EP20K1500CF33C7 - APEX 20KC FPGA, 1.5M Gates, 1020-BBGA | Intel
料号： EP20K1500CF33C7 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $265 | $2,650.00 |
| 50 | $245 | $12,250.00 |
| 100 | $225 | $22,500.00 |
| 500 | $205 | $102,500.00 |
EP20K1500CF33C7 概述
An FPGA (Field-Programmable Gate Array) is a reconfigurable digital integrated circuit whose logic functions and interconnects are defined by a user-loaded configuration bitstream rather than at wafer fab time. APEX 20KC devices sit in the broader taxonomy of programmable logic devices (PLD) -> CPLD/FPGA -> SRAM-based FPGA -> high-density logic + embedded memory. They are widely deployed in glue-logic, bus-bridging, DSP pre-processing, and high-speed data-path roles where discrete gate arrays would be uneconomical.
Key features of the EP20K1500CF33C7 include 51,840 logic elements with embedded system blocks (ESBs) providing dual-port RAM, ROM, and CAM, multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+, LVDS) on the 1020-BBGA package, dedicated clock management circuitry with up to four phase-locked loops, and a 1.8V core supply with separate VCCIO rails for I/O bank voltage selection. The -7 speed grade delivers the fastest commercial timing for the APEX 20KC family.
The APEX 20KC architecture combines a MultiCore architecture with a continuous interconnect hierarchy, enabling predictable timing closure across large designs. Embedded system blocks (ESBs) deliver true dual-port RAM up to 32K x 36 bits per block, allowing designers to instantiate memory, FIFOs, and content-addressable memory without sacrificing logic capacity. The 1020-BBGA package exposes up to 808 user I/Os, supporting high pin-count bridging applications.
Typical applications include high-speed telecommunications backplanes, video broadcast and image processing pipelines, ASIC prototyping and emulation, industrial control and instrumentation, and PCI/CompactPCI interface bridging. The combination of high logic density and embedded memory makes the EP20K1500CF33C7 a strong fit for designs that previously required multiple smaller FPGAs.
When designing with this device, ensure that the Quartus II (or legacy MAX+PLUS II) toolchain is available, as later Quartus versions have dropped APEX 20KC support. Plan for a robust 1.8V core supply with adequate bulk decoupling, and verify signal-integrity on LVDS pairs given the large 1020-ball BGA fan-out.
This page synthesizes distributor stock levels, drop-in alternatives in the same APEX 20KC family, and practical design considerations not found in the legacy datasheet alone.
直接替换替代料： EP20K1500CF33C7 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP20K1500CF33C7 （相同外形与封装尺寸） ——差异在于 Series, Speed Grade, Family, Package / Case, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
EP20K1500CF33C8
✅ 直接替换✓ 有现货
$1090 / 个
查看数据手册 →EP20K1500CF33C7ES
✅ 直接替换✓ 有现货
$138 / 个
查看数据手册 →EP20K1500CF33I7
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP20K1500CF33I8
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP20K1500CB652C7ES
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$198.4 / 个
查看数据手册 →EP20K1500CB652C8ES
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$205 / 个
查看数据手册 →EP20K1500CF33C7 最大额定值与电气特性
| Family | APEX 20KC |
| Series | APEX 20KC |
| Logic Elements / Cells | 51840 |
| Number of Registers | 51840 |
| Total RAM Bits | 442368 |
| Number of Gates | 1500000 |
| Supply Voltage - Core | 1.8 V |
| Supply Voltage - I/O | 1.5 V to 3.3 V (bank-dependent) |
| Speed Grade | -7 (fastest commercial) |
| 工作温度 | 0C to +85C (commercial) |
| 封装 / 外壳 | 1020-BBGA (FineLine BGA) |
| 安装类型 | Surface Mount |
| Configuration Technology | SRAM (volatile, reprogrammable) |
| Embedded Memory | ESB dual-port RAM up to 32K x 36 bits/block |
| PLL Count | Up to 4 |
| LVDS Support | Yes |
EP20K1500CF33C7 1020-bbga (fineline bga) 引脚配置指南
EP20K1500CF33C7（1020-bbga (fineline bga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP20K1500CF33C7.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP20K1500CF33C7 适用于 7 应用s: Telecommunications Backplane Bridging, ASIC Prototyping and Emulation, Video Broadcast and Image Processing, Industrial Control and Instrumentation, PCI/CompactPCI Interface Bridging, DSP Pre-Processing and Co-Processing, Legacy System Sustainment and Field Upgrades.
