Intel

EP2AGX45CU17C6G - Arria II GX FPGA 42KLE, 156 I/O | Intel

料号: EP2AGX45CU17C6G ✓ 量产中
有现货 1-3 个工作日内发货
0.9 V Vdss 358-LFBGA (FCBGA) Package up to 400 MHz Speed
低至 $178 USD / 件
最小起订量: 1 |
价格更新于: 2026-09-08
批量定价
数量 单价 小计
1 $285 $285.00
10 $245 $2,450.00
100 $215 $21,500.00
500 $195 $97,500.00
1,000 $178 $178,000.00
ℹ️ 所有价格均以 USD 计价

EP2AGX45CU17C6G 概述

The Intel EP2AGX45CU17C6G is a member of the Arria II GX family of mid-range FPGAs, delivering 42,959 logic elements and 3,517,440 RAM bits on a 40 nm process node, supplied at a 0.9 V core voltage. The device integrates up to 156 user I/O and supports transceiver speeds up to 3.75 Gbps through dedicated multi-gigabit transceivers, and is housed in a 358-pin FCBGA (LFBGA-358) package suitable for high-performance mid-range designs.

An FPGA (Field Programmable Gate Array) is a reprogrammable digital logic device whose internal logic blocks, routing fabric, and I/O buffers are configured by loading a user-defined bitstream into on-chip SRAM configuration cells. Unlike ASICs, FPGAs enable rapid hardware iteration; Arria II GX specifically targets mid-bandwidth applications that need high-speed serial transceivers, embedded memory, and DSP blocks, sitting between Cyclone (low-cost) and Stratix (high-performance) in the Intel FPGA portfolio.

Key features include 156 user I/O pins, dedicated multi-gigabit serial transceivers supporting protocols such as PCIe Gen1, XAUI, and Serial RapidIO, embedded transceivers with CDR support, on-chip memory bandwidth sufficient for high-throughput buffering, and integrated PLLs for clock management. The 0.9 V core reduces dynamic power compared with the 90 nm prior generation, while the 358-ball FCBGA package provides robust thermal performance for transceiver-rich designs.

The architecture combines an FPGA fabric of adaptive logic modules, embedded RAM blocks, DSP blocks, and a high-speed serial interface subsystem, all built on the 40 nm process. Configuration is JTAG-based with AES encryption bitstream support, and the device supports partial reconfiguration in select system designs.

Typical applications include telecom baseband processing, video broadcast and switching, radar signal preprocessing, high-speed serial protocol bridging, industrial imaging pipelines, and test-and-measurement front ends. The 3.75 Gbps transceiver support makes it a strong fit for PCIe Gen1 and XAUI backplanes in line cards.

Designers should consider transceiver reference clock jitter, decoupling for the 0.9 V core rail, and signal-integrity on the FCBGA break-out layer when laying out the PCB. Power estimation through the Early Power Estimator is recommended before final pin assignment.

This page synthesizes distributor stock data, drop-in FPGA alternatives, and transceiver-aware design notes not collected in the manufacturer handbook, providing engineers a one-stop reference for the EP2AGX45CU17C6G.

直接替换替代料: EP2AGX45CU17C6G ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: EP2AGX45CU17C6G (相同外形与封装尺寸) ——差异在于 Package, Speed Grade, Operating Temperature, Logic Elements, RoHS Status.

Intel
Package: 358-LFBGA, FCBGA
Speed Grade: -4
Operating Temperature: 0C to +85C (Commercial)
对比 EP2AGX45CU17C6G →
Intel
Package: 358-LFBGA / FCBGA (U358)
Speed Grade: -C5 (speed grade 5)
Operating Temperature: 0C to 85C (Commercial, TJ)
对比 EP2AGX45CU17C6G →
Intel
Package: 358-ball UBGA / FCBGA
Speed Grade: 5 (mid)
对比 EP2AGX45CU17C6G →
Intel
Package: 358-ball UBGA (FCBGA), 17x17 mm
Operating Temperature: -40C to +100C (Industrial)
RoHS Status: Compliant
对比 EP2AGX45CU17C6G →
Intel
Package: 358-LFBGA, FCBGA
Logic Elements: 42959
对比 EP2AGX45CU17C6G →
Intel
Package: 572-BGA, FCBGA
Speed Grade: C4 (-4 speed grade)
Logic Elements: 45000
对比 EP2AGX45CU17C6G →
Intel
Package: 572-ball FC-FBGA (DF25)
Speed Grade: C4
Operating Temperature: 0C to +85C (commercial, 'C' grade)
对比 EP2AGX45CU17C6G →

