EP20K1000CF672C7 - 1M Gate APEX 20KC FPGA 508 I/O FC-FBGA | Intel
料号： EP20K1000CF672C7 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198 | $19,800.00 |
| 250 | $175 | $43,750.00 |
| 500 | $158 | $79,000.00 |
EP20K1000CF672C7 概述
An FPGA is a programmable logic device (PLD) that integrates configurable logic blocks (LEs), embedded memory (CAM/ROM/RAM), routing channels, and I/O elements on a single die. Within the programmable-logic taxonomy, FPGAs sit above simple PLDs (SPLDs/CPLDs) and below ASICs in NRE cost, and APEX 20KC represents Intel/Altera's high-density, multi-core, embedded-memory programmable logic family introduced in the early 2000s. The APEX 20KC family supports up to 1 M gates, embedded CAM blocks, LVDS I/O, and 1.8 V low-voltage operation.
Key features of the EP20K1000CF672C7 include 38400 logic cells/elements, 1 M system gates, embedded array blocks (EABs) for memory and DSP-style functions, four phase-locked loops (PLLs) for clock management, multi-voltage I/O standards (LVTTL, LVCMOS, PCI, LVDS, GTL+, SSTL-2/3, HSTL), in-system programmability via the passive serial, JTAG (IEEE 1149.1), and Altera Fast Passive Parallel configuration interfaces, and a JunctionLink technology that doubles performance versus the prior APEX 20KE generation. The C7 speed grade offers the fastest timing in the family.
The 0.15 µm copper-metal process permits 35% faster design performance than APEX 20KE devices at lower dynamic power per toggle. Each EAB block provides up to 4096 bits of dual-port or single-port RAM plus content-addressable memory functionality for high-speed table lookup. The 672-pin FC-FBGA package (45 × 45 mm, 1.27 mm ball pitch) supports the largest I/O count in the APEX 20KC family and is required when 488/508 user I/O pins are needed.
Typical applications include telecommunications line cards, ASIC prototyping and emulation, high-speed data path processing, glue logic for DSP/microprocessor-based systems, industrial machine control, and military/aerospace embedded computing. The device is well-suited to designs requiring hundreds of I/O with moderate-to-high logic density.
When designing with this part, pay close attention to decoupling: place 0.1 µF and 0.01 µF ceramics on every VCCINT/VCCIO pin with a 4-layer PCB at minimum. Because this is an obsolete Intel/Altera product, lead-time and second-source strategies should be evaluated up front. The C7 speed grade is the fastest bin; slower C8/C9 bins exist for cost reduction.
This page synthesizes datasheet specifications, distributor pricing, pin-compatible same-family alternatives, and practical design notes not collected in the manufacturer datasheet alone.
直接替换替代料： EP20K1000CF672C7 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP20K1000CF672C7 （相同外形与封装尺寸） ——差异在于 Package, Process Technology, Operating Temperature, Speed Grade, Configuration Interface.
快速对比工具——选择替代料号进行并排对比：
EP20K1000EFC672-2X
✅ 直接替换📋 参考替代料（不在目录中）
EP20K1000CF672C8
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$245.09 / 个
查看数据手册 →EP20K1000CF672C9
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP20K1000CF672C7 最大额定值与电气特性
| Family | APEX 20KC |
| Device Type | FPGA (Field Programmable Gate Array) |
| System Gates | 1,000,000 (typical) |
| Logic Elements / Cells | 38400 |
| Maximum Internal Frequency | 375.94 MHz |
| Propagation Delay | 1.6 ns (typical) |
| Process Technology | 0.15 µm all-layer copper CMOS |
| Core Supply Voltage | 1.8 V |
| User I/O Count | 488 (some sources list 508) |
| 封装 | 672-ball FC-FBGA (45 × 45 mm, 1.27 mm pitch) |
| 安装类型 | Surface Mount |
| 工作温度 | 0 °C to +85 °C (commercial, C suffix) |
| Speed Grade | C7 (fastest) |
| Embedded Memory (EAB) | Embedded array blocks (RAM/CAM/ROM) |
| PLL Count | 4 |
| Configuration Interface | Passive Serial, JTAG (IEEE 1149.1), Fast Passive Parallel |
EP20K1000CF672C7 672-ball fc-fbga (45 × 45 mm, 1.27 mm pitch) 引脚配置指南
EP20K1000CF672C7（672-ball fc-fbga (45 × 45 mm, 1.27 mm pitch) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP20K1000CF672C7.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP20K1000CF672C7 适用于 6 应用s: Telecommunications Line Cards, ASIC Prototyping and Emulation, Industrial Machine Control, DSP and Microprocessor Glue Logic, Military and Aerospace Embedded Computing, High-Speed Test and Measurement Instrumentation.