Telecommunications Backplane Bridging
The EP20K1500CF33C7 fits telecom backplane bridging because its 51,840 logic elements and 442,368 bits of embedded memory can simultaneously implement multiple bus standards (PCI, GTL+, LVDS) required to interface legacy TDM framers with modern packet processors. The 1020-BBGA package exposes up to 808 user I/Os, enough to handle multi-channel STS-1/STM-1 framers alongside 10/100 Ethernet MAC bridges. With four PLLs and the -7 speed grade, designers can generate multiple independent clocks for TDM, Ethernet, and system backplane domains without external clock buffers. Compared to using multiple smaller FPGAs, the EP20K1500CF33C7 reduces board area and BOM cost while simplifying timing closure across protocol boundaries. The APEX 20KC architecture's MultiCore interconnect hierarchy delivers predictable timing for backplane nets with controlled-impedance routing.
推荐
ASIC Prototyping and Emulation
The EP20K1500CF33C7 serves as an ASIC prototyping platform because its 1.5 million gates of logic capacity can hold large ASIC netlists partitioned across the MultiCore architecture. The embedded system blocks (ESBs) provide true dual-port RAM up to 32K x 36 bits per block, allowing ASIC RAMs to be mapped directly without consuming logic resources. Designers can validate register-transfer-level (RTL) code at near-ASIC speeds using the -7 speed grade timing, then port verified designs to mask-programmed gate arrays. The 1020-BBGA package supports high probe-pin counts for emulation logic analyzers. Note that modern ASIC prototypes should consider Stratix IV/V or Cyclone V because Intel Quartus has dropped APEX 20KC support; the EP20K1500CF33C7 remains useful only with MAX+PLUS II or legacy Quartus II 6.0/6.1 toolchains.
推荐
Video Broadcast and Image Processing
The EP20K1500CF33C7 suits video broadcast and image-processing designs because its 442,368 embedded memory bits can hold multiple frame buffers for SD/HD video pipelines, while the 51,840 logic elements implement real-time filtering, scaling, and format conversion. LVDS support on the 1020-BBGA package enables direct connection to high-speed digital video serializers and deserializers common in broadcast equipment. The four PLLs allow independent pixel-clock generation for input capture, processing, and output stages, eliminating external clock generator chips. The APEX 20KC's MultiCore architecture supports pipelined DSP functions at the -7 speed grade, suitable for HD-SDI and DVB-ASI streams. Engineers targeting broadcast applications should note that the EP20K1500CF33C7 is obsolete, so new designs should evaluate Cyclone IV E or Stratix IV GX families with current Quartus support.
推荐
Industrial Control and Instrumentation
The EP20K1500CF33C7 is used in industrial control because its 1.8V core and multi-standard I/O banks (LVTTL, LVCMOS, PCI, GTL+) can interface directly to legacy 5V and modern 3.3V industrial buses without level translators. The 442,368 embedded memory bits support real-time control loops with large lookup tables for sensor calibration and PID compensation. Up to four PLLs provide deterministic clock generation for motor control PWM, encoder feedback, and fieldbus synchronization (Profibus, DeviceNet, CAN). The 1020-BBGA package is ruggedized for industrial vibration and thermal environments. For industrial-temperature applications, select the EP20K1500CF33I7 variant (-40C to +100C) instead. Designers should verify supply longevity and use the EP20K1500CF33C7 only in legacy systems with proven APEX 20KC firmware support.
推荐
PCI/CompactPCI Interface Bridging
The EP20K1500CF33C7 bridges PCI/CompactPCI buses because its PCI-compliant I/O banks and 51,840 logic elements can implement master/target PCI cores with DMA engines and interrupt controllers. The 442,368 embedded memory bits support scatter-gather descriptor tables and FIFO buffers for high-throughput packet or block transfers. Up to 808 user I/Os on the 1020-BBGA package expose multiple PCI segments, allowing the device to bridge between CompactPCI backplanes and local processor buses. The -7 speed grade meets 33 MHz and 66 MHz PCI timing budgets with margin. The APEX 20KC family includes reference designs for PCI 32/64 and PCI-X, accelerating development. New designs should migrate to Cyclone IV GX with PCIe hard IP, since the EP20K1500CF33C7 requires soft IP cores for PCI.
推荐
DSP Pre-Processing and Co-Processing
The EP20K1500CF33C7 serves as a DSP pre-processor because its 51,840 logic elements can implement multiple FIR/IIR filter channels in parallel, offloading the host DSP. The 442,368 embedded memory bits support sample buffering and coefficient tables for adaptive filters; the four PLLs generate sample clocks independent of the host processor clock. LVDS I/O on the 1020-BBGA package enables direct connection to high-speed ADCs and DACs in radar, sonar, and software-defined radio front-ends. The APEX 20KC MultiCore architecture delivers predictable timing closure for high-sample-rate pipelines. Note that the -7 speed grade is suitable for moderate DSP workloads; for higher-rate FFTs and complex modulation, consider modern Stratix V or Cyclone V DSP-enhanced families with dedicated DSP blocks.
