EP3C5F256C6N - Cyclone III FPGA, 5K LEs, 256-FBGA | Intel
料号： EP3C5F256C6N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $37.8 | $37.80 |
| 10 | $32.5 | $325.00 |
| 100 | $27.4 | $2,740.00 |
| 500 | $22.1 | $11,050.00 |
| 1,000 | $18.85 | $18,850.00 |
EP3C5F256C6N 概述
An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor containing an array of programmable logic blocks, embedded memory, DSP slices, and programmable I/O cells interconnected by a routing fabric. FPGAs occupy the top of the programmable logic hierarchy below custom ASICs: PLA -> CPLD -> FPGA -> ASIC. The Cyclone III family was engineered as Intel/Altera's lowest-power 65 nm FPGA line, enabling fanless operation in cost-driven designs that previously required discrete logic or microcontrollers.
Key features include 23 embedded 18x18 multipliers for DSP, two PLLs per device, support for external memory interfaces such as DDR/DDR2 SDRAM and QDRII SRAM, and configurable I/O standards including LVDS, LVTTL, SSTL, and PCI. The Cyclone III architecture supports up to 120 K logic elements at the family level and ships with Quartus II design tools (now Quartus Prime Lite). Configuration is via serial or parallel flash, JTAG, or AS/PS modes.
Typical applications include industrial motor control and human-machine interfaces, video processing pipelines, low-volume ASIC prototyping, consumer display controllers, and portable/wireless protocol bridging. The 256-FBGA package with 1 mm ball pitch supports dense multi-layer PCB layouts while maintaining 17x17 mm board area.
When designing with this device, plan I/O bank assignments against VCCIO supply rails, allocate sufficient decoupling per bank, and reserve dedicated clock pins for PLL inputs. Quartus II design software provides free synthesis support for the entire Cyclone III family.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： EP3C5F256C6N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3C5F256C6N （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Process Technology, RoHS Status, Logic Array Blocks (LABs).
快速对比工具——选择替代料号进行并排对比：
EP3C5F256C6
✅ 直接替换✓ 有现货
$21.4 / 个
查看数据手册 →EP3C5F256C8N
✅ 直接替换✓ 有现货
$10.95 / 个
查看数据手册 →EP3C5F256A7N
✅ 直接替换✓ 有现货
$24.4 / 个
查看数据手册 →EP3C5F256I7N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$24 / 个
查看数据手册 →EP3C10F256C6N
✅ 直接替换✓ 有现货
$14.1 / 个
查看数据手册 →EP3C10F256C8N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$15.4 / 个
查看数据手册 →EP3C16F256I7N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$38.5 / 个
查看数据手册 →EP3C25F256C8N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$38.95 / 个
查看数据手册 →EP3C5F256C6N 最大额定值与电气特性
| Family | Cyclone III |
| Series | EP3C5 |
| Logic Elements (LEs) | 5136 |
| Logic Array Blocks (LABs) | 182 (per DigiKey listing) |
| Total Memory Bits | 423936 |
| Embedded 18x18 Multipliers | 23 |
| PLLs | 2 |
| Maximum User I/Os | 182 |
| Core Process Technology | 65 nm CMOS |
| Core Voltage | 1.2 V |
| 工作温度 | 0 C to +85 C (commercial "C6" speed grade) |
| 封装 | 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1 mm pitch |
| 安装类型 | Surface Mount |
| RoHS / Lead-Free | Lead-free (per distributor listings) |
| Configuration Modes | Serial, Parallel, JTAG, AS, PS |
EP3C5F256C6N 256-ball fbga (fineline bga), 17 x 17 mm, 1 mm pitch 引脚配置指南
EP3C5F256C6N（256-ball fbga (fineline bga), 17 x 17 mm, 1 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3C5F256C6N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3C5F256C6N 适用于 6 应用s: Industrial Motor Control, Human-Machine Interface (HMI) Display Controller, Low-Volume ASIC Prototyping, Video Processing Pipeline, Consumer Wireless Protocol Bridge, Portable Data Acquisition.
Industrial Motor Control
The EP3C5F256C6N's 5136 logic elements, 23 embedded 18x18 multipliers, and 2 PLLs make it a strong fit for industrial motor control applications such as field-oriented control (FOC) and stepper servo drives. The 65 nm Cyclone III silicon provides deterministic DSP performance for PID loops and SVPWM generation, while the 1.2 V core keeps dissipation low enough for fanless IP65 enclosures. Up to 182 user I/Os in the FBGA-256 package support multi-axis encoder inputs (QEP), gate-driver PWM outputs, and isolated communication links such as RS-485 or CAN. Industrial users typically pair this FPGA with external ADCs for current sensing and rely on Quartus II for hardware-accelerated simulation. The 0 C to +85 C commercial temperature grade covers most factory-floor cabinets.
