EP1S60F1508C7N - Stratix 57K LE FPGA, 1022 I/O, 1508-FCBGA | Intel
MPN: EP1S60F1508C7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $460 | $4,600.00 |
| 100 | $420 | $42,000.00 |
| 500 | $380 | $190,000.00 |
| 1,000 | $350 | $350,000.00 |
Drop-in alternatives for EP1S60F1508C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1S60F1508C7
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP1S60F1508C6N
✅ Drop-In📋 Reference alternative (not in catalog)
EP1S60F1508C7N Maximum Ratings & Electrical Characteristics
| Series | Stratix |
| Family | Stratix (EP1S60) |
| Logic Elements (LEs) | 57,120 |
| Logic Blocks / LABs | 5,712 LABs (6,570 CLBs) |
| Total Embedded RAM | 5,215,104 bits (521 Kbits) |
| User I/O Pins | 1,022 |
| DSP / Multiplier Blocks | 18-bit DSP blocks |
| PLLs | 12 (up to 400 MHz) |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.425 V to 1.575 V (1.5 V nominal) |
| Operating Temperature | 0 °C to 85 °C (Commercial) |
| Package | 1508-ball FC-FBGA, 1.0 mm pitch, 40 x 40 mm |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Lead-free / RoHS compliant per datasheet |
| Lead-Free | Yes |
| Lifecycle | Obsolete - Stratix family EOL |
EP1S60F1508C7N 1508-ball fc-fbga, 1.0 mm pitch, 40 x 40 mm Pin Configuration Guide
Complete pinout information for EP1S60F1508C7N (1508-ball fc-fbga, 1.0 mm pitch, 40 x 40 mm package) with 1,022 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S60F1508C7N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 1,022 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S60F1508C7N is suitable for 6 applications: Telecom Line-Card ASIC Prototyping, High-Performance DSP and Image Processing, Software-Defined Radio (SDR) Baseband, Networking Switch Fabric, Military / Aerospace Legacy Avionics, Industrial Test and Measurement Instrumentation.
Telecom Line-Card ASIC Prototyping
The EP1S60F1508C7N's 57,120 logic elements and 1,022 user I/O pins make it a strong fit for telecom line-card ASIC prototyping, where engineers emulate custom packet-processing chips before taping out silicon. Its 521 Kbits of TriMatrix on-chip RAM support wide packet buffers and lookup tables without external SRAM for many control-plane tasks. The 12 PLLs and 420 MHz DSP blocks handle serializer/deserializer and framer logic at line rates. Compared to ASIC, it allows same-day RTL iteration, but consumes more power at the 1.5 V core.
Recommended
High-Performance DSP and Image Processing
With 18-bit DSP blocks clocked at up to 420 MHz and 521 Kbits of embedded RAM, the EP1S60F1508C7N is well suited to high-performance DSP and real-time image processing pipelines, including FFTs, FIR filters, and convolution accelerators. The 1,022 user I/O pins let designers attach multiple DDR/QDR SRAM banks and high-resolution video ADCs in parallel. The 130 nm CMOS process trades off against newer 65 nm / 28 nm FPGAs in power efficiency, but remains adequate for fixed-function DSP cards in industrial imaging. Altera's DSP Builder and Quartus II toolchain support direct MATLAB-to-FPGA flow for image-processing teams.
Recommended
Software-Defined Radio (SDR) Baseband
The EP1S60F1508C7N's combination of 57,120 LEs, dedicated 18-bit DSP blocks, 12 PLLs, and up to 12 high-speed serial transceivers (3.125 Gbps) depending on die variant positions it as a viable SDR baseband engine for sub-6 GHz waveforms. The 1,022 user I/O pins route digital baseband to RF front-end ADCs/DACs and provide ample GPIO for control and synchronization. Embedded TriMatrix memory supports waveform sample buffers and channelization tables at baseband. Designers should budget for the 130 nm process's higher static power vs modern Arria 10 / Stratix 10 alternatives when sizing thermal solutions.
Recommended
Networking Switch Fabric
In networking switch-fabric designs, the EP1S60F1508C7N's wide I/O count (1,022) and 521 Kbits of TriMatrix RAM enable multi-queue packet schedulers and CAM-like lookup engines for 10G / 40G aggregate line cards. The 12 PLLs generate independent clocks for SERDES lanes and backplane SerDes links. Pin-compatible Stratix variants such as EP1S40F1020C7N allow right-sizing of fabric capacity per port count. The 130 nm die delivers proven reliability for long-lifecycle telecom programs where re-qualification cost outweighs the power-efficiency advantage of newer nodes.
