O pins can ingest parallel Camera Link or DVI streams and drive HDMI/DVI outputs. DSP blocks accelerate convolution kernels and motion-estimation arithmetic. The 1020-ball FBGA exposes enough I/O for multi-stream HD pipelines with embedded frame buffers in TriMatrix memory.
Recommended
Industrial Control and High-Speed Data Acquisition
Industrial control systems with high-speed data acquisition (multi-MHz ADC sampling, encoder feedback, deterministic actuation) benefit from the EP1S40F1020C7's parallel I/O count and DSP throughput. The 773 user I/O can capture data from multiple synchronized ADC channels while the TriMatrix memory buffers bursts. The 0-85 °C commercial temperature range covers most factory-floor enclosures; for harsher environments, the EP1S40F1020I industrial variant is recommended. Hardware determinism makes the device preferable to microcontrollers for closed-loop control.
Recommended
Software-Defined Radio (SDR) Baseband
SDR baseband designs benefit from the EP1S40F1020C7's DSP density and high fabric clock. Up- and down-conversion chains, channelizers, and demodulators can be implemented entirely in fabric with margin. The TriMatrix memory holds complex sample buffers and channel coefficients; the 1020-ball FBGA exposes enough LVDS pairs to interface directly to high-speed ADC/DAC front-ends. Engineers can reconfigure the SDR personality in seconds via JTAG, enabling multi-mode radio platforms.
Recommended
Recommended Products Summary
Engineering reference data for EP1S40F1020C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S40F1020C6 | EP1S40F1020C6N | EP1S40F1020C5 | EP1S40F1020C5N | EP1S30F1020C7 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch) | 1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch) - same | 1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch) - same | 1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch) - same | 1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch) - same | 1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch) - same |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 33,880 |
| Speed Grade | 7 (fastest) | 6 | 6 | 5 (slowest) | 5 (slowest) | 7 |
| Embedded Memory Bits | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 2,213,376 |
| Maximum User I/O | 773 | 773 | 773 | 773 | 773 | 773 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lead-Free / RoHS Finish | [DATA_NEEDED] | [DATA_NEEDED] | Yes (N suffix) | [DATA_NEEDED] | Yes (N suffix) | [DATA_NEEDED] |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest speed grade in 1020-ball FBGA EP1S40 family (vs EP1S40F1020C6)
- Maximum logic density in original Stratix family in this package (vs EP1S30F1020C7)
- Dedicated DSP blocks and TriMatrix memory in original 130 nm Stratix (vs EP1K50 / ACEX family)
Design Notes
The 1020-ball FineLine BGA package uses a 1 mm ball pitch on a 33 x 33 mm substrate. Per Stratix handbook layout guidelines, escape routing must use microvia or via-in-pad (VIPPO) technology for reliable breakout. Without microvias, signal escape from inner balls is impractical at 1 mm pitch. Plan a minimum 6 PCB layers with dedicated power/ground planes beneath the device; insufficient decoupling will cause simultaneous-switching-noise (SSN) issues on high-speed I/O banks. Estimate: at 1.5 V core and 0.85 V PLL supply, expect ~10-15 W typical core power for high-utilization designs.
The EP1S40F1020C7 requires a 1.5 V core supply plus a separate analog PLL supply (also typically 1.5 V) plus I/O bank reference voltages (VREF) for HSTL/SSTL standards. Power-rail sequencing should bring the core up before the I/O banks to avoid latch-up; consult the Stratix handbook section on power management for the canonical sequence. Bulk decoupling of at least 220 uF per supply domain plus 0.1 uF and 0.01 uF high-frequency caps at every supply pin is recommended. Estimated: a high-utilization design at 420 MHz can exceed 20 W dynamic power.
Do not assume all Stratix EP1S40F1020 speed grades are interchangeable at the binary bitstream level - the SOF (SRAM Object File) is speed-grade specific, and loading a C7 bitstream on a C5 device will fail configuration. Always regenerate the programming file for the actual target speed grade. Also note that the original Stratix family uses 1.5 V core while Stratix III/IV/V use lower core voltages; mixing families on a multi-FPGA board requires level translation. Configuration schemes (Passive Serial, Passive Parallel Synchronous, Active Serial via EPC16/EPC64) must match the chosen configuration device generation.
Compliance Information
RoHS / lead-free status not explicitly stated in the Verified Web Data for EP1S40F1020C7. N-suffixed variants (C6N, C5N) are typically lead-free finishes. AEC-Q100 not applicable (FPGA, not automotive-qualified discrete).