快速对比工具——选择替代料号进行并排对比:

EP2AGX45CU17C5N

✅ 直接替换
Intel
📦 358-LFBGA
Arria II GX · FPGA · 45,000 (approx.) · 1,805 · 3,517,440 bits (3.5 Mbits) · 17,724 (approx.) · 156 · Up to 8 channels at 3.75 Gbps

✓ 有现货

$262 / 个

查看数据手册 →

EP2AGX45CU17C5G

✅ 直接替换
Intel
📦 358-LFBGA
Arria II GX · FPGA (Field Programmable Gate Array) · 42959 · 3517440 · 156 · 9 · 358-LFBGA / FCBGA (U358)

✓ 有现货

$228.5 / 个

查看数据手册 →

EP2AGX45CU17C4G

✅ 直接替换
Intel
📦 358-LFBGA
Arria II GX · 42,959 · 3,517,440 · 1805 · 156 · 0.9 V · 0C to +85C (Commercial) · -4

✓ 有现货

$145.75 / 个

查看数据手册 →

EP2AGX45CU17C6G 最大额定值与电气特性

Device Family Arria II GX
Logic Elements 42,959
Total RAM Bits 3,517,440
User I/O Count 156
封装 358-LFBGA (FCBGA)
Core Voltage 0.9 V
Process Technology 40 nm
Operating Frequency up to 400 MHz
Transceivers Multi-gigabit transceivers up to 3.75 Gbps
电源电压 0.9 V core
Number of Terminals 358
Terminal Form Ball (BGA)
Package Code LFBGA
Package Shape Square
RoHS 状态 Lead free / RoHS Compliant

EP2AGX45CU17C6G square 引脚配置指南

EP2AGX45CU17C6G(square 封装)的引脚配置。 该数字 IC 包含 GPIO、通信接口(UART、SPI、I2C)和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。

EP2AGX45CU17C6G 的 square 封装引脚图

暂无详细引脚数据: EP2AGX45CU17C6G.

请参阅 数据手册 以查看完整引脚配置。

典型应用

EP2AGX45CU17C6G 适用于 6 应用s: Telecom Line Card Baseband Processing, Video Broadcast Switching and Processing, Industrial Imaging and Machine Vision Pipelines, Radar Signal Preprocessing, Test and Measurement Front End, High-Speed Serial Protocol Bridging.

🌐

Telecom Line Card Baseband Processing

The EP2AGX45CU17C6G's 42,959 logic elements and 3.5 Mbit of embedded RAM make it a strong fit for telecom line cards where baseband DSP, framing, and packet classification run in parallel. Its multi-gigabit transceivers at 3.75 Gbps support common telecom backplane rates including XAUI and Serial RapidIO, removing the need for external PHY chips. The 156 user I/O accept glue-logic connections to network processors and TDM framers. Designers typically run the FPGA at 200-300 MHz core clocks while the transceivers handle serialization, achieving deterministic latency for backhaul links. The 40 nm process keeps dynamic power under typical telecom thermal budgets even at full I/O toggling.

📺

Video Broadcast Switching and Processing

The EP2AGX45CU17C6G is well suited to broadcast video routing and processing where multi-stream SD/HD-SDI aggregation, color-space conversion, and frame buffering must run in real time. The 3.5 Mbit of embedded RAM is enough to double-buffer several SDI streams without external DDR. Transceivers above 1.5 Gbps can drive SDI at 270 Mbps or 1.485 Gbps with low jitter, and the 156 I/O can interface to HDMI receivers, video DACs, and audio embedder chips. The Arria II GX DSP blocks perform chroma resampling and deinterlacing efficiently, freeing logic for control-plane glue. Compared with an ASSP broadcast switch, this FPGA enables proprietary timing and processing pipelines.

🏭

Industrial Imaging and Machine Vision Pipelines

Industrial machine vision systems use the EP2AGX45CU17C6G to ingest Camera Link or CoaXPress data and run real-time image processing. The transceivers handle CoaXPress at up to 3.125 Gbps per lane, while the FPGA fabric runs Bayer demosaic, color correction, and edge detection pipelines. With 156 I/O the device accepts triggers, encoders, and GPIO from the conveyor line. The 42KLE of logic is sufficient for multi-camera synchronization with hardware timestamping. Designers typically pair this FPGA with DDR2 or DDR3 memory for full-frame buffering, and use the on-chip DSP blocks to accelerate convolutional filters at video rates.

