EP1SGX10DF672C6N - Stratix GX FPGA, 10K LE, 672-FBGA | Altera
MPN: EP1SGX10DF672C6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $295 | $295.00 |
| 10 | $268 | $2,680.00 |
| 100 | $238 | $23,800.00 |
| 500 | $215 | $107,500.00 |
| 1,000 | $195 | $195,000.00 |
Drop-in alternatives for EP1SGX10DF672C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1SGX10CF672C6N
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View Datasheet →EP1SGX10DF672C6N Maximum Ratings & Electrical Characteristics
| Manufacturer | Altera (Intel) |
| Series | Stratix GX |
| Family | Stratix GX |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Cells | 10,570 |
| Configurable Logic Blocks (CLBs) | 1,200 |
| Total RAM Bits | 920,448 |
| Maximum User I/Os | 362 |
| Supply Voltage (Core) | 1.425 V to 1.575 V (1.5 V nominal) |
| Logic Family | CMOS |
| Package Type | 672-FBGA (FineLine BGA, 27 × 27 mm, 1 mm pitch) |
| Number of Pins | 672 |
| Mounting Type | Surface Mount |
| Operating Temperature (Commercial) | 0 °C to +85 °C |
| Transceivers | Up to 20 high-speed serial channels |
EP1SGX10DF672C6N 672-fbga (fineline bga, 27 × 27 mm, 1 mm pitch) Pin Configuration Guide
Complete pinout information for EP1SGX10DF672C6N (672-fbga (fineline bga, 27 × 27 mm, 1 mm pitch) package) with 672 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX10DF672C6N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 672 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX10DF672C6N is suitable for 6 applications: Custom Protocol Bridging ASIC Prototyping, Telecom Backplane Aggregation, Broadcast Video Processing, Industrial High-Speed Data Acquisition, Legacy PCI Express Endpoint / Root Complex Prototyping, ASIC Emulation and Prototyping.
Custom Protocol Bridging ASIC Prototyping
The EP1SGX10DF672C6N's 20 integrated multi-gigabit transceivers and 10,570 logic cells make it well suited for prototyping custom serial-protocol bridges that later migrate to an ASIC. Engineers can implement PHY-layer state machines, link training, and adaptation logic directly in FPGA fabric, replacing the typical ASSP-plus-FPGA two-chip approach with a single device. With 920 Kbits of embedded RAM and dedicated DSP blocks, the device sustains line-rate processing for protocols such as Serial RapidIO, XAUI, and proprietary backplane SerDes. The 672-FBGA package provides ample I/O for parallel side-band signals alongside the serial lanes, which is critical when bridging between mismatched clock domains.
Recommended
Telecom Backplane Aggregation
The EP1SGX10DF672C6N is widely deployed in telecom aggregation line cards that need to terminate many high-speed serial links from a backplane while performing framing, deframing, and traffic shaping. Its 20 transceiver channels at multi-gigabit rates map directly to typical backplane lane counts, and the 362 user I/Os handle parallel fabric interfaces to network processors. The 1.5 V core plus bank-selectable VCCIO rails let designers mix 1.5 V, 1.8 V, 2.5 V, and 3.3 V I/O without external level shifters. Stratix GX vertical migration within the 672-FBGA footprint enables density upgrades without board rework.
Recommended
Broadcast Video Processing
Broadcast video processing systems often require real-time pixel-rate manipulation such as color-space conversion, scaling, de-interlacing, and overlay compositing. The EP1SGX10DF672C6N's embedded DSP blocks and 920 Kbits of block RAM deliver the throughput needed for SD-SDI, HD-SDI, and 3G-SDI pipelines, while 362 user I/Os accept parallel video buses from external decoders. Designers commonly implement multiple independent video pipelines in a single device, taking advantage of the deterministic latency and parallel architecture versus general-purpose CPUs.
Recommended
Industrial High-Speed Data Acquisition
In high-channel-count industrial test, scientific instrumentation, and radar front-ends, the EP1SGX10DF672C6N's combination of 20 serial transceivers and large logic capacity lets designers build multi-channel digitizer aggregation in a single chip. Each transceiver lane can carry digitized IF data from an ADC across a backplane to a host processor, eliminating parallel LVDS routing that would otherwise consume hundreds of pins. The 1.5 V core supply and commercial 0 to 85 °C operating range suit controlled-environment test racks and laboratory instrumentation.
