EP2AGZ225FF35C3N - Arria II GZ FPGA 224K LE 1152-FCBGA | Intel
料号： EP2AGZ225FF35C3N ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2994.92 | $2,994.92 |
| 10 | $2850 | $28,500.00 |
| 100 | $2650 | $265,000.00 |
| 500 | $2400 | $1,200,000.00 |
| 1,000 | $2200 | $2,200,000.00 |
EP2AGZ225FF35C3N 概述
An FPGA (Field Programmable Gate Array) is a programmable logic device that allows designers to configure digital logic, memory, and routing after fabrication. FPGAs sit in the broader category hierarchy of programmable logic devices (PLD) -> FPGA -> semiconductor IC. The Arria II GZ family is built on a 40nm process node and targets applications needing transceivers, DSP blocks, and external memory interfaces (EMIF) at low total cost of ownership.
Key features of the EP2AGZ225FF35C3N include 12.5 Gbps transceiver capability, dedicated DSP blocks for high-speed signal processing, up to 554 user I/Os, and embedded RAM blocks with parity support. The device supports PCI Express Gen2 hard IP, multiple high-speed memory interfaces (DDR3, DDR2, QDRII+, RLDRAM2), and eight full-duplex clock data recovery (CDR)-based transceivers plus 16 additional transceivers up to 6.375 Gbps.
The architecture uses logic elements (LE) grouped into Adaptive Logic Modules (ALMs), each containing 8-input fracturable look-up tables (LUTs), registers, and dedicated arithmetic adders. The 1152-ball FCBGA package provides the high-density interconnect required for the 554 user I/Os and the multiple transceiver channels. Speed grade 3 indicates a moderate speed bin, balancing performance and yield for cost-sensitive applications.
Typical applications include wireless baseband processing, high-definition video broadcast equipment, radar signal processing, test and measurement instrumentation, medical imaging, and high-speed data acquisition systems. Designers select the Arria II GZ family when they need Stratix-class transceivers and DSP throughput at a lower price point, and when 28 Gbps Stratix V-class performance is not required.
When designing with the EP2AGZ225FF35C3N, careful PCB layout is essential because the FCBGA package demands a multi-layer PCB with matched-impedance traces, blind/buried vias, and controlled-length routing for the transceiver channels. Power distribution requires multiple dedicated voltage rails (core, I/O, PLL, transceiver, auxiliary) with extensive decoupling, and thermal management via heatsink attachment is typically required at full transceiver utilization.
This page synthesizes distributor pricing from DigiKey, Mouser, and Octopart, Intel-recommended Arria II GZ drop-in alternatives from the same family, and practical design considerations not found in the standalone datasheet, making it a faster decision aid for procurement and FPGA selection.
直接替换替代料： EP2AGZ225FF35C3N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2AGZ225FF35C3N （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature Grade, RoHS Status, Logic Array Blocks (LABs), Transceivers.
快速对比工具——选择替代料号进行并排对比：
EP2AGZ225FF35C4N
✅ 直接替换✓ 有现货
$1750 / 个
查看数据手册 →EP2AGZ225FF35C5N
✅ 直接替换📋 参考替代料（不在目录中）
EP2AGZ225FF35I3N
✅ 直接替换✓ 有现货
$2655 / 个
查看数据手册 →EP2AGZ225FF35C3G
✅ 直接替换✓ 有现货
$868.4 / 个
查看数据手册 →EP2AGZ225FF35C3N 最大额定值与电气特性
| Family | Arria II GZ |
| Logic Elements (LE) | 224,000 |
| Logic Array Blocks (LAB) | 8,960 |
| Embedded Memory (bits) | 14,248,960 |
| User I/Os | 554 |
| 封装 | 1152-BBGA, FCBGA |
| Process Node | 40 nm |
| Speed Grade | 3 |
| Temperature Grade | Commercial (0C to +85C) |
| Transceivers | Up to 12.5 Gbps |
| DSP Blocks | Yes (variable-precision) |
| Memory Interfaces | DDR3, DDR2, QDRII+, RLDRAM2 |
| PCI Express Hard IP | Gen1, Gen2 |
| 安装类型 | Surface Mount (BGA) |
| RoHS 状态 | Compliant |
EP2AGZ225FF35C3N 1152-bbga, fcbga 引脚配置指南
EP2AGZ225FF35C3N（1152-bbga, fcbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2AGZ225FF35C3N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2AGZ225FF35C3N 适用于 7 应用s: Wireless Baseband Processing, High-Definition Video Broadcast Equipment, Radar Signal Processing, Test and Measurement Instrumentation, Medical Imaging Systems, High-Speed Data Acquisition Systems, Industrial Motor Control and Drive Systems.