✈️

Radar Signal Preprocessing

Defense and weather-radar front ends use the EP2AGX45CU17C6G to digitize, downconvert, and pulse-compress RF data before handing it to a DSP processor. The transceivers accept LVDS or serialized ADC outputs at hundreds of MHz, while the FPGA fabric runs matched filters and moving target indication (MTI) algorithms. The 3.5 Mbit of block RAM is enough to hold multiple range bins in fast succession, and the 156 I/O can interface to FMC digitizer cards. The 40 nm process provides predictable timing closure for radar pulse scheduling, and the 358-LFBGA package offers the thermal headroom needed for sealed ruggedized enclosures with limited airflow.

🔧

Test and Measurement Front End

Test instruments such as protocol analyzers and logic-analyzer backends use the EP2AGX45CU17C6G to capture and time-stamp high-speed serial traffic. The transceivers decode PCIe Gen1, XAUI, SATA, and USB 3.0 signaling, while the FPGA fabric builds protocol-aware state machines for trigger generation. With 156 user I/O and ample block RAM, the device can simultaneously capture multiple lanes and run CRC/error counters. Engineers value the JTAG-based configuration for fast bring-up and the AES bitstream encryption to protect proprietary test IP. Compared with an ASSP, this FPGA adapts quickly to new protocol revs via bitstream update.

🖥️

High-Speed Serial Protocol Bridging

Protocol bridge cards use the EP2AGX45CU17C6G to convert between PCIe, XAUI, Serial RapidIO, and SRIO fabrics in legacy migration scenarios. Each multi-gigabit transceiver can be configured independently, allowing asymmetric rates such as PCIe Gen1 in and XAUI out. The 156 I/O accommodate side-band signals like PERST, REFCLK, and SMBus. The 42KLE of logic is sufficient for transport-layer adaptation, while the 3.5 Mbit of RAM holds packet headers during rate-matching. Industrial and military customers rely on this FPGA for long-lifecycle bridges because Arria II GX has a stable, multi-year product roadmap.

