EP1SGX10DF672C7N - 10,570-Lane FPGA | Intel | High-Speed Systems
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Drop-in alternatives for EP1SGX10DF672C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1SGX10DF672C7
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View Datasheet →EP1SGX10DF672C7N Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array (FPGA) |
| Device Family | Stratix GX |
| Logic Cells | 10,570 cells |
| User I/O | 362 I/O |
| Logic Family | CMOS |
| Process Technology | 130 nm |
| Supply Voltage | 1.5 V |
| Package | 672-Ball FC-FBGA |
| Alternative Package Description | FBGA-1020 |
| Package Body | 33 mm x 33 mm |
| Ball Pitch | 1 mm |
| Listed Frequency Figure | 4,385.97 MHz |
| Operating Temperature | 0 C to 85 C |
| Mounting Type | Surface Mount |
| DigiKey Product Category | FPGAs (Field Programmable Gate Array) |
| RoHS Status | unknown |
| REACH Status | unknown |
| AEC-Q100 Status | not_applicable |
EP1SGX10DF672C7N 33 mm x 33 mm Pin Configuration Guide
Complete pinout information for EP1SGX10DF672C7N (33 mm x 33 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX10DF672C7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX10DF672C7N is suitable for 6 applications: Telecommunications Line Cards, Industrial Communication Controllers, Test and Measurement Equipment, Video and Imaging Aggregation, Storage Data-Path Controllers, Embedded Protocol Bridge.
Telecommunications Line Cards
EP1SGX10DF672C7N fits telecommunications line cards that need programmable protocol handling, data framing, and multiple external interfaces. Its 10,570 logic cells provide capacity for custom state machines, packet inspection, timing recovery support logic, and interface adaptation, while the listed 362 I/O can connect parallel control, status, memory, and transport signals. The Stratix GX family is intended for communication-oriented designs, making the device more relevant than a general-purpose CPLD when several functions must coexist. Engineers can place clock-domain crossing, buffers, and protocol-specific logic in one programmable device. Before layout, confirm the exact pin assignments, available I/O banks, high-speed lane resources, power rails, and supported configuration method from the family documentation; the supplied data does not provide a transceiver count or guaranteed line rate.
Recommended
Industrial Communication Controllers
EP1SGX10DF672C7N suits industrial controllers that combine deterministic hardware logic with several fieldbus, Ethernet-adjacent, or proprietary interfaces. The 10,570-cell resource level can implement real-time scheduling, protocol conversion, filtering, error detection, and control logic without relying entirely on processor software. Its 362 listed I/O help aggregate sensor inputs, actuator controls, status signals, and external memory or bridge devices, while programmability allows late interface changes during commissioning. A 1.5 V core supply is identified, but complete power domains and sequencing are unavailable here. Validate the 0 C to 85 C rating against the enclosure, conduction cooling, and measured board temperature. The BGA package also requires controlled impedance, escape routing, clean power, and manufacturer-approved thermal design.
Recommended
Test and Measurement Equipment
EP1SGX10DF672C7N can serve in test systems that acquire, generate, correlate, and route high-speed digital data. The 10,570 logic cells are appropriate for trigger logic, channel aggregation, data reduction, pattern generation, time stamping, and custom instrument interfaces, while 362 listed I/O support parallel ADCs, DACs, memory devices, and control ports. Reprogrammability allows the same hardware platform to support multiple test modes or product revisions, shortening redesign cycles. However, the supplied 4,385.97 MHz catalog figure is not supported by timing conditions and must not be used as a guaranteed sampling or clock rate. Use the exact speed-grade timing model and tool-generated reports. The 672-ball FC-FBGA package also demands careful power integrity, low-noise references, matched clock distribution, and measurement of signal margins at temperature.
Recommended
Video and Imaging Aggregation
EP1SGX10DF672C7N is a candidate for video routers, frame grabbers, and imaging systems that merge parallel sensor data with control and memory traffic. Its 10,570 logic cells can handle timing generation, synchronization, cropping, buffering control, region-of-interest processing, and interface conversion, while 362 I/O provide substantial connection capacity for image sensors, serializers, DDR-style memory interfaces, and host processors. FPGA parallelism can reduce latency compared with a software-only implementation, particularly when pixels or packets arrive continuously. Designers should budget logic for synchronization FIFOs and clock-domain isolation, and should verify I/O-bank support because BGA banks may restrict voltage standards. The 1 mm pitch and 33 mm package body simplify package planning but require a multilayer PCB, via escape review, decoupling analysis, and signal-integrity simulation for high-speed edges.
Recommended
Storage Data-Path Controllers
EP1SGX10DF672C7N can implement custom storage controllers, protocol bridges, redundancy managers, and real-time data-path monitoring. The 10,570-cell capacity allows simultaneous handling of queues, CRC logic, scrambling, command translation, error recovery, and host interfaces, while the 362-I/O listing can support multiple memory banks, control paths, and high-speed parallel links. Its reprogrammable architecture is valuable when evolving standards or customer-specific features would otherwise require an ASIC redesign. A switching converter cannot replace the FPGA; each required rail must satisfy the exact device voltage, current, ripple, sequencing, and transient requirements, none of which are fully listed in the supplied data. Validate I/O termination, bus timing, clock-domain crossing, and read/write margins with the selected memory or storage interface before release.
