EP2SGX60DF780I4 vs EP2SGX60DF780C3N 对比

详细并排对比 EP2SGX60DF780I4 出自 Intel 和 EP2SGX60DF780C3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP2SGX60DF780I4 EP2SGX60DF780I4 - 60K LEs Stratix II GX FPGA, 780-FBGA | Intel

EP2SGX60DF780I4 - 60K LEs Stratix II GX FPGA, 780-FBGA | Intel

EP2SGX60DF780I4 ⚠ 最后一次采购
Intel
EP2SGX60DF780C3N EP2SGX60DF780C3N - 60K LEs Stratix II GX FPGA | Intel

EP2SGX60DF780C3N - 60K LEs Stratix II GX FPGA | Intel

EP2SGX60DF780C3N ✗ 停产

规格对比

参数 EP2SGX60DF780I4 EP2SGX60DF780C3N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 停产
库存状态 有库存 有库存
单价(USD) $1,550.00 $188.00
Family Stratix II GX Stratix II GX
Device Logic Elements 60,440 —
Logic Cells / CLBs 60,440 —
Total RAM Bits 2,544,192 bits —
User I/O Count 364 —
Transceivers Embedded multi-gigabit transceivers (MGTs) —
Transceiver Data Rate [DATA_NEEDED: transceiver data rate in Gbps] —
Internal Maximum Frequency 732.1 MHz —
Propagation Delay [DATA_NEEDED: propagation delay] [DATA_NEEDED: propagation delay ns]
Process Technology 90 nm CMOS 90 nm
Core Voltage 1.2 V 1.2 V
封装 780-ball FC-FBGA (29 x 29 mm, 1 mm pitch) —
安装类型 Surface Mount Surface Mount (BGA)
工作温度 -40C to +100C (Industrial) [DATA_NEEDED: operating temperature range C]
Speed Grade I4 (Industrial, speed grade 4) —
MSL 等级 [DATA_NEEDED: MSL level] —
RoHS 状态 Compliant Compliant (per distributor listing)
Device Type — FPGA
Logic Elements — 60,440
LABs/CLBs — 3,022
Total Memory Bits — 2,544,192
User I/Os — 364
Package Type — 780-pin FC-FBGA (DF780)
Package Dimensions — 23 x 23 mm
Pitch — 1 mm
Internal Frequency — 717 MHz

数据手册与资源

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