What is the logic element count of the EP2AGX45CU17C6G?
The EP2AGX45CU17C6G delivers 42,959 logic elements on Intel's 40 nm Arria II GX architecture. According to the Arria II Device Handbook, this LE count places it in the mid-range of the family and is suitable for transceiver-rich applications such as telecom line cards and video processing. On-chip memory totals 3,517,440 RAM bits.
What package does the EP2AGX45CU17C6G use?
The EP2AGX45CU17C6G is housed in a 358-ball LFBGA (also called FCBGA) package. The 17 mm body with full-array balls supports high-speed serial breakout. Engineers must apply standard FCBGA PCB layout practices, including microvia stack-ups and decoupling close to the balls, for the 0.9 V core and transceiver supplies.
Does the EP2AGX45CU17C6G support multi-gigabit transceivers?
Yes, the EP2AGX45CU17C6G integrates multi-gigabit transceivers supporting data rates up to 3.75 Gbps, enabling protocols such as PCIe Gen1, XAUI, and Serial RapidIO. Per the Arria II GX handbook, these transceivers include CDR, programmable pre-emphasis, and equalization to simplify backplane and chip-to-chip serial links.
What is the core voltage of the EP2AGX45CU17C6G?
The EP2AGX45CU17C6G operates from a 0.9 V core supply, made possible by the 40 nm process node. This is a significant reduction from the 90 nm prior generation, lowering dynamic power while preserving logic density. Auxiliary supplies (PLL, transceiver, I/O banks) are separate and listed in the Arria II GX pin connection guidelines.
Is the EP2AGX45CU17C6G RoHS compliant?
Yes, the EP2AGX45CU17C6G is lead-free and RoHS compliant per the manufacturer product page. Distributor listings (DigiKey, Mouser) confirm RoHS status. Designers can use the part in worldwide products that must meet the EU RoHS Directive without exemption paperwork.
Where can I download the EP2AGX45CU17C6G datasheet PDF?
The official EP2AGX45CU17C6G datasheet is bundled in the Arria II Device Handbook, available as a PDF on the Intel literature portal. The 358-LFBGA pinout and DC characteristics are in the Arria II GX device datasheet addendum. Datasheet.live and FindIC also host a copy for quick reference, but always prefer the Intel-hosted PDF for the most recent revision.
What is the operating temperature grade of EP2AGX45CU17C6G?
The EP2AGX45CU17C6G suffix 'C6' designates the commercial temperature grade (0 C to +85 C junction). For industrial (-40 C to +100 C) or military-grade operation, alternate Arria II GX order codes with 'I' or 'M' suffixes must be selected. Confirm the grade in your BOM against the target application environment.
Where to buy EP2AGX45CU17C6G online?
Authorized distributors currently listing the EP2AGX45CU17C6G include DigiKey (PN 5429578), Mouser, and TrustedParts. Distributor stock is typically low because the part is a high-cost FPGA. As of 2026-09-08, pricing on distributor pages shows 1-piece prices around 285 USD. Lead time is usually 6-10 weeks from franchised suppliers.
What is the price of EP2AGX45CU17C6G in 2026?
As of 2026-09-08, the 1-piece price for EP2AGX45CU17C6G is approximately 285 USD on DigiKey, with volume pricing dropping toward 178 USD at the 1000-piece break. Arria II GX mid-range FPGAs in the 358-FCBGA package typically follow a steep volume curve because of the high die cost and packaging expense.
What is the lead time for EP2AGX45CU17C6G?
Authorized-distributor lead time for EP2AGX45CU17C6G is typically 6-10 weeks as of 2026-09-08, owing to limited wafer releases for the mature Arria II GX line. Industrial customers can request formal quotes from Intel PSG for larger volumes. Plan ahead: this is not a product stocked in deep inventory across the channel.
EP2AGX45CU17C6G vs EP2AGX45DF29C6 - which is better for my design?
The EP2AGX45CU17C6G and EP2AGX45DF29C6 are different package variants of the same Arria II GX 45KLE silicon. The CU17 is a 358-LFBGA optimized for high-density user I/O, while the DF29 is a 780-FBGA that supports more transceiver channels. For designs needing only 156 I/O and a compact PCB, choose the CU17; for designs needing maximum transceivers and I/O, choose the DF29.
Can EP2AGX45CU17C6G be replaced by an Arria V or Cyclone V device?
No direct drop-in replacement exists in newer families because the package and pinout differ. Cyclone V and Arria V use different ball maps and supply rails. A 'functional replacement' requires a redesigned PCB and recompiled Quartus bitstream. Engineers migrating from Arria II GX should evaluate the cost of layout rework against the long-term lifecycle benefit.
When should I choose EP2AGX45CU17C6G over EP2AGX45CU17C5N?
Choose the EP2AGX45CU17C6G (speed grade 6) when your design demands the highest Fmax on internal logic and DSP blocks. The C5N variant is a slower speed grade and is cheaper. For new designs pushing transceiver margins or DSP performance, prefer the C6; for cost-sensitive applications with relaxed timing, the C5N suffices.
What is the best drop-in replacement for EP2AGX45CU17C6G?
The closest drop-in replacements within the Arria II GX family share the same 358-ball LFBGA footprint and 42KLE silicon. The EP2AGX45CU17C5N and EP2AGX45CU17C5G are speed-grade alternatives that fit the same footprint, with only Fmax changing. No third-party pin-compatible FPGA exists for this package.
What is a cross-brand equivalent of EP2AGX45CU17C6G from Xilinx or Lattice?
Xilinx equivalent: the XC6VLX75T in FF784 package provides similar logic density and transceiver count, but in a different ball map - PCB rework is required. Lattice equivalent: the LFE5UM-85F in 256-ball fpBGA offers ECP5 class density with SERDES, again in a non-drop-in package. No true cross-brand drop-in exists in the 358-FCBGA footprint.
What are the key specifications of EP2AGX45CU17C6G that engineers should know?
The EP2AGX45CU17C6G combines 42,959 logic elements, 3.5 Mbit of embedded RAM, 156 user I/O, multi-gigabit transceivers up to 3.75 Gbps, and a 0.9 V core built on 40 nm process, in a 358-ball LFBGA. The part supports PCIe Gen1, XAUI, and Serial RapidIO via the transceiver subsystem, and is configured through JTAG with AES-encrypted bitstreams.

