EP20K1500CF33C7ES - APEX20K 1.5M Gates FPGA 1020-BGA | Intel
料号： EP20K1500CF33C7ES ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198 | $19,800.00 |
| 500 | $162 | $81,000.00 |
| 1,000 | $138 | $138,000.00 |
EP20K1500CF33C7ES 概述
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose logic function is defined by the user after manufacture, rather than at the fab. FPGAs sit hierarchically between ASICs (high NRE, fixed function) and CPLDs (lower density, fixed interconnect), and are commonly classified by LUT count, DSP block count, and on-chip memory. The APEX20K family from Intel/Altera is an early-generation SRAM-based LUT architecture that combines fine-grained logic with embedded memory blocks (ESBs), making it suitable for data-path, glue-logic, and DSP-style designs of its era.
Key features of the EP20K1500CF33C7ES include 51,840 logic elements/cells, embedded system blocks (ESBs) for on-chip RAM, up to 808 user I/O pins, in-system programmability via JTAG, and support for LVTTL, LVCMOS, PCI, and other I/O standards via Altera's Quartus II / MAX+PLUS II toolchain. The device also includes dedicated clock management circuits and a high-speed interconnect fabric (MultiTrack interconnect) for predictable timing closure across wide datapaths.
The EP20K1500CF33C7ES utilizes a 0.18 µm CMOS SRAM process with 4-input LUTs and a hierarchical routing architecture, achieving typical internal clock rates of 100-180 MHz depending on design complexity. The embedded system blocks (ESBs) provide true dual-port RAM with parity, supporting FIFO and register-file patterns. Multiple I/O banks allow mixed-voltage interfacing across 2.5V, 3.3V, and 5V-tolerant buses.
Typical applications include telecommunications infrastructure, industrial automation controllers, ASIC prototyping, high-speed datapath design, custom DSP engines, and legacy system upgrades where high gate count and abundant I/O are required. The 1020-BGA package supports high-density board layouts and is suited to multi-layer PCBs.
When designing with this device, ensure the Quartus II design tool version supports the APEX20K family and that the 1020-ball BGA layout is matched to compatible footprint/IP. Plan power sequencing for the 2.5V VCCINT and 3.3V VCCIO rails to avoid I/O bus contention during configuration.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the EP20K1500CF33C7ES not found in the manufacturer datasheet alone.
直接替换替代料： EP20K1500CF33C7ES ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP20K1500CF33C7ES （相同外形与封装尺寸） ——差异在于 Series, Speed Grade, Operating Temperature, Family, Package / Case.
快速对比工具——选择替代料号进行并排对比：
EP20K1500CF33C7
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$205 / 个
查看数据手册 →EP20K1500CB652C7ES
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$198.4 / 个
查看数据手册 →EP20K1500CF33C7ES 最大额定值与电气特性
| Family | APEX20K |
| Series | APEX 20K |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements / Cells | 51840 |
| Number of I/O | 808 |
| Number of Gates | 1500000 |
| Voltage - Supply | 2.5V core, 3.3V I/O |
| 工作温度 | 0C to +85C (commercial) |
| 安装类型 | Surface Mount |
| 封装 / 外壳 | 1020-BBGA, FCBGA (FineLine BGA) |
| Supplier Device Package | 1020-BGA |
| Programmable Type | In System Programmable (SRAM-based) |
| Configuration Method | SRAM / JTAG |
| I/O Standards | LVTTL, LVCMOS, PCI, GTL, SSTL |
EP20K1500CF33C7ES 1020-bga 引脚配置指南
EP20K1500CF33C7ES（1020-bga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP20K1500CF33C7ES.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP20K1500CF33C7ES 适用于 6 应用s: Telecommunications Infrastructure, ASIC Prototyping, High-Speed Datapath / DSP Engine, Industrial Automation Controllers, Custom Glue Logic & Bus Bridging, Legacy System Upgrade / End-of-Life Replacement.
Telecommunications Infrastructure
The EP20K1500CF33C7ES's 51,840 logic elements and 1.5M system gates, combined with 808 user I/Os, suit it to telecom line-card designs where multiple interface standards (LVTTL, LVCMOS, PCI) and abundant glue logic must coexist. Placed on the backplane interface card, it bridges bus conversions, packet inspection, and timing/clock distribution. Unlike smaller CPLDs, the high gate count absorbs datapath-wide state machines and protocol engines in a single device; the trade-off is high core power and a large 1020-BGA footprint requiring dense PCB routing. Designers should budget thermal headroom for sustained switching activity.
推荐
ASIC Prototyping
The EP20K1500CF33C7ES is widely used as an ASIC prototype platform because its 1.5M system gates and abundant I/O (808 pins) can mimic complex ASICs while remaining reprogrammable. Engineers map RTL directly onto the FPGA fabric and verify functionality, timing, and I/O behavior before committing to silicon. The 1020-BGA package supports breakout boards for multi-FPGA partitioning of very large ASICs. The trade-off is internal clock rates around 100-180 MHz, well below ASIC speeds, but the iterative turnaround is far faster than an ASIC respin.
