EP2SGX60DF780I4 - 60K LEs Stratix II GX FPGA, 780-FBGA | Intel
料号： EP2SGX60DF780I4 ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1780 | $17,800.00 |
| 100 | $1695 | $169,500.00 |
| 500 | $1620 | $810,000.00 |
| 1,000 | $1550 | $1,550,000.00 |
EP2SGX60DF780I4 概述
An FPGA is an integrated circuit containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP such as transceivers, memory blocks, and DSP blocks. The Stratix II GX family is Intel's (formerly Altera's) high-end transceiver-rich FPGA family, positioned above the Cyclone and Arria lines and below the Stratix IV/V in the programmable-logic taxonomy: FPGA > Stratix > high-speed serial transceiver FPGA > Stratix II GX. This categorization matters for system architects evaluating performance per dollar and per watt.
Key features of the EP2SGX60DF780I4 include 60,440 logic elements, 2,544,192 embedded RAM bits organized as M512/M4K/M-RAM blocks, embedded 6.375 Gbps multi-gigabit transceivers (MGTs), dedicated DSP blocks, and Phase-Locked Loops (PLLs). The high transceiver count and rich DSP resources make the device a workhorse for parallel signal-processing and high-speed serial I/O applications.
Architecturally, Stratix II GX devices use an adaptive logic module (ALM)-based fabric, an 8-input fracturable LUT, and a column-based DSP/memory floorplan. Compared to Stratix II (non-GX) devices, the GX variant adds hardened PMA-capable transceivers directly bonded to the die, enabling 6.375 Gbps SERDES without consuming fabric logic. This architecture delivers a multi-GHz fabric with deterministic timing closure.
Typical applications include high-speed serial backplane interfaces (XAUI, PCIe Gen1, Serial RapidIO, SDI/HD-SDI), DSP co-processing, software-defined radio (SDR) baseband, and 1G/10G Ethernet MAC bridging. The device's combination of 6.375 Gbps transceivers and embedded DSP is well matched to multi-lane serial protocol bridges and pre-silicon ASIC prototyping.
When designing with the EP2SGX60DF780I4, designers should carefully manage multi-gigabit transceiver PCB routing (controlled-impedance differential pairs, length matching, and AC-coupling capacitors on each lane), provide ample decoupling on VCCINT/VCCA and VTT rails, and ensure thermal management accounts for industrial-temperature operation in enclosed chassis. Power estimation should be performed in the Quartus II Early Power Estimator before PCB layout to size rails correctly.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not aggregated in a single place on the manufacturer datasheet, giving engineers a one-stop reference for part selection, sourcing, and PCB-level integration.
直接替换替代料： EP2SGX60DF780I4 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2SGX60DF780I4 （相同外形与封装尺寸） ——差异在于 Speed Grade, Package, Package Type, Process Technology, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
EP2SGX60DF780C5
✅ 直接替换✓ 有现货
$860.69 / 个
查看数据手册 →EP2SGX60DF780C7
✅ 直接替换✓ 有现货
$348 / 个
查看数据手册 →EP2SGX60DF780I3N
✅ 直接替换✓ 有现货
$1295 / 个
查看数据手册 →EP2SGX60DF780C4
✅ 直接替换✓ 有现货
$1350 / 个
查看数据手册 →EP2SGX60DF780C5N
✅ 直接替换✓ 有现货
$205 / 个
查看数据手册 →EP2SGX60DF780C3N
✅ 直接替换✓ 有现货
$188 / 个
查看数据手册 →EP2SGX60DF780I4 最大额定值与电气特性
| Family | Stratix II GX |
| Device Logic Elements | 60,440 |
| Logic Cells / CLBs | 60,440 |
| Total RAM Bits | 2,544,192 bits |
| User I/O Count | 364 |
| Transceivers | Embedded multi-gigabit transceivers (MGTs) |
| Internal Maximum Frequency | 732.1 MHz |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| 封装 | 780-ball FC-FBGA (29 x 29 mm, 1 mm pitch) |
| 安装类型 | Surface Mount |
| 工作温度 | -40C to +100C (Industrial) |
| Speed Grade | I4 (Industrial, speed grade 4) |
| RoHS 状态 | Compliant |
EP2SGX60DF780I4 780-ball fc-fbga (29 x 29 mm, 1 mm pitch) 引脚配置指南
EP2SGX60DF780I4（780-ball fc-fbga (29 x 29 mm, 1 mm pitch) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2SGX60DF780I4.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2SGX60DF780I4 适用于 6 应用s: 10 Gigabit Ethernet XAUI Bridge, PCI Express Gen1 Endpoint, Serial RapidIO Switch Fabric, Software-Defined Radio (SDR) Baseband, High-Definition Serial Digital Interface (HD-SDI / 3G-SDI), Pre-Silicon ASIC Prototyping.
