EP1SGX10DF672C7 - Stratix GX FPGA 10,570 LEs 672-FBGA | Altera
料号： EP1SGX10DF672C7 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $142 | $14,200.00 |
| 500 | $121 | $60,500.00 |
| 1,000 | $98.5 | $98,500.00 |
EP1SGX10DF672C7 概述
An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, routing interconnects, and dedicated silicon IP such as block RAM, DSP slices, PLLs, and serializer/deserializer (SerDes) transceivers on a single die. Within the broader semiconductor hierarchy, FPGAs sit above fixed-function ASICs in flexibility and below microcontrollers in software abstraction, occupying the design space where high parallelism, custom datapaths, and hardware-level protocol termination (PCI Express, Gigabit Ethernet, Serial RapidIO) are required.
Key features of the EP1SGX10DF672C7 include integrated 3.125 Gbps transceivers, embedded multiplier blocks suited to DSP and baseband signal processing, and tri-state 3.3 V/2.5 V/1.8 V LVTTL/LVCMOS I/O standards. The device supports in-system configuration via passive serial, active serial, and JTAG modes, and includes on-chip encryption circuitry for bitstream protection. Total RAM is organized into M512, M4K, and M-RAM blocks to balance density and access granularity.
Architecturally, the Stratix GX family uses a row- and column-based logic array with DirectDrive routing and MultiTrack interconnect to minimize delay skew and support predictable timing closure. The integrated transceiver channels use a hardened physical media attachment (PMA) layer and a soft physical coding sublayer (PCS), allowing protocol stacks for PCI Express, Gigabit Ethernet, Serial RapidIO, and Aurora to be implemented without external PHY devices.
Typical applications include communication line cards, baseband processing for wireless backhaul, protocol bridging ASICs, high-speed serial interface test and prototyping platforms, and embedded DSP preprocessing for radar and medical imaging. The combination of high logic count and embedded serial channels is the key differentiator from general-purpose Stratix devices.
When designing with this part, ensure that all transceiver reference clocks are routed as differential pairs with controlled impedance, and confirm that the FBGA-672 PCB land pattern uses 1.0 mm pitch microvia or via-in-pad construction to maintain signal integrity at multi-gigabit data rates. The package is large (33 x 33 mm), so PCB layer count and stackup should be planned early.
This page synthesizes distributor pricing from four major sources, drop-in compatible alternatives in the same FBGA-672 footprint, and practical design notes not found in the manufacturer datasheet summary.
直接替换替代料： EP1SGX10DF672C7 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1SGX10DF672C7 （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, Family, Logic Elements, Process Technology.
快速对比工具——选择替代料号进行并排对比：
EP1SGX10DF672C7N
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →EP1SGX10DF672C6N
✅ 直接替换✓ 有现货
$195 / 个
查看数据手册 →EP1SGX10CF672C7
✅ 直接替换✓ 有现货
$185 / 个
查看数据手册 →EP1SGX10CF672C7N
✅ 直接替换✓ 有现货
$182.1 / 个
查看数据手册 →EP2SGX30DF672I4
✅ 直接替换📋 参考替代料（不在目录中）
EP1SGX10DF672C7 最大额定值与电气特性
| Family | Stratix GX |
| Manufacturer | Altera (Intel) |
| Logic Elements | 10,570 |
| Total RAM Bits | 920,448 |
| User I/O Count | 362 |
| 封装 | FBGA-672 (33 x 33 mm, 1.0 mm pitch) |
| Logic Family | CMOS |
| 电源电压 | 1.425 V to 1.575 V (core) |
| 工作温度 | 0 C to 85 C (commercial) |
| Pin/Ball Count | 672 |
| Number of Transceivers | Up to 20 channels (per Stratix GX family) |
| Transceiver Data Rate | Up to 3.125 Gbps |
| Embedded Multipliers | Yes (DSP blocks) |
| Configuration Modes | Passive Serial, Active Serial, JTAG |
| 安装类型 | Surface Mount |
EP1SGX10DF672C7 fbga-672 (33 x 33 mm, 1.0 mm pitch) 引脚配置指南
EP1SGX10DF672C7（fbga-672 (33 x 33 mm, 1.0 mm pitch) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1SGX10DF672C7.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1SGX10DF672C7 适用于 6 应用s: PCI Express Endpoint / Root Complex, Gigabit Ethernet Aggregation / Switching Line Cards, Serial RapidIO Baseband Processing, High-Speed Serial Protocol Bridge / ASIC Prototype, Radar / Ultrasound DSP Preprocessing, Industrial Test & Measurement Instrumentation.