Wireless Baseband Processing
The EP2AGZ225FF35C3N is well suited for wireless baseband processing in 4G LTE and WiMAX base stations. Its 224,000 logic elements and variable-precision DSP blocks support high-throughput channel coding (Turbo, Viterbi), FFT/iFFT engines, and MIMO signal processing. The 12.5 Gbps transceivers enable CPRI and OBSAI fronthaul links between baseband units and remote radio heads. Embedded memory (14.2 Mbits) accommodates intermediate symbol buffers without external SRAM. Designers can implement complete PHY-layer functions in a single device while leaving headroom for MAC-layer acceleration.
推荐
High-Definition Video Broadcast Equipment
The EP2AGZ225FF35C3N supports real-time HD and 4K video pipelines in broadcast routers, switchers, and contribution encoders. Its DSP blocks accelerate color space conversion, scaling, deinterlacing, and chroma keying in real time. The 12.5 Gbps transceivers carry SDI (SMPTE 424M, 425M), HDMI 1.4, and DisplayPort 1.2 signals natively. With 554 user I/Os and external DDR3 memory interfaces, the device can drive multi-output video walls and frame synchronizers without external bridge chips. Commercial temperature grade fits typical broadcast equipment chassis operating below 85C.
推荐
Radar Signal Processing
The EP2AGZ225FF35C3N's variable-precision DSP blocks handle pulse-Doppler radar signal processing including FFT, moving target indication (MTI), and constant false-alarm rate (CFAR) detection in real time. Its 14.2 Mbits of embedded memory serves as fast-access coefficient and window storage for FFT engines. Transceivers up to 12.5 Gbps accept digitized IF signals directly from high-speed ADCs, eliminating intermediate serializer/deserializer stages. The device is used in maritime, weather, and air-traffic-control radar systems where deterministic latency and parallel DSP throughput matter more than raw logic density.
推荐
Test and Measurement Instrumentation
The EP2AGZ225FF35C3N enables high-channel-count oscilloscopes, logic analyzers, and protocol analyzers. Its 554 user I/Os accommodate parallel probe interfaces, and the DSP blocks accelerate FFT-based spectrum analysis in real time. Transceivers accept high-speed serial protocols (PCIe Gen2, 10GbE, USB 3.0) for instrument I/O. The embedded memory and external DDR3 controllers provide deep acquisition buffer storage. Commercial temperature grade is sufficient for laboratory and rack-mounted instrumentation. Quartus Prime supports the device with built-in reference designs for FFT and PCIe implementations.
推荐
Medical Imaging Systems
The EP2AGZ225FF35C3N powers ultrasound beamformers, CT image reconstruction, and MRI gradient controllers in medical imaging equipment. DSP blocks implement FIR filters and back-projection algorithms for image reconstruction. The 12.5 Gbps transceivers move raw sensor data from probe heads to processing electronics. With 224K LEs and 14.2 Mbits of memory, the device can host multiple processing pipelines in parallel. Medical applications typically migrate to industrial-grade (-40C to +100C) variants for reliability, available as the EP2AGZ225FF35I3N in the same 1152-FCBGA package.
推荐
High-Speed Data Acquisition Systems
The EP2AGZ225FF35C3N handles multi-channel high-speed ADC data acquisition in scientific, defense, and industrial monitoring systems. Transceivers up to 12.5 Gbps accept serial LVDS data from ADCs up to 250 MSPS without external deserializer chips. The 224K LEs implement channel calibration, decimation filters, and trigger logic. External DDR3 memory controllers capture deep waveform records. The FCBGA package's controlled-impedance pins ensure signal integrity between the FPGA and adjacent ADCs on the PCB. Quartus Prime provides MegaCore functions for common data-acquisition DSP blocks.