Recommended
Military / Aerospace Legacy Avionics
The EP1S60F1508C7N's commercial-grade operating range (0 °C to 85 °C) and high logic density have made it a go-to prototyping FPGA for legacy avionics and military signal-processing subsystems where long-qualified Altera toolchains are required. The 1508-ball FC-FBGA withstands the mechanical shock and vibration profile of airborne platforms when paired with underfilled PCB assemblies. TriMatrix memory and DSP blocks accelerate radar and SIGINT pre-processing algorithms. Designers should note the part is EOL and must qualify Stratix II EP2S60F1508C5N or industrial-grade EP1S60F1508I7N as second sources.
Recommended
Industrial Test and Measurement Instrumentation
Test and measurement instruments - oscilloscopes, logic analyzers, protocol testers, and arbitrary waveform generators - leverage the EP1S60F1508C7N's 1,022 user I/O and 521 Kbits of embedded memory to implement parallel acquisition channels and deep sample buffers. The 12 PLLs synchronize multiple ADC clock domains within a single device. Compared with newer FPGAs, the 130 nm Stratix die consumes more watts per MHz, but its mature Altera Quartus II design flow and abundant reference designs accelerate time to market for niche instrumentation products. Pin-compatible Stratix variants let designers right-size cost per channel.
Recommended
Recommended Products Summary
Engineering reference data for EP1S60F1508C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S60F1508C7 | EP1S60F1508C6N |
|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 1508-ball FC-FBGA | 1508-ball FC-FBGA - identical | 1508-ball FC-FBGA - identical |
| Logic Elements | 57,120 LEs | 57,120 LEs | 57,120 LEs |
| Embedded RAM | 5,215,104 bits | 5,215,104 bits | 5,215,104 bits |
| User I/O | 1,022 | 1,022 | 1,022 |
| Speed Grade | -7 | -7 | -6 (slower Fmax) |
| Temperature Grade | Commercial (0 to 85 C) | Commercial (0 to 85 C) | Commercial (0 to 85 C) |
| Lead-Free (N suffix) | Yes (N suffix) | No (non-N variant) | Yes (N suffix) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest-density member of the original Stratix family with 1,022 user I/O (vs EP1S60F1020C7N)
- Faster speed grade than the -6 variant (vs EP1S60F1508C6N)
- Lead-free (N suffix) compliance for modern RoHS designs (vs EP1S60F1508C7)
Design Notes
The EP1S60F1508C7N 1508-ball FC-FBGA package is rated at a theta-JA of approximately 15 C/W with appropriate thermal via arrays under the BGA. Designers must use a 4-layer PCB with a solid ground/power plane and a full array of thermal vias under the central die region to keep the junction below 100 C at 1.5 V core and 0.5 to 0.8 A typical core current. Stratix power calculator files in Altera Quartus II estimate worst-case power at ~5 W, so a small heatsink or 6-Layer PCB stack-up is recommended for forced-air-cooled chassis.
Use a high-density BGA fan-out with microvia-in-pad or via-on-pad construction to escape the 1.0 mm pitch FC-FBGA; standard 0.8 mm laser-drilled microvias on a 4-layer 1 oz copper stack-up are typical. Match trace impedance to 50 ohm single-ended / 100 ohm differential for high-speed LVDS lanes. Decouple VCCINT with 0.1 uF, 1 uF, and 10 uF ceramic capacitors distributed beneath the package, plus bulk tantalum/polymer capacitors on the 1.5 V and 3.3 V rails per the Stratix hardware reference.
Estimated: with 130 nm CMOS and 1.5 V core, VCCINT decoupling must be placed within 50 mils of each BGA power pin and use low-ESL ceramics; missing decoupling causes PLL jitter and LVDS eye-pattern degradation. Always configure unused user I/O as tri-stated inputs with internal weak pull-up enabled in the Quartus pin planner. Finally, because this part is EOL, do not start new high-volume designs on the EP1S60F1508C7N - qualify the EP1S60F1508C7 or the EP1S60F1508C6N as second source and migrate to Stratix II EP2S60F1508C5N for new programs.
Compliance Information
Lead-free / RoHS compliant per the Altera datasheet (N suffix indicates lead-free terminal finish). REACH, halogen-free, and conflict-mineral status were not explicitly stated in the verified data and remain unknown.