PCI Express Endpoint / Root Complex
The EP1SGX10DF672C7 is well suited to PCI Express endpoint and root complex designs because it integrates up to 20 hardened 3.125 Gbps transceiver channels that natively support the PCIe x1 and x4 physical layer. The transceiver PMA handles 8B/10B encoding, comma alignment, and clock-data recovery, while the soft PCS implements the transaction and data link layers. Using the ALT2GXB megafunction in Quartus II, engineers can build a complete PCIe x4 endpoint in approximately 3,000 logic elements, leaving the remaining 7,500 LEs for user logic. For boards targeting 2.5 GT/s PCIe Gen 1 throughput with minimal board BOM, the FBGA-672 device provides the highest logic count in the EP1SGX10 family while exposing the maximum transceiver count.
推荐
Gigabit Ethernet Aggregation / Switching Line Cards
Telecom line cards aggregating multiple Gigabit Ethernet links into a backplane fabric benefit from the EP1SGX10DF672C7's integrated 1000BASE-X PCS support. Each transceiver implements the 8B/10B physical coding sublayer with rate adaptation, while soft logic can build the MAC, link aggregation, and switching table. The device's 920 kbit embedded RAM buffers packets efficiently, and the 362 user I/O pins accommodate multiple GMII/RGMII interfaces plus SGMII bridges. Compared with discrete PHY + ASSP solutions, this single-chip approach reduces board area by approximately 40% and simplifies thermal design because all serial channels are uniformly clocked from a single PLL tree.
推荐
Serial RapidIO Baseband Processing
Wireless baseband DSP cards use the EP1SGX10DF672C7 to bridge Serial RapidIO (sRIO) links to DSP clusters such as TI TMS320C6000 series. The embedded 3.125 Gbps transceivers map directly to the sRIO physical specification, and the device's 10,570 logic elements provide ample fabric for the sRIO logical layer, error correction, and DSP preprocessing (FFT, channelization, FEC). The 920 kbit block RAM holds frame descriptors and circular buffers for sustained 2 Gbps throughput, while the 362 user I/O pins interface to external DDR-2 and LVDS links. Engineers can build complete sRIO-to-DSP bridges with under 30ns backplane latency.
推荐
High-Speed Serial Protocol Bridge / ASIC Prototype
For ASIC replacement or pre-silicon prototyping of custom serial protocols (XAUI, Aurora, custom 8B/10B), the EP1SGX10DF672C7 provides the flexibility to implement both ends of the link in a single device family. Each transceiver channel can be configured independently for different data rates and protocols, making the device ideal for bridging between XAUI, SGMII, and PCIe in protocol-converter applications. The abundant 362 user I/O pins accommodate parallel LVDS side interfaces to legacy ASICs, and the large embedded RAM enables packet buffering across the protocol bridge.
推荐
Radar / Ultrasound DSP Preprocessing
Medical imaging and defense radar systems use the EP1SGX10DF672C7 for high-speed DSP preprocessing of ADC sample streams before forwarding to host processors. The integrated multiplier/DSP blocks implement FIR filters and FFT butterflies at full sample rate, while the transceivers stream processed data to downstream FPGAs or DSPs via Aurora or Serial RapidIO. The 920 kbit block RAM holds complex FFT twiddle tables and intermediate frame buffers. Compared with discrete DSP processor arrays, a single EP1SGX10DF672C7 reduces power per FFT by 3-5x and enables deterministic latency for phase-sensitive beamforming.
推荐
Industrial Test & Measurement Instrumentation
Bench-top test equipment such as protocol analyzers, BERT (bit error rate testers), and logic analyzers leverage the EP1SGX10DF672C7 for simultaneous generation and analysis of multi-gigabit serial traffic. Each channel can be looped back for self-test, and the embedded RAM captures long PRBS patterns for jitter compliance testing. The 362 user I/O pins drive LCD/TFT displays and front-panel controls, while the 10,570 logic elements host custom measurement firmware. The commercial temperature grade (0 C to 85 C) is appropriate for laboratory environments.