Telecommunications Line Cards
The EP20K1000CF672C7's 1 M system gates, 38400 logic elements, and 488 user I/Os make it well suited to telecommunications line-card designs where hundreds of LVTTL/LVDS signals interface to TDM framers, network processors, and serializer/deserializer chips. The device's 375.94 MHz maximum internal frequency and embedded array blocks (EABs) support high-speed packet header inspection and ATM cell processing. Designers typically instantiate multiple soft MAC cores alongside hardware CAM lookups in EABs, with 1.8 V VCCINT supplied by a dedicated LDO and 2.5 V/3.3 V VCCIO banks for upstream ASIC I/O compatibility.
推荐
ASIC Prototyping and Emulation
With 1 M gates and 38400 logic elements, the EP20K1000CF672C7 served as a primary ASIC prototyping vehicle for medium-complexity ASICs in the 2001–2010 timeframe. The 488 user I/Os allow direct connection to ASIC package emulation fixtures, while the 4 PLLs provide flexible clock synthesis for multi-clock-domain ASIC designs. Engineers partition the ASIC RTL across multiple APEX 20KC devices using JTAG daisy-chain configuration. For new ASIC prototyping today, designers should evaluate Cyclone V or Stratix 10 instead.
推荐
Industrial Machine Control
The EP20K1000CF672C7 is widely deployed in industrial machine controllers, PLCs, and motor-drive boards because its 488 user I/Os handle dozens of opto-isolated digital inputs, PWM outputs, encoder interfaces, and HMI display buses. Embedded array blocks (EABs) implement deterministic state machines and lookup tables for motion control, while 4 PLLs synthesize multiple clock domains from a single crystal. Industrial designs typically operate the part at 0–70 °C with LVTTL or 24 V-tolerant opto-isolated I/O; the EP20K1000CF672C7's commercial 0–85 °C temperature range fits most factory-floor enclosures.
推荐
DSP and Microprocessor Glue Logic
The EP20K1000CF672C7 acts as high-performance glue logic between microprocessors, DSPs, and external memory in embedded computing platforms. Its 38400 LEs easily absorb wide FIFO buffers, SDRAM controllers, DMA engines, and custom bus bridges; embedded array blocks (EABs) implement dual-port RAM up to 4096 bits each for high-bandwidth data path buffering. The 488 user I/Os accommodate 32-bit external memory buses plus PCI or LVDS links to co-processors. The 1.8 V core consumes modest power at moderate toggle rates, suitable for fanless embedded boxes.
推荐
Military and Aerospace Embedded Computing
Although the EP20K1000CF672C7 is a commercial-temperature part, it is found in many legacy military and aerospace embedded computing platforms because of its high I/O count and proven APEX 20KC architecture. Designers pair it with radiation-tolerant front-end ASICs, store critical state in EAB-based CAM for deterministic lookup, and use the 4 PLLs for redundant clock synthesis. The 672-ball FC-FBGA package supports hermetic and ceramic-column-grid-array rework for ruggedized modules. For new Mil/Aero designs, Intel recommends the military-temperature EP20K1000CB652I8 variant or migrating to Rad-Hard Stratix equivalents.
推荐
High-Speed Test and Measurement Instrumentation
The EP20K1000CF672C7's 375.94 MHz internal frequency and 488 user I/Os enable high-speed pattern generation, logic analyzer capture, and protocol exerciser designs used in bench-top test equipment. Embedded array blocks (EABs) implement deep capture buffers and pattern lookup tables, while the 4 PLLs synthesize multiple test clock domains from a single reference. Engineers typically combine the device with high-speed ADC/DAC front-ends, configuring the part via JTAG for fast design iteration. The 672-ball FC-FBGA package's 1.27 mm pitch keeps the board compact even with hundreds of test points.