10 Gigabit Ethernet XAUI Bridge
The EP2SGX60DF780I4's embedded multi-gigabit transceivers and 60,440 logic elements make it a natural fit for 10 Gigabit Ethernet XAUI-to-XGMII bridging and switching. With 4 transceivers per XAUI lane group running at 3.125 Gbps, the device can implement a 4-lane XAUI interface in 4K LEs, leaving 50K+ LEs for MAC-layer processing, bridging logic, and traffic shaping. Compared to a discrete SERDES plus ASIC implementation, the integrated transceiver approach saves PCB area and reduces BOM cost. The industrial temperature rating enables deployment in outdoor telecom cabinets.
推荐
PCI Express Gen1 Endpoint
The EP2SGX60DF780I4 includes hard PCI Express Gen1 (2.5 Gbps) PHY IP that is licensed through Quartus II and bonded to the MGTs. Implementing a x4 Gen1 endpoint requires approximately 8K-12K LEs, a fraction of the available 60,440 LEs, leaving substantial headroom for the application-layer DMA engine, BAR mapping logic, and MSI-X interrupt controller. The 780-ball FC-FBGA package provides the differential pairs and reference clock inputs required by the PCIe PHY. Industrial temperature rating suits in-chassis deployments in servers and base stations.
推荐
Serial RapidIO Switch Fabric
Serial RapidIO (sRIO) at 1.25/2.5/3.125 Gbps is a key fabric in wireless base-station and military-aerospace DSP arrays. The EP2SGX60DF780I4 supports 1x and 4x sRIO links via the MGTs, with the protocol layer consumed in approximately 6K-10K LEs per port. The 60K-LE fabric allows a small switch (4 ports) to be built entirely in fabric, while a larger 8-port switch can be partitioned across the embedded transceivers and the logic. The -40C to +100C industrial temperature range qualifies the part for outdoor wireless infrastructure cabinets.
推荐
Software-Defined Radio (SDR) Baseband
The Stratix II GX's combination of MGTs, embedded DSP blocks, and 2.5 Mbit of block RAM makes the EP2SGX60DF780I4 well suited to SDR baseband processing. A typical multi-channel DDC/DUC bank for cellular base-station baseband consumes 30-50 DSP blocks and 4-8 MGTs for CPRI/OBSAI front-haul. The 60K-LE fabric leaves 10-20K LEs for protocol-stack software (via Nios II embedded processor) or custom MAC-layer logic. The industrial temperature rating matches the operational envelope of outdoor macro-cell base stations.
推荐
High-Definition Serial Digital Interface (HD-SDI / 3G-SDI)
The SMPTE 259M/292M/424M serial digital interface standards (SD-SDI, HD-SDI, 3G-SDI) require multi-gigabit serializer/deserializer operation up to 2.97 Gbps, well within the EP2SGX60DF780I4's MGT capability. The device can implement a 4-channel SDI router with embedded audio de-embedders, ANC processing, and genlock in 20-30K LEs, leaving headroom for ancillary data processing. The 780-FBGA package supports the required number of differential pairs (4 TX + 4 RX per direction) plus reference clock and JTAG.