推荐
推荐产品汇总
工程参考数据： EP1SGX10DF672C7 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1SGX10DF672C7N | EP1SGX10DF672C6N | EP1SGX10CF672C7 | EP1SGX10CF672C7N | EP2SGX30DF672I4 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | FBGA-672 (33x33 mm, 1.0 mm pitch) | FBGA-672 (same) | FBGA-672 (same) | FBGA-672 (same) | FBGA-672 (same) | FBGA-672 (same footprint, different ball map) |
| Logic Elements | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 33,000 |
| Total RAM Bits | 920,448 | 920,448 | 920,448 | 920,448 | 920,448 | 2,310,528 |
| User I/O | 362 | 362 | 362 | 362 | 362 | 362 |
| Integrated Transceivers | Yes, up to 20 channels @ 3.125 Gbps | Yes, same | Yes, same | No (Stratix non-GX) | No (Stratix non-GX) | Yes, 8 channels @ 6.375 Gbps |
| Speed Grade | C7 (commercial, fastest) | C7 (same) | C6 (-1 grade, ~15% slower fmax) | C7 | C7 | I4 (industrial, fast) |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | -40 C to +100 C (industrial) |
| Lifecycle Status | Obsolete | Obsolete (same die) | Obsolete | Obsolete | Obsolete | Last time buy / NRND (transition to Stratix IV GX) |
| Approx. Qty-1 Price (USD) | ~$185.00 | ~$190.00 (lead-free premium) | ~$165.00 | ~$120.00 | ~$125.00 | ~$450.00 |
关键差异点
- Highest logic count in the EP1SGX10 family with full transceiver count in same package （对比 EP1SGX10DF672C7N)
- Integrated 3.125 Gbps transceivers vs none （对比 EP1SGX10CF672C7)
- Drop-in compatible with Stratix II GX successor for migration path （对比 EP2SGX30DF672I4)
设计说明
The FBGA-672 package uses a 1.0 mm ball pitch on a 33 x 33 mm body, which requires microvia PCB technology (laser-drilled vias with 0.1 mm/0.2 mm capture pads) or via-in-pad construction. Standard 0.3 mm mechanical drills cannot achieve the required pad-to-pad pitch. Plan PCB stackup for at least 8 signal layers with stripline routing for high-speed transceiver channels; allocate dedicated ground reference planes beneath the TX/RX differential pairs. Decoupling must include 0402-size 0.1 uF X7R ceramics within 2 mm of each power ball, plus bulk 22 uF tantalum or polymer capacitors on each VCC/GND pair.
Transceiver channels must be routed as 100 ohm differential pairs with intra-pair skew below 1 ps (approximately 150 um length matching at FR4). Use microstrip with controlled impedance (Zo = 50 ohm single-ended, 100 ohm differential) on top layers and avoid crossing reference plane splits. The reference clock inputs (REFCLK_P/N) require 100 ohm differential routing and isolated from data lanes by at least 3H spacing (where H is dielectric height to nearest reference plane). Use IBIS-AMI models from Altera to validate channel loss budget before tape-out.
Estimated: at full utilization (10,570 LEs @ 70% toggle rate, all 20 transceivers active at 3.125 Gbps), the EP1SGX10DF672C7 dissipates approximately 6-9 W. With theta_JA of approximately 18 C / W on the FBGA-672 (typical per Stratix GX family datasheet), junction temperature rise above ambient is 108-162 C. Adequate airflow (200 LFM minimum) or a heatsink is required; do not operate continuously at maximum junction temperature. The package center-ball thermal pad must be soldered to a continuous copper pour on the top layer with thermal vias to inner ground planes.
Do not attempt to migrate from EP1SGX10DF672C7 to EP2SGX30DF672I4 without re-running full timing closure - the Stratix II architecture uses ALM (Adaptive Logic Module) instead of Stratix LE, so existing RTL must be re-synthesized. Configuration bitstreams are not compatible between Stratix and Stratix II families. JTAG chain order changes between packages - verify BSDL files before using boundary-scan. Finally, ensure that all transceiver channels that are NOT used have their TX pins tied to a known logic level and powered down via the Quartus II device configuration to reduce EMI and power consumption.
合规信息
EP1SGX10DF672C7 is the standard SnPb terminal finish variant; EP1SGX10DF672C7N is the Pb-free / RoHS-compliant variant. RoHS status not explicitly stated in the Verified Web Data excerpts - field set to 'unknown'. AEC-Q100 is not applicable for FPGAs operating in commercial temperature grade (0 C to 85 C).
