EP2AGX45DF25C4G - Arria II GX 45KLE FPGA 572-FCBGA | Intel
料号： EP2AGX45DF25C4G ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $248 | $24,800.00 |
| 500 | $225 | $112,500.00 |
| 1,000 | $205 | $205,000.00 |
EP2AGX45DF25C4G 概述
What is a Field Programmable Gate Array (FPGA)? An FPGA is a reconfigurable semiconductor device whose logic fabric, routing, and I/O can be programmed by the end user after manufacture. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and are typically classified alongside ASICs, CPLDs, and structured ASSPs in the programmable logic / semiconductor landscape. The Arria II GX family in particular targets mid-range applications requiring integrated transceivers (PCIe, Gigabit Ethernet, Serial RapidIO), signal processing, and embedded memory, while staying in the low-power envelope (sub-1.5 W typical at mid-utilization).
Key features of the EP2AGX45DF25C4G include a logic-element density of approximately 45K, embedded 10-bit signal-processing blocks, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), and the device is specified for industrial-grade temperatures. The package code DF25 indicates the 572-ball 1.0 mm-pitch FCBGA with Pb-free / lead-free compliance (suffix G), and the speed grade -4 balances performance and power for cost-sensitive mid-tier designs.
Architecturally, the EP2AGX45DF25C4G uses a 40 nm process node with an adaptive logic module (ALM) fabric, embedded M9K/M144K RAM blocks, and dedicated Multipliers combined into DSP blocks. The integrated transceiver capability supports multiple protocols including PCIe Gen1/Gen2, XAUI, and Serial RapidIO, while the hard memory controller supports DDR2/DDR3 with on-chip termination. The high transceivers, programmable drive strength, and on-chip PLL/MMCM-equivalent blocks make the part well-suited to designs where transceiver count and DSP density matter more than raw logic capacity.
Typical applications include wireless baseband processing, broadband aggregation routers with PCIe backplanes, broadcast video processing cards, defense and aerospace signal processing modules, and industrial machine-vision systems requiring deterministic latency. Designers choose the EP2AGX45 series when they need proven 40 nm transceiver availability, embedded memory bandwidth, and a long-lifecycle FPGA family supported by the Quartus II / Quartus Prime design toolchain.
Design considerations for the EP2AGX45DF25C4G include proper transceiver analog supply filtering, controlled-impedance routing for the 572-ball FBGA breakout, thermal management under sustained DSP utilization, and careful power-decoupling of each 1.0 V core/1.5 V transceiver rail. Engineers should also reference Altera's Arria II GX device handbook for transceiver reference designs and the PCG (Pin Connection Guidelines) for correct ball-to-pad assignment.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Arria II GX family, and practical design notes not aggregated in a single location in the manufacturer datasheet.
直接替换替代料： EP2AGX45DF25C4G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2AGX45DF25C4G （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Operating Temperature, Transceivers, Family.
快速对比工具——选择替代料号进行并排对比：
EP2AGX45CU17C4G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$145.75 / 个
查看数据手册 →EP2AGX45CU17C5G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$228.5 / 个
查看数据手册 →EP2AGX45CU17C6G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$178 / 个
查看数据手册 →EP2AGX45CU17I3G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$445 / 个
查看数据手册 →EP2AGX45CU17I5G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$526.7882 / 个
查看数据手册 →EP2AGX45DF25C4G 最大额定值与电气特性
| Series | Arria II GX |
| Family | EP2AGX (Arria II GX) |
| Logic Elements | 45000 |
| Embedded Memory Bits | 3517440 |
| Adaptive Logic Modules | 42959 |
| Number of I/O | 252 |
| 封装 | 572-BGA, FCBGA |
| Package Code | DF25 (1.0 mm pitch) |
| 安装类型 | Surface Mount |
| Speed Grade | C4 (-4 speed grade) |
| Process Node | 40 nm |
| Lead Free / RoHS | Yes (suffix G = lead-free) |
EP2AGX45DF25C4G df25 (1.0 mm pitch) 引脚配置指南
EP2AGX45DF25C4G（df25 (1.0 mm pitch) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2AGX45DF25C4G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2AGX45DF25C4G 适用于 6 应用s: Wireless Baseband Processing, Broadcast Video Processing Cards, PCIe Aggregation Router / Bridge, Industrial Machine Vision Systems, Defense / Aerospace Signal Processing, Test & Measurement Instrumentation.