Recommended
Legacy PCI Express Endpoint / Root Complex Prototyping
Engineers historically used the EP1SGX10DF672C6N to prototype PCI Express Gen1 endpoints and root complexes because its transceivers directly drive the PCIe physical layer. The Stratix GX hard IP block plus fabric logic implement transaction, data link, and physical layers with deterministic latency, while the 672-FBGA package exposes enough I/O for auxiliary control and status signals. Although newer Cyclone and Stratix families are recommended for new designs, the EP1SGX10DF672C6N remains a viable platform for sustaining legacy PCIe Gen1 test fixtures.
Recommended
ASIC Emulation and Prototyping
With 10,570 logic cells and 920 Kbits of embedded RAM, the EP1SGX10DF672C6N is large enough to emulate mid-complexity ASIC RTL blocks for verification and early software development before tape-out. The 672-FBGA package exposes 362 user I/Os for chip-to-chip bridging on multi-FPGA emulation boards, and the 1.5 V core allows relatively straightforward power-tree design. Designers chain multiple Stratix GX devices together using the high-speed transceivers to share clocks and trace data across the emulation array, accelerating pre-silicon validation cycles.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX10DF672C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX10CF672C6N | EP1SGX10DF672C5N | EP1SGX10DF672C7N | EP1SGX10CF672C6 | EP1SGX10CF672C7N | EP1SGX10CF672C7 |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera | Altera | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 672-FBGA (27x27, 1mm pitch) | 672-FBGA (27x27, 1mm pitch) - same | 672-FBGA (27x27, 1mm pitch) - same | 672-FBGA (27x27, 1mm pitch) - same | 672-FBGA (27x27, 1mm pitch) - same | 672-FBGA (27x27, 1mm pitch) - same | 672-FBGA (27x27, 1mm pitch) - same |
| Logic Cells | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 |
| Total RAM Bits | 920,448 | 920,448 | 920,448 | 920,448 | 920,448 | 920,448 | 920,448 |
| Speed Grade | C6 | C6 | C5 (slower) | C7 (faster) | C6 | C7 (faster) | C7 (faster) |
| Core Voltage | 1.5 V (1.425 V - 1.575 V) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C |
| Maximum User I/Os | 362 | 362 | 362 | 362 | 362 | 362 | 362 |
Key Differentiators
- 20 integrated multi-gigabit transceivers in a 672-FBGA package (vs EP1SGX10CF672C6N)
- Stratix GX vertical-migration pin-compatible package (vs EP1SGX10DF672C5N)
- Faster C7 speed grade for timing-margin critical designs (vs EP1SGX10DF672C7N)
Design Notes
The 672-FBGA package concentrates heat under the central die region. At full transceiver utilization (20 lanes at multi-gigabit rates) the device can exceed 5–8 W of dissipation. Provide at least four thermal vias per thermal pad ball and connect them to inner-plane copper pours to spread heat. Designers targeting production deployment should measure the case temperature under worst-case traffic to verify the 85 °C commercial limit. Estimated: at 6 W dissipation with 4-layer FR-4 and no heatsink, the junction can approach the operating limit; a small clip-on heatsink is recommended for sustained full-load operation.
Use the Stratix GX vertical-migration pin tables to keep the 672-FBGA footprint reusable across densities in the family. Route all 20 high-speed transceiver lanes with controlled 100 Ω differential impedance, length-matched within the tolerance specified in the Stratix GX handbook. Place AC-coupling capacitors for each transceiver lane within 1 cm of the corresponding BGA ball; their placement is mandatory because the on-chip transceivers expect AC-coupled inputs. Decouple every VCC and VCCIO pin with a 0.1 µF plus 10 µF combination placed as close as BGA fanout allows.
Do not assume the EP1SGX10DF672C6N can be hot-swapped on a board designed for the EP1SGX10CF672C6N without verifying JTAG IDs and configuration bitstream compatibility. Altera/Intel Stratix GX devices use SRAM configuration, so an unprogrammed device will not boot on its own - always include a configuration memory (EPCS or compatible) on the schematic. Also note that obsolete part stock often carries older date codes that may not match the latest Quartus II supported-device database, which can complicate programming-file generation.
Compliance Information
RoHS/REACH/lead-free status not explicitly stated in the provided web data for this obsolete part. Original Altera Stratix GX family shipped before RoHS was widely enforced; later date codes (post-2006) typically carry lead-free ball finish. Compliance should be verified per specific lot date code with the supplier.
