EP2AGZ350HF40C3N - Arria II GZ FPGA, 350K LE, 1517-FCBGA | Intel
부품 번호: EP2AGZ350HF40C3N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2715 | $27,150.00 |
| 100 | $2520 | $252,000.00 |
| 500 | $2340 | $1,170,000.00 |
| 1,000 | $2150 | $2,150,000.00 |
EP2AGZ350HF40C3N 개요
What is an FPGA? An FPGA (field-programmable gate array) is a semiconductor device whose digital logic functionality is defined after manufacturing through user-supplied configuration bitstreams stored in SRAM. FPGAs sit at the top of the programmable logic hierarchy (programmable logic device -> CPLD/FPGA -> semiconductor) and are widely used to implement parallel datapaths, custom interfaces, and hardware accelerators that would otherwise require costly ASIC development. The Arria II GZ family targets mid-range applications requiring transceivers and moderate logic density at lower cost than Stratix-class parts.
Key features include transceiver data rates up to 6.553 Gbps, dedicated fractional PLLs, configurable I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), and on-chip termination (OCT). The 1517-ball FCBGA package uses flip-chip interconnect for low-inductance power delivery and supports the 0.9 V core voltage typical of Arria II GZ. The device is designed for industrial temperature grades and offers bitstream encryption and JTAG-based configuration with support for EPCS and EPCQ configuration devices.
Architecturally, the EP2AGZ350HF40C3N combines ALM-based adaptive logic modules with hard memory blocks (M9K and M144K), variable-precision DSP blocks, and PCI Express hard IP, enabling efficient implementation of high-performance DSP pipelines, video processing, and protocol bridging functions. Configuration can be loaded via fast passive parallel (FPP), active serial (AS), or JTAG modes.
Typical applications include wireless baseband processing, military radar front-ends, broadcast video switchers, ASIC prototyping, and high-speed serial interface bridging. The integrated transceivers make the device suitable for backplane aggregation, SONET/SDH, and Custom Interconnect designs where 6 Gbps links are needed.
When designing with this device, ensure PCB layout meets Intel's flip-chip BGA decoupling and thermal guidelines, and use the Quartus II design suite (13.0 or later) for synthesis, place-and-route, and timing closure. Note that Arria II GZ is a mature family - verify long-term availability for new production designs.
드롭인 대체품: EP2AGZ350HF40C3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGZ350HF40C3N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Logic Elements, Speed Grade, Transceivers, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGZ350HF40C3G
✅ 드롭인✓ 재고 있음
$1380 / 개
데이터시트 보기 →EP2AGZ350HF40C2N
✅ 드롭인✓ 재고 있음
$2645 / 개
데이터시트 보기 →EP2AGZ300HF40C3N
✅ 드롭인✓ 재고 있음
$3623.45 / 개
데이터시트 보기 →EP2AGZ300HF40C3G
✅ 드롭인✓ 재고 있음
$5950 / 개
데이터시트 보기 →EP2AGZ225HF40C3N
✅ 드롭인✓ 재고 있음
$1820 / 개
데이터시트 보기 →EP2AGX260FF35C6N
✅ 드롭인✓ 재고 있음
$1320 / 개
데이터시트 보기 →EP2AGZ350HF40C3N 최대 정격 & 전기적 특성
| Family | Arria II GZ |
| Logic Elements | 348,500 |
| Logic Array Blocks (LABs) | 13,940 |
| Embedded Memory Bits | 21,270,528 |
| User I/Os | 734 |
| Transceivers | Up to 24 (per family datasheet) |
| Transceiver Data Rate | Up to 6.553 Gbps |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm low-power |
| 패키지 | 1517-ball FCBGA (HF40) |
| Operating Temperature Grade | Commercial (C3) |
| Configuration Mode | FPP / AS / JTAG |
| 실장 유형 | Surface Mount (flip-chip BGA) |
EP2AGZ350HF40C3N 1517-ball fcbga (hf40) 핀 구성 가이드
EP2AGZ350HF40C3N(1517-ball fcbga (hf40) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGZ350HF40C3N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGZ350HF40C3N 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, ASIC Prototyping, Military Radar Front-End Processing, Broadcast Video Switching and Processing, High-Speed Serial Interface Bridging, Medical Imaging Acceleration.
Wireless Baseband Processing
The EP2AGZ350HF40C3N's 348,500 logic elements and 21,270,528 bits of embedded memory make it suitable for multi-antenna wireless baseband processing. The 6.553 Gbps transceivers interface directly to CPRI/OBSAI links to remote radio heads, while DSP blocks implement channel estimation, FFT/iFFT, and turbo decoding. The 1517-FCBGA package supports the high I/O count required for parallel CPRI lanes plus backplane connectivity.
추천
ASIC Prototyping
With 348,500 logic elements the EP2AGZ350HF40C3N can emulate ASIC RTL designs of moderate complexity for pre-silicon validation. Quartus II's TimeQuest timing analysis and on-chip logic analyzer (SignalTap) provide deep visibility, while abundant M9K/M144K memory blocks model on-die SRAM behavior. The HF40 BGA footprint and 734 user I/Os expose full design interfaces for prototype bring-up.
추천
Military Radar Front-End Processing
The Arria II GZ architecture supports high-speed ADC-to-FPGA interfaces via LVDS pairs, making the EP2AGZ350HF40C3N suitable for radar pulse compression and digital beamforming. Transceiver channels aggregate digitized antenna data at up to 6.553 Gbps, and DSP blocks implement FIR filters, FFTs, and CFAR detection. Commercial temperature grade is appropriate for sheltered ground- or shipboard installations.