Wireless Baseband Processing
The EP2AGX45DF25C4G's 45K logic elements, dedicated variable-precision DSP blocks, and 3.5 Mbit embedded RAM make it well-suited for wireless baseband processing in LTE small cells, WiMAX base stations, and remote-radio-head (RRH) front-haul. Its integrated multi-gigabit transceivers support CPRI / OBSAI links to the radio unit with deterministic latency through DSP pipeline balancing. Compared to discrete FPGA + external transceiver designs, the integrated transceiver reduces PCB area by approximately 40% and simplifies the analog supply tree. The 572-ball FCBGA footprint handles the high I/O count required for parallel antenna data, JESD204B interfaces, and time-synchronization I/O.
推荐
Broadcast Video Processing Cards
The EP2AGX45DF25C4G delivers the right balance of memory bandwidth (3.5 Mbit embedded RAM plus external DDR2/DDR3 controller) and DSP throughput for broadcast video processing cards handling SD/HD/3G-SDI streams. Its variable-precision DSP blocks accelerate de-interlacing, scaling, and color-space conversion at rates well beyond what an FPGA in the lower-density Cyclone family can sustain. The 252 user I/O pins accommodate parallel video buses plus HDMI / DisplayPort bridges. Designers frequently pair it with dedicated SDI equalizers and HDMI transmitters on the same PCIe carrier card.
推荐
PCIe Aggregation Router / Bridge
For PCIe Gen1/Gen2 aggregation routers and protocol-bridge cards, the EP2AGX45DF25C4G provides integrated multi-gigabit transceivers plus dedicated PCIe hard IP blocks, eliminating the need for external bridge chips. The 45K logic-element budget is sufficient to terminate multiple PCIe lanes while running custom protocol logic (SerialLite, Aurora 8B/10B) on the same die. With 252 user I/O pins available, the device can drive a switch-fabric backplane alongside Ethernet PHYs. Compared with a soft-IP PCIe implementation on a smaller FPGA, this device reduces latency by approximately 30-50%.
推荐
Industrial Machine Vision Systems
Deterministic-latency image processing for industrial machine-vision inspection lines is a strong fit for the EP2AGX45DF25C4G: its DSP blocks accelerate Sobel, Laplacian, and FFT kernels at line-scan camera rates up to 80 kHz, while 252 user I/O pins accommodate Camera Link, CoaXPress, or GigE Vision interfaces. The 572-ball FCBGA handles the multi-rail power sequencing required by PoE-powered cameras. Industrial-grade speed variants like the EP2AGX45DF25I3G extend operation to factory-floor temperatures down to -40C. Compared with DSP processors, the FPGA provides 5-10x throughput per watt for pixel-rate image pipelines.
推荐
Defense / Aerospace Signal Processing
The EP2AGX45DF25C4G's MIL-PRF-38534-compatible package, integrated transceivers, and 3.5 Mbit embedded RAM make it suitable for radar front-end processing, electronic-warfare subsystems, and secure communications modules in defense programs. The deterministic DSP pipeline supports pulse-Doppler FFTs and adaptive beamforming at rates exceeding 100 MSPS. The 1.0 mm-pitch 572-ball FCBGA withstands the vibration profile of airborne and naval platforms. Industrial- and military-grade speed variants of the same die extend operating range to -55C without PCB redesign.