推荐
推荐产品汇总
工程参考数据： EP20K1000CF672C7 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP20K1000EFC672-2X | EP20K1000CF672C8 | EP20K1000CF672C9 | EP20K1000CB652I8 | EP20K1000CB652C9ES |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-ball FC-FBGA (45x45 mm, 1.27 mm pitch) | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 652-ball BGA - different | 652-ball BGA - different |
| Family / Generation | APEX 20KC (0.15 µm) | APEX 20KE (0.22 µm) | APEX 20KC (0.15 µm) | APEX 20KC (0.15 µm) | APEX 20KC (0.15 µm) | APEX 20KC (0.15 µm) |
| Logic Elements | 38400 | 38400 | 38400 | 38400 | 38400 | 38400 |
| System Gates | 1 M | 1 M | 1 M | 1 M | 1 M | 1 M |
| Max Internal Frequency | 375.94 MHz | 350 MHz (-7%) | ~330 MHz (-12%) | ~290 MHz (-23%) | 375.94 MHz | ~290 MHz (-23%) |
| User I/O Count | 488 | 488 | 488 | 488 | fewer (652-ball package) | fewer (652-ball package) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
关键差异点
- Fastest speed grade (C7) in the APEX 20KC family at 672-ball FC-FBGA （对比 EP20K1000CF672C8)
- Newer 0.15 µm copper process vs 0.22 µm in APEX 20KE （对比 EP20K1000EFC672-2X)
- Largest I/O count variant (488 user I/Os) in the APEX 20KC family （对比 EP20K1000CB652I8)
设计说明
Estimated: core power scales with toggle rate. At 100 MHz system clock with 50 % logic utilization, the EP20K1000CF672C7 typically draws 1–2 A from the 1.8 V VCCINT rail. Provide a 1.8 V LDO rated for at least 3 A with 100 mV peak-to-peak noise, and decouple every VCCINT pin with 0.1 µF X7R plus 10 µF bulk. VCCIO banks (2.5 V or 3.3 V) supply I/O drivers and can draw up to 1 A per bank under heavy switching; use separate regulator zones per VCCIO bank to prevent switching noise coupling into VCCINT.
The 672-ball FC-FBGA package has a 45 × 45 mm body and 1.27 mm ball pitch, which is reworkable but requires a 4-layer minimum PCB with continuous ground plane beneath the package. Use 0.8 mm via-in-pad micro-vias under the BGA balls if you need to escape all 672 signals on a 4-layer stack, or move to a 6-layer stack with buried vias for higher yield. Keep all configuration/JTAG traces short (< 50 mm) and route them on the top layer adjacent to the BGA to minimize reflection on the TCK/TMS chain.
Configuration-mode pin strapping (MSEL0/MSEL1/MSEL2) must match the desired mode on power-up or the device will not enter user mode. Do not leave any VCCIO bank floating - unused banks must still be tied to a valid voltage to avoid I/O buffer latch-up during configuration. The CONF_DONE pin must be monitored by the host CPU or external watchdog because stuck-at-low indicates a configuration failure; do not assume a successful boot from power-good alone.
Estimated: at 1 A core current and 1.8 V, the EP20K1000CF672C7 dissipates roughly 1.8 W at full toggle rate. The FC-FBGA package has a θJA around 12–15 °C/W with a standard 4-layer JEDEC test board, producing a 22–27 °C temperature rise. No external heatsink is required for typical commercial designs, but ensure adequate airflow (> 100 LFM) if the part sits adjacent to a > 2 W power supply on the board.
LVDS I/O on the EP20K1000CF672C7 requires 100 Ω differential termination near the receiver; do not route LVDS pairs longer than 500 mm without re-evaluating eye margins. For DDR-style interfaces, place the FPGA, memory, and termination resistors in a 'fly-by' topology with stubs under 25 mm. Use the Quartus II 13.0sp1 toolchain's pin planner to assign SSO (Simultaneously Switching Output) limits per bank and avoid exceeding the I/O bank's VCCIO current rating.
合规信息
APEX 20KC family pre-dates widespread RoHS/REACH material declarations by Intel/Altera. Engineers shipping into the EU or automotive applications should request a manufacturer material declaration from the specific lot/date code before design-in.
