EP20K400CB652I7 - 400K Gate APEX 20KC FPGA | Altera | BGA-652
料号： EP20K400CB652I7 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $252 | $2,520.00 |
| 100 | $215 | $21,500.00 |
| 500 | $178 | $89,000.00 |
| 1,000 | $149.5 | $149,500.00 |
EP20K400CB652I7 概述
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that lets designers configure arbitrary digital logic through SRAM-based configuration memory. FPGAs sit in the broader taxonomy of digital ICs > programmable logic > programmable logic device (PLD) > FPGA, and they compete with CPLDs and structured ASICs. The APEX 20KC family combines look-up-table (LUT)-based logic with embedded memory blocks (ESBs) and a MultiCore interconnect, enabling system-on-a-chip integration for glue logic, bus interfaces, DSP preprocessing, and high-speed I/O bridging.
Key features of the EP20K400CB652I7 include: 16,640 logic elements, 400K typical gates, embedded system blocks (ESBs) configurable as dual-port RAM/FIFO/CAM, multi-standard I/O support, dedicated clock management circuitry, and JTAG-based in-system programmability (ISP). The 'I7' speed grade and 'I' industrial temperature suffix make it suitable for -40 °C to +100 °C operation, while the BGA-652 footprint delivers high signal density for data-path-heavy designs.
Architecturally, the APEX 20KC family introduced a hierarchical MegaLAB structure grouping 16 Logic Elements (LEs) with one ESB, providing predictable timing and efficient silicon utilization for register-rich designs. The MultiCore interconnect allows deterministic routing across the die, simplifying static timing closure compared with older symmetric-array FPGAs.
Typical applications include telecommunications line cards, industrial control and instrumentation, military/aerospace signal processing, high-speed data acquisition front-ends, and legacy replacement of ASICs where NRE cost is prohibitive. The 652-ball BGA also supports prototyping for ASIC emulation.
When designing with this part, allocate sufficient PCB layers (>=6) for BGA fan-out and controlled-impedance routing; verify that your Quartus/MAX+PLUS II toolchain still supports the device, as the APEX 20KC family reached end-of-life and is now serviced through Intel's FPGA legacy support programs rather than active new design-ins.
This page synthesizes distributor stock data, cross-validated BGA-652 footprint alternatives, lifecycle status, and legacy replacement notes not found in the original datasheet PDF.
直接替换替代料： EP20K400CB652I7 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP20K400CB652I7 （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Process Technology, Speed Grade, System Gates.
快速对比工具——选择替代料号进行并排对比：
EP20K400CB652C9N
✅ 直接替换✓ 有现货
$195 / 个
查看数据手册 →EP20K400CB652C8N
✅ 直接替换✓ 有现货
$155 / 个
查看数据手册 →EP20K400CB652C7N
✅ 直接替换✓ 有现货
$158 / 个
查看数据手册 →EP20K400CB652C9
✅ 直接替换✓ 有现货
$89.2 / 个
查看数据手册 →EP20K400CB652C9ES
✅ 直接替换✓ 有现货
$195 / 个
查看数据手册 →EP20K400CB652C7ES
✅ 直接替换✓ 有现货
$215 / 个
查看数据手册 →EP20K400CB652I7 最大额定值与电气特性
| Family | APEX 20KC |
| Device Family | Field-Programmable Gate Array (FPGA) |
| Typical Gates | 400,000 |
| Logic Elements (LEs) | 16,640 |
| Maximum Operating Frequency | 375.94 MHz |
| Process Technology | 0.15 µm CMOS |
| Core Supply Voltage | 1.8 V |
| I/O Supply Voltage | 1.8 V / 3.3 V |
| 封装 | BGA-652 (652-ball) |
| Package Code (JESD-30) | S-PBGA-B652 |
| Terminal Form | Ball |
| Package Shape | Square |
| Embedded Memory | Embedded System Blocks (ESB) - dual-port RAM / FIFO / CAM |
| Configuration Method | SRAM + JTAG (ISP) |
| Speed Grade | 7 |
| Temperature Grade | Industrial (-40 °C to +100 °C) |
| RoHS 状态 | Non-compliant (JESD-609 e0, contains lead) |
| Manufacturer Status | Obsolete (Intel/Altera legacy FPGA) |
EP20K400CB652I7 square 引脚配置指南
EP20K400CB652I7（square 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP20K400CB652I7.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP20K400CB652I7 适用于 7 应用s: Telecommunications Line Card Interface, Industrial Control and Factory Automation, High-Speed Data Acquisition Front-End, Military and Aerospace Signal Processing, ASIC Prototyping and Emulation, Legacy Storage Array Controller, Medical Imaging Pre-Processor.