推荐
Test & Measurement Instrumentation
The EP2AGX45DF25C4G provides the right mix of DSP density, memory, and high-speed transceivers for high-end bench-top test and measurement equipment such as oscilloscopes, protocol analyzers, and arbitrary waveform generators. Its variable-precision DSP blocks run real-time FFTs at multi-GSPS sample rates for spectrum analysis, while the integrated transceivers drive multi-lane ADC/DAC digital interfaces (JESD204B). The 252 user I/O pins handle front-panel LCD/button controls plus trigger/sync I/O. Compared with discrete DSP+FPGA designs, the integrated architecture simplifies board layout and reduces BOM cost by approximately 20%.
推荐
推荐产品汇总
工程参考数据： EP2AGX45DF25C4G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2AGX45CU17C4G | EP2AGX45CU17C5G | EP2AGX45CU17C6G | EP2AGX45CU17I3G | EP2AGX45CU17I5G |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FCBGA-572 (DF25, 25 mm body, 1.0 mm pitch) | FCBGA-572 (CU17, 17 mm body variant) | FCBGA-572 (CU17, 17 mm body variant) | FCBGA-572 (CU17, 17 mm body variant) | FCBGA-572 (CU17, 17 mm body variant) | FCBGA-572 (CU17, 17 mm body variant) |
| Logic Elements | 45000 | 45000 | 45000 | 45000 | 45000 | 45000 |
| Embedded Memory Bits | 3517440 | 3517440 | 3517440 | 3517440 | 3517440 | 3517440 |
| Adaptive Logic Modules | 42959 | 42959 | 42959 | 42959 | 42959 | 42959 |
| User I/O Pins | 252 | 252 | 252 | 252 | 252 | 252 |
| Speed Grade | C4 | C4 | C5 | C6 | I3 | I5 |
| Temperature Range | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
关键差异点
- Higher speed-grade option within same 45K-LE Arria II GX family （对比 EP2AGX45CU17C6G)
- Industrial temperature variant available in same die/package （对比 EP2AGX45CU17I5G)
- Smaller 25 mm package body vs other 572-ball FCBGA codes （对比 EP2AGX45CU17C4G)
设计说明
The 572-ball FCBGA at 1.0 mm pitch requires high-density PCB fabrication with microvia (laser-drilled) stack-up. Use a 1+N+1 or 2+N+2 PCB stack-up with 0.4 mm-pitch escape vias from each BGA ball to inner signal layers. Keep all via-in-pad structures filled and plated; standard 4-layer designs are inadequate - plan for at least 8 layers with dedicated transceiver analog power planes. Reference the Altera Arria II GX PCB Design Guidelines for transceiver analog supply isolation.
The EP2AGX45DF25C4G requires three separate power rails: a 1.0 V core (VCCINT), a 1.5 V transceiver analog supply (VCCA_PLL, VCCA_TX, VCCA_RX), and a 2.5 V/3.3 V I/O supply (VCCIO). Decoupling: place 0.1 uF MLCCs as close as possible to every power pin, with bulk 22-47 uF polymer or tantalum capacitors distributed around the package perimeter. Power sequencing must observe VCCINT before VCCIO; refer to the device handbook sequence table.
Estimated: at full DSP utilization (~70% logic, all transceivers active), the EP2AGX45DF25C4G may dissipate approximately 5-7 W depending on clock frequency. The 572-ball FCBGA exposes a thermal pad - solder it to a continuous copper pour on the top layer with thermal vias to inner planes. For high-utilization designs, attach a heatsink with thermal interface material rated to 5 W or above.
Do not configure I/O banks at mixed voltage standards without consulting the VCCIO group table in the device handbook - each bank shares one VCCIO rail. Confirmed: the device does not support LVDS signaling on all banks; the dedicated LVDS-capable banks must be reserved for high-speed SERDES and clock distribution. Use the Quartus Pin Planner to verify bank assignments before PCB layout finalization.
合规信息
RoHS compliant per suffix G designation in part number. Lead-free / Pb-free terminal finish. AEC-Q100 not applicable for FPGA category.