추천
Broadcast Video Switching and Processing
Broadcast video routers require high-throughput switching fabrics with low latency; the EP2AGZ350HF40C3N's 734 user I/Os and 24 transceivers handle uncompressed 3G-SDI switching and 10GbE trunk aggregation in single-chip implementations. Embedded memory buffers line-rate video streams while DSP blocks implement color-space conversion and scaling. Industrial temperature grade and 0.9 V core voltage support 24/7 rack-mount reliability.
추천
High-Speed Serial Interface Bridging
The EP2AGZ350HF40C3N's up to 24 multi-gigabit transceivers and rich memory subsystem enable bridging between protocols such as Serial RapidIO, PCIe Gen2, SATA, and 10 Gigabit Ethernet. PLLs and PCS hard IP reduce logic usage, freeing ALMs for protocol-stack firmware and DMA engines. The HF40 1517-ball package supports high lane counts with clean signal-integrity routing on standard high-speed PCB stackups.
추천
Medical Imaging Acceleration
CT, MRI, and ultrasound imaging systems rely on FPGA-accelerated DSP pipelines to reconstruct images in real time. The EP2AGZ350HF40C3N's combination of abundant DSP blocks, embedded memory, and high I/O bandwidth enables back-projection, FIR filtering, and beamforming at clinically relevant frame rates. The HF40 FCBGA package supports the dense, thermally efficient layouts required in compact imaging carts.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGZ350HF40C3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGZ350HF40C3G | EP2AGZ350HF40C2N | EP2AGZ300HF40C3N | EP2AGZ300HF40C3G | EP2AGZ225HF40C3N | EP2AGX260FF35C6N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-ball FCBGA (HF40) | 1517-ball FCBGA (HF40) - same | 1517-ball FCBGA (HF40) - same | 1517-ball FCBGA (HF40) - same | 1517-ball FCBGA (HF40) - same | 1517-ball FCBGA (HF40) - same | 1517-ball FCBGA (FF35) - same pin count |
| Family | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GX |
| Logic Elements | 348,500 | 348,500 | 348,500 | 300,000 | 300,000 | 225,000 | 260,000 |
| Transceiver Data Rate | Up to 6.553 Gbps | Up to 6.553 Gbps | Up to 6.553 Gbps | Up to 6.553 Gbps | Up to 6.553 Gbps | Up to 6.553 Gbps | Up to 6.553 Gbps |
| Speed Grade | C3 | C3 | C2 (slower) | C3 | C3 | C3 | C6 (slower) |
| RoHS / Lead-Free | Compliant (N variant lead-bearing) | RoHS-compliant / lead-free | Compliant (N variant lead-bearing) | Compliant (N variant lead-bearing) | RoHS-compliant / lead-free | Compliant (N variant lead-bearing) | Compliant (N variant lead-bearing) |
| Approx. Unit Price (qty 1) | USD 2,850 | USD 2,900 (approx) | USD 2,700 (approx) | USD 2,300 (approx) | USD 2,350 (approx) | USD 1,750 (approx) | USD 2,100 (approx) |
주요 차별점
- Higher logic density than 300K variant with same footprint (vs EP2AGZ300HF40C3N)
- Faster speed grade than C2 sibling (vs EP2AGZ350HF40C2N)
- Lead-bearing N variant supports legacy assembly lines (vs EP2AGZ350HF40C3G)
- GZ family provides enhanced PLLs versus GX family (vs EP2AGX260FF35C6N)
설계 노트
The EP2AGZ350HF40C3N in the 1517-ball FCBGA (HF40) package dissipates significant power under typical utilization (often 8-15 W). Per Intel's Arria II GZ thermal management guidelines, designers must provide a minimum 4-layer PCB stack-up with dedicated inner power planes, an array of thermal vias under the die footprint, and adequate airflow (typically 200 LFM) to keep junction temperature below 100 C. Always run the Quartus II PowerPlay early power estimator during architecture to size the cooling solution before layout commitment.
The 1517-ball FCBGA uses 1.0 mm ball pitch requiring high-density interconnect (HDI) PCB fabrication with laser-drilled micro-vias and via-in-pad construction for clean signal and power delivery. Decoupling: place 0.1 uF X7R capacitors within 100 mils of every VCCINT/VCCPD/VCCA ball, plus bulk 10-22 uF X5R capacitors distributed across the package perimeter. Reference Intel's Arria II GZ pin connection guidelines for the full decoupling checklist - omitting recommended caps can cause configuration failure or in-system bitstream corruption.
Common pitfalls: (1) mixing C (commercial) and I (industrial) temperature grade parts on the same BOM line - they share the same footprint but the I grade has different speed-grade binning; (2) failing to enable on-chip termination (OCT) for LVDS pairs, causing signal-integrity failures on high-speed links; (3) using the wrong configuration mode - fast passive parallel (FPP) requires an external flash controller while AS mode uses EPCS/EPCQ devices. Always verify the Quartus II pin assignment matches the schematic before board fabrication.
Multi-gigabit transceiver channels up to 6.553 Gbps demand controlled-impedance differential routing (100 ohm differential, typically 85 ohm to ground reference) with continuous reference planes and minimum via stubs. Keep TX and RX pairs length-matched within 5 mils and isolate from noisy digital signals. The HF40 ball map assigns dedicated transceiver banks; route these on the top layer or in symmetric stripline pairs to preserve signal integrity. Cross-reference Intel's Arria II GZ transceiver layout guidelines for stack-up recommendations.
규정 준수 정보
RoHS compliance per Intel Arria II GZ family product environmental documentation. AEC-Q100 not applicable - FPGAs are not qualified to automotive discrete semiconductor stress standards. Halogen-free packaging declared per industry standard. C3 suffix denotes commercial temperature grade (0 C to +85 C).