推荐
Legacy System Sustainment and Field Upgrades
The EP20K1500CF33C7 is procured primarily for legacy system sustainment because the APEX 20KC family is obsolete and Intel/Altera no longer manufactures these devices. Fielded systems in telecommunications, industrial automation, and defense rely on the EP20K1500CF33C7 for spare-part replacement, firmware updates, and incremental capacity additions where redesign is uneconomical. Distributors such as Heisener, ABC Semiconductor, and Jotrin Electronics list inventory in the 5,000-8,000-piece range, supporting bridge-buy and aftermarket demand. For new designs, engineers should migrate to Cyclone IV or Stratix IV families with current Quartus toolchain support. When sourcing, verify authenticity with X-ray or decapsulation inspection because obsolete FPGAs are common counterfeit targets.
推荐
推荐产品汇总
工程参考数据： EP20K1500CF33C7 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP20K1500CF33C8 | EP20K1500CF33C7ES | EP20K1500CF33I7 | EP20K1500CF33I8 | EP20K1500CB652C7ES | EP20K1500CB652C8ES |
|---|---|---|---|---|---|---|---|
| Package | 1020-BBGA (FineLine BGA) | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 652-BGA - different footprint | 652-BGA - different footprint |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC |
| Logic Elements | 51840 | 51840 | 51840 | 51840 | 51840 | 51840 | 51840 |
| Total Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M |
| Speed Grade | -7 (fastest commercial) | -8 (slower) | -7 (same) | -7 industrial | -8 industrial | -7 (same) | -8 (slower) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +100C industrial | -40C to +100C industrial | 0C to +85C | 0C to +85C |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
关键差异点
- Fastest commercial speed grade in the APEX 20KC family （对比 EP20K1500CF33C8)
- Industrial temperature range option in same package （对比 EP20K1500CF33I7)
- Highest logic density APEX 20KC with 808 user I/Os （对比 EP20K1000CF33C7)
设计说明
Estimated: at a typical APEX 20KC core current of approximately 1.5 A at 1.8 V plus I/O bank current, design a 1.8V regulator rated for at least 3 A continuous with 100 mV peak-to-peak ripple. Use a 4-layer PCB with a dedicated 1.8V plane and place 10uF tantalum plus 0.1uF ceramic decoupling within 5 mm of every VCCINT pin. For VCCIO banks, route separate 1.5V/2.5V/3.3V supplies per bank and decouple identically; mixing VCCIO rails without proper sequencing can cause I/O latch-up during power-up.
The 1020-ball FineLine BGA has a 1.27 mm pitch - route all signals on inner layers with 0.1 mm trace/space and use microvia or via-in-pad technology for breakout. Provide a continuous ground plane on layer 2 directly beneath the BGA and stitch the perimeter with ground vias every 1 mm. For LVDS pairs, maintain 100 ohm differential impedance and skew-match within 10 ps; LVDS reference clock traces should be length-matched to within 50 ps across all PLL inputs. The BGA requires X-ray inspection post-reflow because solder joints are hidden beneath the package.
The APEX 20KC family is obsolete and Intel/Altera no longer supports it in Quartus versions newer than 6.1. Before committing to a new design, verify that the MAX+PLUS II or Quartus II 6.0/6.1 toolchain is available locally with valid licenses. Counterfeit risk is high for obsolete FPGAs - source from reputable distributors such as Heisener, ABC Semiconductor, or XAIPART with traceability documentation. If migrating to a current family, do NOT assume pin compatibility between 1020-BBGA and 652-BGA variants - the ball maps differ and require new PCB layout.
Estimated: the 1020-BBGA package has a theta_JA of approximately 18 C/W with a properly designed 4-layer PCB and adequate ground plane. At a 5 W typical dissipation, junction temperature rises 90C above ambient; at 85C ambient the device approaches its 125C junction limit. For high-utilization designs with sustained logic activity, add thermal vias beneath the BGA thermal pad and consider a heatsink for industrial-temperature (-40C to +100C) variants. Always measure junction temperature in-system with the on-die diode rather than relying on calculated estimates alone.
合规信息
RoHS and lead-free compliance data not available in the verified web data. APEX 20KC family predates current Intel/Altera compliance documentation standards. AEC-Q100 is not applicable for FPGAs.