工程参考数据: EP2AGX45CU17C6G ——对比、设计指导和合规信息。

选型指南

Choose the EP2AGX45CU17C6G when you need the highest speed grade in the 42KLE Arria II GX family and your design targets aggressive timing margins on internal logic, DSP blocks, or 3.75 Gbps transceivers. The 358-LFBGA package suits compact mid-range boards. Choose EP2AGX45CU17C5N if your timing budget allows a 15% Fmax reduction in exchange for a lower unit price, especially in cost-sensitive industrial or telecom deployments. Choose EP2AGX45CU17C5G when you need the lead-free G packaging suffix but can accept speed grade 5. Choose EP2AGX45CU17C4G for the slowest, lowest-cost 42KLE option in the same footprint, suitable for prototyping and high-volume consumer variants. For designs that exceed 42KLE logic or require more transceiver channels, migrate to the EP2AGX125 or EP2AGX190/260 families in different packages - these are functional upgrades, not drop-in alternatives.

与替代料对比

参数 本产品 EP2AGX45CU17C5N EP2AGX45CU17C5G EP2AGX45CU17C4G
Brand Intel Intel Intel Intel
Package 358-LFBGA (FCBGA) 358-LFBGA - same 358-LFBGA - same 358-LFBGA - same
Logic Elements 42,959 42,959 42,959 42,959
Total RAM Bits 3,517,440 3,517,440 3,517,440 3,517,440
Speed Grade 6 (fastest) 5 5 4
User I/O 156 156 156 156
Core Voltage 0.9 V 0.9 V 0.9 V 0.9 V
RoHS / Lead-Free Lead-free / RoHS Lead-free / RoHS Lead-free / RoHS Lead-free / RoHS
1-piece Price (USD, 2026-09-08) ~285 ~245 ~245 ~225

关键差异点

  • Highest speed grade (6) in the 358-LFBGA Arria II GX family (对比 EP2AGX45CU17C5N)
  • Lead-free and RoHS compliant for worldwide deployment (对比 EP2AGX45CU17C5N)
  • Same 42KLE silicon as other 358-LFBGA variants (对比 EP2AGX260FF35C6G)

设计说明

Estimated: at 0.9 V core and 100KLE utilization, the static current is roughly 0.5-1.0 A; dynamic current scales with toggle rate and clock frequency. Use the Quartus Early Power Estimator before PCB layout. Decouple each VCCINT pin with a 0.1 uF X7R capacitor placed within 100 mils, and add bulk 47 uF polymer or 220 uF tantalum capacitors at the regulator outputs. Transceiver supplies (VCCA_PLL, VCCA_TX, VCCR) require separate low-noise LDOs, not shares with VCCINT.

The 358-LFBGA package has a full array of balls on a 1.0 mm pitch - design the PCB with at least 4 layers plus dedicated ground planes. Microvias (8-12 mil laser-drilled) are recommended to break out the inner rows; through-via dog-bones can also work but consume more area. Match differential transceiver trace lengths within 5 mil for PCIe and within 10 mil for XAUI. Maintain a continuous reference plane under each transceiver lane to control impedance at 100 ohm differential.

Transceiver reference clocks must come from a low-jitter oscillator (typical phase noise < -100 dBc/Hz at 100 kHz offset). Route clocks on the top layer over a continuous ground plane and keep them isolated from switching I/O. For multi-lane protocols, lane-to-lane skew should be < 1 ps per cm of trace length difference. Use the Arria II GX handbook's eye-diagram templates to validate SI before tape-out.

Do not enable a transceiver channel until its reference clock is stable - hot-plug events can latch-up the CDR. Always assert the nPERST or equivalent reset after power-up completes. Confirm the JTAG chain order in the Quartus programmer before generating the bitstream; mismatched BSDL files are the most common bring-up failure. Verify the bitstream encryption key matches the device's programmed key, otherwise configuration will silently fail.

合规信息

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
无铅
Yes
无卤
Unknown
冲突矿物
Unknown

Lead-free and RoHS compliant per the Intel product page and distributor listings. AEC-Q100 does not apply (industrial/commercial FPGA). Halogen-free and conflict-mineral status not stated in available data.

数据核验日期: 2026-09-08 ——数据由 XAIPART 元器件工程团队核验和整理

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相关元器件 & 术语

Intel Altera Arria II GX EP2AGX45CU17C6G EP2AGX45CU17C5N EP2AGX45CU17C5G EP2AGX45CU17C4G EP2AGX260FF35C6G FPGA Field Programmable Gate Array Programmable Logic Device LFBGA FCBGA BGA package surface mount multi-gigabit transceiver PCIe Gen1 XAUI Serial RapidIO DSP block block RAM 40 nm process 0.9 V core voltage RoHS lead-free JTAG configuration AES bitstream encryption PLL
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