推荐
Pre-Silicon ASIC Prototyping
With 60,440 logic elements and embedded transceivers, the EP2SGX60DF780I4 is a popular target for pre-silicon ASIC prototyping of mid-complexity designs (1-3M ASIC gates). Multi-FPGA partitioning tools (e.g., Certify, Synopsys Certify) can split a large ASIC netlist across multiple Stratix II GX devices with high-speed serial TDM links between FPGAs. The 780-ball FC-FBGA footprint and 1 mm pitch facilitate BGA-to-BGA socket-based prototyping boards (e.g., HAPS, FPGA-Array). Industrial temperature rating extends prototyping use into the field.
推荐
推荐产品汇总
工程参考数据： EP2SGX60DF780I4 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2SGX60DF780C5 | EP2SGX60DF780C7 | EP2SGX60DF780I3N | EP2SGX60DF780C4 | EP2SGX60DF780C5N | EP2SGX60DF780C3N |
|---|---|---|---|---|---|---|---|
| Package | 780-ball FC-FBGA (29x29 mm) | 780-ball FC-FBGA (29x29 mm) - same | 780-ball FC-FBGA (29x29 mm) - same | 780-ball FC-FBGA (29x29 mm) - same | 780-ball FC-FBGA (29x29 mm) - same | 780-ball FC-FBGA (29x29 mm) - same | 780-ball FC-FBGA (29x29 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Speed Grade | I4 (industrial, grade 4) | C5 (commercial, grade 5) | C7 (commercial, grade 7) | I3 (industrial, grade 3) | C4 (commercial, grade 4) | C5 (commercial, grade 5) | C3 (commercial, grade 3) |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Embedded Memory | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits |
| User I/O | 364 | 364 | 364 | 364 | 364 | 364 | 364 |
| Internal Max Frequency | 732.1 MHz | 732.1 MHz | 732.1 MHz | 732.1 MHz | 732.1 MHz | 732.1 MHz | 732.1 MHz |
| Lead-Free (N suffix) | No | No | No | Yes (N suffix) | No | Yes (N suffix) | Yes (N suffix) |
关键差异点
- Industrial speed grade at -40C to +100C （对比 EP2SGX60DF780C5)
- I4 (industrial grade 4) timing budget balance （对比 EP2SGX60DF780I3N)
- 60,440 logic elements vs 33,640 in EP2SGX30 devices （对比 EP2SGX30DF780I4)
设计说明
Estimated: the 780-ball FC-FBGA package at 1 mm pitch requires escape routing on a high-density PCB (HDI) with microvia stacks. Designers should plan for at least 6 PCB layers (4 signal + 2 ground) and use a 0.8 mm / 0.4 mm laser-drilled microvia stackup. VCCINT and VCCA decoupling should be placed as close to the balls as possible, with 0402 size 0.1 uF X5R ceramic capacitors preferred for high-frequency decoupling of the 1.2 V core rail.
The multi-gigabit transceiver (MGT) channels require tightly controlled differential pair routing: 100 ohm +/- 10% differential impedance, intra-pair length matching within 5 mils, and inter-pair length matching within 50 mils for multi-lane protocols. Reference designators and signal naming should follow the Stratix II GX PCB Design Guidelines (Altera app note AN 521). Each MGT lane requires its own AC-coupling capacitor (0.01 uF X7R) close to the receiver side of the channel.
Estimated: at typical utilization (~50K LEs, 4 active MGTs, 25% block RAM toggling rate), the EP2SGX60DF780I4 dissipates approximately 4-7 W. The 29 x 29 mm FC-FBGA package has a theta-JA of approximately 12-15 C/W with a 16-layer PCB, implying a junction-to-ambient temperature rise of 50-100 C. In enclosed industrial enclosures with 70C ambient, a thermal pad or heatsink is recommended to keep the junction below 100C.
Configuration mode (AS, AP, PS, JTAG) must be selected correctly via MSEL pins; mis-configuring MSEL causes the device to fail to configure. The CONF_DONE pin must be pulled high externally and monitored by the system controller. The nCONFIG pin must be held low during power-up ramp and released only after VCCINT, VCCA, and VCCPD reach the recommended operating range. Failing to observe these constraints can result in brown-out configuration failures or CRC errors during multi-boot.
合规信息
RoHS and lead-free compliance confirmed by Intel/Altera product page. Not AEC-Q100 qualified (commercial/industrial grade, not automotive grade).