推荐
Industrial Motor Control and Drive Systems
The EP2AGZ225FF35C3N executes field-oriented control (FOC) algorithms for high-performance AC motor drives in industrial automation. Its variable-precision DSP blocks accelerate Park/Clarke transforms, space-vector PWM generation, and PI control loops at PWM frequencies up to 100 kHz. The 554 user I/Os handle multiple encoder inputs, resolver interfaces, and gate driver signals for three-phase IGBT/MOSFET bridges. Transceivers enable EtherCAT, Profinet, and SERCOS III industrial Ethernet connectivity. Designers typically pair the Arria II GZ with external current-sense amplifiers and gate drivers in CNC machines, robotics, and servo drives.
推荐
推荐产品汇总
工程参考数据： EP2AGZ225FF35C3N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2AGZ225FF35C4N | EP2AGZ225FF35C5N | EP2AGZ225FF35I3N | EP2AGZ225FF35C3G |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA |
| Logic Elements | 224,000 | 224,000 | 224,000 | 224,000 | 224,000 |
| Speed Grade | C3 | C4 | C5 | I3 | C3 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Industrial (-40C to +100C) | Commercial |
| Embedded Memory (bits) | 14,248,960 | 14,248,960 | 14,248,960 | 14,248,960 | 14,248,960 |
| User I/Os | 554 | 554 | 554 | 554 | 554 |
| Transceiver Max Data Rate | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps |
关键差异点
- High-density 224K LE Arria II GZ with 12.5 Gbps transceivers （对比 EP2AGX260FF35C5N (Arria II GX, 260K LE but only 6.375 Gbps transceivers))
- Commercial speed grade C3 is the fastest variant （对比 EP2AGZ225FF35C5N (speed grade C5))
- Pin-compatible with industrial temperature variant （对比 EP2AGZ225FF35I3N (industrial temperature, same package))
设计说明
The 1152-ball FCBGA package mandates a high-density PCB stack-up with at least 8 layers, microvias or stacked-vias, and impedance-controlled routing for the 12.5 Gbps transceiver channels. Decoupling requires a mix of bulk, mid-frequency, and high-frequency MLCC capacitors placed as close as possible to each power pin. Reference the Intel Arria II GZ Pin Connection Guidelines (PCG) and board design guidelines (AN 521) for via-in-pad recommendations and signal-integrity design rules. Estimated: a typical board for this device runs $400-$800 USD in PCB fabrication alone at low volumes.
At full transceiver utilization (16 channels at 12.5 Gbps) and 80% logic utilization, the EP2AGZ225FF35C3N can dissipate 8-12 W. A passive heatsink attached with thermal interface material is the minimum requirement; for enclosed chassis without forced airflow, an active heatsink or blower fan is recommended. Estimated: junction temperature rise at 10 W dissipation with a standard 20 C/W heatsink is ~50 C above ambient, requiring ambient below 35 C for commercial-temperature reliability.
Do not confuse the Arria II GZ (EP2AGZ) with the lower-end Arria II GX (EP2AGX). The GZ family supports up to 12.5 Gbps transceivers and higher DSP block count, while the GX family tops out at 6.375 Gbps. Verify the device order code carefully on procurement documents - replacing a GZ with a GX in the same PCB footprint will silently fail timing closure for transceiver-based designs. Also note the difference between speed grades (C3 fastest, C5 slowest) which affects Fmax by 15-30%.
The EP2AGZ225FF35C3N requires multiple voltage rails: VCCINT (core), VCCAUX and VCCAUX_GXB (auxiliary), VCCPD (I/O pre-driver), VCCIO (I/O banks), VCCR_GXB and VCCT_GXB (transceiver), VCCP (PCIe), and VCCBAT (battery backup for key). Power-on sequencing must follow the Arria II GZ handbook specification; out-of-order sequencing can latch-up the device. Use a power management IC such as the LTC3612 or ISL80030 to manage rail sequencing and minimize inrush current during configuration.
Transceiver channel routing must use 100 ohm differential impedance with intra-pair skew below 1 ps and inter-channel skew matched to within 5 ps for CPRI applications. Use guard traces or ground shielding around the high-speed lanes. Length-matching the reference clock to all transceiver banks is essential; do not daisy-chain. Reference Intel application note AN 530 for Arria II GZ transceiver board design, including via stub minimization and AC-coupling capacitor placement.
合规信息
RoHS compliant per Intel/Altera product specifications. AEC-Q100 qualification is not applicable - FPGAs are typically not AEC-Q100 qualified at the component level; the system integrator must perform automotive qualification. REACH and conflict minerals compliance published in Intel material declaration database.