Telecommunications Line Card Interface
The EP20K400CB652I7 fits telecommunications line-card interface designs because its 16,640 logic elements and 400K system gates provide ample capacity for parallel protocol bridging (UTOPIA, POS-PHY, SPI-4.2), while the 652-ball BGA delivers the high pin count needed for wide parallel data buses and multiple SERDES companion interfaces. The 1.8/3.3 V I/O bank support lets the same die interface to legacy 3.3 V bus drivers and modern 1.8 V ASICs without external level shifters. Engineers typically place the FPGA between the framer/MAC ASIC and the backplane SERDES, using the embedded system blocks (ESBs) as 36-bit-wide packet buffers with FIFO flags. The 375.94 MHz maximum internal frequency and deterministic MultiCore interconnect simplify STA closure for the 100+ MHz bus interfaces common in legacy SONET/SDH and Ethernet-over-SDH designs. Industrial temperature grade allows deployment in outdoor enclosures without derating.
推荐
Industrial Control and Factory Automation
The EP20K400CB652I7 is well matched to industrial control platforms because its industrial -40 °C to +100 °C temperature range tolerates cabinet and factory-floor thermal stress, while its 16,640 logic elements can absorb multiple real-time control loops, encoder counters, and fieldbus bridges (Profibus, CANopen, Modbus, EtherCAT) in a single device. The 652-ball BGA delivers enough I/O for parallel bus interfaces to industrial ADCs/DACs, motor-control PWMs, and discrete I/O modules. The 1.8/3.3 V mixed-voltage I/O simplifies interfacing to legacy 5 V-tolerant logic via external resistor dividers or level shifters. Engineers commonly implement deterministic motion-control state machines and PLC scan engines in the device, leveraging the APEX 20KC's predictable MultiCore routing for tight timing margins on 50 µs servo loops. The JTAG in-system programmability allows field firmware updates without removing the controller from the cabinet.
推荐
High-Speed Data Acquisition Front-End
The EP20K400CB652I7 is well suited for high-speed data acquisition front-ends because its 400K gates and 16,640 LEs can absorb multiple parallel ADC capture pipelines, digital down-conversion chains, and packet-formatter blocks, while the 652-ball BGA exposes 300+ general-purpose I/O pins for interfacing to parallel-output ADCs, DDR memory, and high-speed LVDS buses. The 375.94 MHz internal frequency supports 200 MHz data-path designs typical of 14/16-bit ADCs at 100+ MSPS. The embedded system blocks (ESBs) provide 36-bit-wide dual-port RAM for sample buffering and trigger-history storage without consuming logic-element memory. Engineers commonly implement front-end decimation filters, FFT pre-processing, and trigger-arming logic in this FPGA, then hand off packed samples to a downstream DSP or host processor via SPI, parallel bus, or PCI interface.
推荐
Military and Aerospace Signal Processing
The EP20K400CB652I7 is appropriate for military and aerospace signal-processing subsystems because its industrial temperature range and high gate count support demanding radar, electronic-warfare, and avionics-bus applications where COTS-grade silicon is acceptable. The 652-ball BGA package supports the high pin density required for parallel sensor arrays and ARINC 429/MIL-STD-1553 interfaces. The 1.8 V core operates from MIL-STD-704 or DO-160 power buses with standard DC-DC converters. Engineers implement FFT-based channelizers, pulse-compression filters, and bus monitors in the device, using the embedded system blocks as correlation-buffer memory. Note that the EP20K400CB652I7 is non-RoHS (JESD-609 e0); military and aerospace applications frequently claim the RoHS-7 or RoHS-5 exemption for legacy hardware, but new programs should migrate to a RoHS-compliant alternative.
推荐
ASIC Prototyping and Emulation
The EP20K400CB652I7 is widely used in ASIC prototyping and emulation because its 400K gates and 16,640 LEs can absorb multi-million-gate ASIC RTL after synthesis, and multiple FPGAs can be arrayed on a single PCB using the 652-ball BGA's high pin count to expose shared global buses, JTAG chains, and clock distribution networks. The deterministic MultiCore interconnect gives engineers stable timing closure across RTL revisions, which is critical for long emulation runs. The SRAM-based configuration allows rapid design re-spin via JTAG in minutes rather than the weeks required for a tape-out. Engineers build modular emulator motherboards that socket 4-8 APEX 20KC devices in parallel to partition the ASIC's RTL, then co-simulate against testbench software running on a host workstation. The 1.8 V core draws relatively low power compared to bipolar ECL prototyping alternatives.
推荐
Legacy Storage Array Controller
The EP20K400CB652I7 is well matched to legacy storage array controller designs because its 400K gates can absorb RAID parity engines, SCSI/FC command queues, and disk-side DMA controllers in a single chip, while its 652-ball BGA delivers the wide bus width needed for parallel connection to multiple disk controllers and memory buffers. The 1.8/3.3 V I/O directly interfaces to legacy 3.3 V ASICs and modern 1.8 V memory without external level translation. The embedded system blocks act as high-bandwidth cache-tag RAM and command-queue storage. Engineers implement zero-copy DMA, scatter-gather engines, and error-correction logic in the device. Industrial temperature range allows deployment in storage subsystems with constrained cooling. Note that modern NVMe/PCIe storage designs should migrate to a Cyclone V GT or Stratix V equivalent.