Recommended
Embedded Protocol Bridge
EP1SGX10DF672C7N fits an embedded protocol bridge when a system must translate streams between processors, peripheral controllers, legacy buses, and high-speed links. The 10,570 logic cells support FIFOs, rate matching, packetization, address decoding, error checking, and protocol state machines, while 362 I/O leave room for multiple masters, slaves, clocks, and service interfaces. A single FPGA can replace several fixed-function bridge devices and adapt when endpoint requirements change. The commercial 0 C to 85 C listing must be checked against the target product's ambient and self-heating conditions. Use the exact pin planner to reserve configuration, clock, power, and debug signals before assigning I/O. Validate throughput from the implemented design rather than the unqualified 4,385.97 MHz catalog field, and confirm configuration image compatibility in the legacy Quartus tool flow.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX10DF672C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX10DF672C7 | EP1SGX10DF672C6N | EP1SGX10DF672C5N | EP1SGX10DF672I6N |
|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Altera |
| Package | 672-Ball FC-FBGA | 672-Ball FC-FBGA | 672-Ball FC-FBGA | 672-Ball FC-FBGA | FBGA-672 |
| Device Family | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX |
| Logic Cells | 10,570 cells | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| User I/O | 362 I/O | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | 330 I/O |
| Supply Voltage | 1.5 V | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | 1.5 V |
| Ordering Grade | C7N | C7 | C6N | C5N | I6N |
| Cross-Reference Evidence | Target device | Same-family candidate; detailed comparison unavailable | Same-family candidate; detailed comparison unavailable | Same-family candidate; detailed comparison unavailable | Package and terminals stated consistent by web result |
Key Differentiators
- Higher listed I/O resource than the verified replacement candidate (vs EP1SGX10DF672I6N)
- C7N ordering designation within the target family (vs EP1SGX10DF672C6N)
- Commercial 0 C to 85 C operating listing (vs EP1SGX10DF672I6N)
Design Notes
Treat the listed 1.5 V value only as the confirmed nominal supply; the supplied data does not identify additional FPGA rail domains, tolerances, currents, ramp rates, or sequencing. Before schematic release, create a rail table from the exact Stratix GX family handbook, including core, I/O, auxiliary, and any transceiver supplies. Select regulators for worst-case transient load, not average utilization, and keep high-frequency ceramic decoupling adjacent to the package with bulk capacitance placed for effective current return. Validate power-up and power-down sequencing on hardware, because an out-of-sequence rail can cause configuration failure, I/O contention, or long-term reliability concerns.
Use 0 C to 85 C only as the listed ambient operating range, not as a substitute for a junction-temperature calculation. No thermal resistance, maximum junction temperature, or power-consumption data appears in the supplied sources. Estimate or simulate total dissipation from utilization, clock rate, toggle activity, I/O loading, and configuration, then compare it with the manufacturer package model and board copper. Measure temperatures on populated prototypes at maximum workload and airflow. For a 33 mm by 33 mm BGA, spreading copper, thermal vias, chassis conduction paths, and nearby heat sources can materially change the result; qualify the complete assembly rather than the FPGA alone.
Route the 672-ball FC-FBGA as a controlled-impedance multilayer design with continuous reference planes and a verified via-escape plan. Place decoupling capacitors as close as physically possible to their associated power balls and minimize shared inductance between regulator, capacitor, and package. Follow the exact package drawing for ball orientation and keep high-speed lanes away from clock, power-entry, and board-edge discontinuities. Assign signal pins only through the exact device and package in Quartus, then review simultaneous-switching noise, I/O-bank voltage compatibility, differential-pair geometry, and return-path continuity. A generic FBGA footprint or pinout from another speed grade must not be used.
Do not interpret the 4,385.97 MHz catalog figure as a guaranteed operating frequency because the supplied data provides no condition, timing grade, or measurement definition. Do not infer a 672-ball pinout from a 672-pin label, and do not assume FBGA-1020 means 1,020 external signals; the verified comparison shows that package nomenclature varies by source. Similarly, a matching FC-FBGA package does not prove compatible rails, I/O banks, configuration modes, timing, or firmware. Before substituting a C5, C6, C7, or I6 ordering code, compare the manufacturer ordering guide, exact pin map, speed-grade tables, temperature rating, and power requirements. Unverified package-only candidates are not production drop-ins.
Compliance Information
The verified web data does not provide RoHS, REACH, lead-free, halogen-free, or conflict-minerals statements. AEC-Q100 is treated as not applicable to this general-purpose FPGA because the supplied data contains no automotive qualification claim; this is not a compliance certification.