推荐
High-Speed Datapath / DSP Engine
The APEX20K's embedded system blocks (ESBs) provide true dual-port RAM with parity, ideal for datapath register files, FIFOs, and DSP coefficient storage. The EP20K1500CF33C7ES implements pipelined multipliers, FIR filters, and FFT butterflies with the 51,840 logic elements handling control and arithmetic, while ESBs hold coefficients and delay lines. The 808 user I/Os sustain wide parallel datapaths (32-64 bit) without external muxing. The trade-off versus modern DSP-capable FPGAs (Stratix/Cyclone with hard DSP blocks) is that all DSP is fabric-implemented, limiting fmax.
推荐
Industrial Automation Controllers
The EP20K1500CF33C7ES's high logic density and abundant I/O (808 pins) suit complex industrial controllers driving multiple servos, sensors, and fieldbuses. The 2.5V core / 3.3V I/O supplies interface directly to legacy 3.3V industrial buses (LVCMOS, PCI). The SRAM-based configuration allows field updates via JTAG, valuable for in-situ firmware revisions. The trade-off is the commercial 0C-85C temperature grade; for harsh industrial environments above 85C, a -1 speed grade or different package variant may be required. MultiTrack interconnect provides predictable timing for deterministic control loops.
推荐
Custom Glue Logic & Bus Bridging
The EP20K1500CF33C7ES's 808 user I/Os and multi-standard I/O support (LVTTL, LVCMOS, PCI, GTL, SSTL) make it a powerful bus-bridging and glue-logic solution. Designers terminate and adapt multiple buses (PCI, VME, custom parallel) in a single chip, with the 51,840 logic elements absorbing state machines, FIFOs, and protocol converters. The 1020-BGA package supports high pin density on multi-layer backplanes. The trade-off is large board area and the obsolete lifecycle; new designs targeting the same use case should evaluate Cyclone IV E or similar modern Intel FPGAs.
推荐
Legacy System Upgrade / End-of-Life Replacement
Many industrial, military, and aerospace systems designed in the early 2000s use APEX20K family FPGAs like the EP20K1500CF33C7ES. While obsolete, the part supports long-life field upgrades via JTAG reprogramming when channel stock is still available. Engineers should source the EP20K1500CF33C7ES from authorized distributors with warranty and traceability. The trade-off is rising price due to scarcity and the eventual need for board-level redesign with a current-generation FPGA. Use this part only for in-system firmware updates or low-volume repairs.
推荐
推荐产品汇总
工程参考数据： EP20K1500CF33C7ES ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP20K1500CF33C7 | EP20K1500CB652C7ES |
|---|---|---|---|
| Brand | Intel | Intel | Intel |
| Package | 1020-BGA (FineLine) | 1020-BGA (FineLine) - same | 652-BGA - different, NOT drop-in |
| Logic Elements | 51840 | 51840 | 51840 |
| System Gates | 1.5M | 1.5M | 1.5M |
| User I/O | 808 | 808 | 488 (fewer pins in 652-BGA) |
| Core Voltage | 2.5V | 2.5V | 2.5V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete |
关键差异点
- High-density APEX20K1500 with 808 user I/Os （对比 EP20K1500CB652C7ES)
- Closest same-die drop-in within 1020-BGA （对比 EP20K1500CF33C7)
设计说明
The 1020-ball FineLine BGA package requires multi-layer PCB routing with microvia or via-in-pad technology for breakout. Use a controlled-impedance stackup for high-speed I/O and ensure the JTAG pins (TCK, TMS, TDI, TDO) are brought out to a header for in-system programming. Follow Intel's APEX20K BGA footprint reference for land pattern, mask, and paste layers.
Estimated: at 100 MHz internal toggle with typical APEX20K1500 utilization, expect core current draw in the 1.5-3 A range from the 2.5V VCCINT rail. Use a low-noise LDO (e.g. TPS7A4701 or equivalent) and place decoupling capacitors (10 uF bulk + 0.1 uF + 0.01 uF) within 5 mm of every supply pin. Power-sequence VCCINT before VCCIO to prevent I/O bus contention during SRAM configuration.
Because the EP20K1500CF33C7ES is SRAM-based, the configuration bitstream is lost at power-down. Add a configuration EPROM (e.g. EPC2 or compatible) on the board for automatic load, or use a microcontroller to drive JTAG at boot. Do not assume the device retains its design without persistent storage. Also verify Quartus II (not Quartus Prime) is used for compilation, as newer tools do not support APEX20K.
合规信息
Compliance data not present in verified web data. The APEX20K family predates widespread RoHS-REACH harmonization; older date codes may not be RoHS compliant. Confirm with distributor or Intel legacy documentation before assuming compliance for new designs.