推荐
Medical Imaging Pre-Processor
The EP20K400CB652I7 is used in medical imaging pre-processing subsystems because its 400K gates can absorb ultrasound beamformers, CT reconstruction pre-passes, and MRI gradient-control state machines, while the 652-ball BGA exposes enough pins for parallel LVDS data capture from analog front-ends. The 375.94 MHz internal frequency supports real-time pipeline processing at typical ultrasound line rates of 4-8 kHz. The embedded system blocks provide line-buffer memory for delay-and-sum beamforming without external SRAM. Engineers commonly implement FIR filter banks, Hilbert transformers, and envelope detectors in the device, then hand off envelope-detected data to a downstream DSP or ARM-class host. The industrial temperature range supports deployment in scanner cabinets without derating. Modern designs should consider migration to Cyclone V GT or Arria V for lower power and modern interfaces.
推荐
推荐产品汇总
工程参考数据： EP20K400CB652I7 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP20K400CB652C9N | EP20K400CB652C8N | EP20K400CB652C7N | EP20K400CB652C9 | EP20K400CB652C9ES | EP20K400CB652C7ES |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | BGA-652 | BGA-652 - same | BGA-652 - same | BGA-652 - same | BGA-652 - same | BGA-652 - same | BGA-652 - same |
| Family | APEX 20KC | APEX 20KC - same | APEX 20KC - same | APEX 20KC - same | APEX 20KC - same | APEX 20KC - same | APEX 20KC - same |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Typical Gates | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 |
| Speed Grade | 7 (industrial) | 9 (commercial, faster) | 8 (commercial) | 7 (commercial, matches timing) | 9 (commercial) | 9 (commercial, ES screened) | 7 (commercial, ES screened) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C), ES screening | Commercial (0C to +85C), ES screening |
| Core Voltage | 1.8 V | 1.8 V - same | 1.8 V - same | 1.8 V - same | 1.8 V - same | 1.8 V - same | 1.8 V - same |
| Process Technology | 0.15 µm CMOS | 0.15 µm CMOS - same | 0.15 µm CMOS - same | 0.15 µm CMOS - same | 0.15 µm CMOS - same | 0.15 µm CMOS - same | 0.15 µm CMOS - same |
| RoHS Status | Non-compliant (JESD-609 e0) | Pb-free (N suffix) | Pb-free (N suffix) | Pb-free (N suffix) | Non-compliant (no N suffix) | Non-compliant (ES variant) | Non-compliant (ES variant) |
关键差异点
- Industrial temperature grade with 7-speed rating for -40C to +100C operation （对比 EP20K400CB652C9N)
- Non-RoHS (SnPb) terminal finish preserved for legacy/avionics programs （对比 EP20K400CB652C9N)
- 7-speed grade (slower but proven) for timing-conservative designs （对比 EP20K400CB652C9N)
设计说明
The EP20K400CB652I7 uses a 652-ball fine-pitch BGA requiring a minimum 6-layer PCB for signal fan-out, with matched-impedance layers for high-speed LVDS and clock traces. Place at least 4-6 ground-reference vias per signal-via row to maintain return-path continuity. Use 8-mil (0.2 mm) trace-and-space rules for inner BGA escape, and 4-mil microvia technology if manufacturing cost allows - this greatly simplifies breakout routing under the 1.0 mm ball pitch.
The EP20K400CB652I7 requires separate 1.8 V core and 1.8/3.3 V I/O supplies, each decoupled with 0.1 µF X7R ceramics at every supply pin and bulk 47-100 µF tantalum or polymer capacitors at the regulator output. Place decoupling capacitors on the BOTTOM side of the PCB directly under their respective balls with vias-in-pad construction. Power sequencing is NOT required (core and I/O can come up simultaneously), but hold the device in reset (nCONFIG low) until both supplies are stable to prevent in-rush current spikes through the I/O buffers.
Three pitfalls catch engineers migrating to this part: (1) Modern Quartus (10.0 and later) does NOT support APEX 20KC - you must use Quartus II 9.1 SP2 or MAX+PLUS II 10.23; (2) Configuration bitstream generated for APEX 20K (EP20K400BCxxx) will not load on APEX 20KC (EP20K400CBxxx) - recompile with the correct device library; (3) The 'I' suffix means industrial temperature (-40C to +100C) but the 'I' position in the MPN can be confused with the 'I' in 'CB652I7' where 'I' actually means industrial - confirm with the datasheet ordering table before placing production orders.
Route JTAG signals (TCK, TMS, TDI, TDO, nTRST) on a dedicated layer or with controlled 50 ohm impedance to ground, and series-terminate TCK with a 33 ohm resistor at the driver to prevent ringing on long board-to-board cables. Provide a 4.7 kohm pull-up on nCONFIG, nSTATUS, and CONF_DONE, and a 1 kohm pull-up on MSEL pins to set the configuration mode. The exposed die paddle (thermal pad) MUST be soldered to a continuous ground copper pour with at least 16 thermal vias (0.3 mm drill, 1.0 mm pitch) to the internal ground plane for 5 W+ power dissipation.
合规信息
Per Corphita verified data, JESD-609 code is e0 (SnPb finish) - non-RoHS. Part is industrial-grade (-40C to +100C) but not AEC-Q100 qualified for automotive. Reach, halogen-free, and conflict-mineral status unknown - request full material declaration from Altera/Intel legacy support.