推荐
Human-Machine Interface (HMI) Display Controller
For HMI panels driving TFT LCDs, the EP3C5F256C6N delivers 182 user I/Os to interface RGB or LVDS displays, touch controllers, and backlight PWM channels. The 423936 RAM bits provide frame-buffer and glyph cache storage without external SRAM for low-resolution panels. With 65 nm low-leakage process and 1.2 V core, the device enables slim fanless panel designs. Quartus II supports soft IP cores for SPI, I2C, and UART commonly used for HMI communication. The FBGA-256 package is well suited to compact panel PCBs.
推荐
Low-Volume ASIC Prototyping
The EP3C5F256C6N serves as a low-cost ASIC prototyping platform for designers validating RTL before committing to mask sets. Quartus II supports incremental compilation with region-based design partitions, ideal for hardware-software co-development. The 5136 LEs accommodate most mid-complexity state machines and datapaths, while the embedded RAM blocks provide realistic timing behavior. JTAG configuration allows fast design iteration in the lab. Cyclone III is in long-term support, ensuring design IP investment is preserved.
推荐
Video Processing Pipeline
For video bridging, scaling, and color-space conversion, the EP3C5F256C6N provides 23 embedded 18x18 multipliers for real-time 2D filter and scaling operations. Its PLL resources generate pixel clocks needed for SD/HD video timings, while 182 I/Os interface BT.656, BT.1120, or HDMI bridge chips. Cyclone III supports DDR/DDR2 SDRAM controllers for frame buffering. The low 1.2 V core power enables compact video modules without forced-air cooling.
推荐
Consumer Wireless Protocol Bridge
For Wi-Fi, Bluetooth, or sub-GHz wireless bridges in consumer IoT, the EP3C5F256C6N offers flexible I/O voltage mixing (LVTTL, LVCMOS, LVDS) to interface diverse radio modules. With 2 PLLs, it generates precise clock trees for radio baseband processing, and embedded multipliers accelerate FFT and channel coding operations. Quartus II supports soft CPU cores (Nios II) for protocol stack offload. The low-power 65 nm silicon extends battery life in portable wireless hubs.
推荐
Portable Data Acquisition
Battery-powered data loggers and portable instruments benefit from the EP3C5F256C6N's low 65 nm core power and 0 C to +85 C commercial temperature range. The 5136 LEs implement custom ADC control, digital filtering, and compression logic, while 182 I/Os sample multi-channel analog front ends and store to external flash or SD cards. PLLs provide jitter-clean clocks for ADC sampling. The FBGA-256 supports dense PCB layouts with minimal footprint.
推荐
推荐产品汇总
工程参考数据： EP3C5F256C6N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3C5F256C6 | EP3C5F256C8N | EP3C5F256A7N | EP3C10F256C6N | EP3C25F256C8N |
|---|---|---|---|---|---|---|
| Package | 256-ball FBGA (17x17 mm) | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same |
| Brand | Intel (formerly Altera) | Intel / Altera - same | Intel / Altera - same | Intel / Altera - same | Intel / Altera - same | Intel / Altera - same |
| Logic Elements | 5136 LEs | 5136 LEs | 5136 LEs | 5136 LEs | 10320 LEs (~2x) | 24624 LEs (~5x) |
| Total Memory Bits | 423936 | 423936 | 423936 | 423936 | 423936 | 608256 |
| Embedded 18x18 Multipliers | 23 | 23 | 23 | 23 | 46 | 66 |
| PLLs | 2 | 2 | 2 | 2 | 2 | 4 |
| Maximum User I/Os | 182 | 182 | 182 | 182 | 182 | 156 (fewer per FBGA-256 pinmap) |
| Speed Grade | C6 (commercial) | C6 | C8 (slower, -1 bin) | A7 (industrial temp) | C6 | C8 |
| Operating Temperature | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | -40 C to +125 C | 0 C to +85 C | 0 C to +85 C |
关键差异点
- Commercial temperature grade with lead-free RoHS compliance （对比 EP3C5F256A7N)
- Higher speed grade (C6) than C8 variant （对比 EP3C5F256C8N)
- Lowest-cost entry point within Cyclone III 5K-LE family （对比 EP3C10F256C6N)
设计说明
The EP3C5F256C6N core runs on 1.2 V supplied by an external regulator. Decoupling follows the Intel Cyclone III handbook recommendation: bulk 100 uF aluminum-polymer on the 1.2 V rail plus 0.1 uF and 0.01 uF ceramics per power pin pair. I/O banks require separate VCCIO rails (1.2 V to 3.3 V) per bank. Estimated: at 100 MHz core logic with 50% toggle, typical core dissipation is ~300 mW plus dynamic I/O losses. Keep PLL analog supplies (VCC_PLL) filtered with ferrite beads and decoupled with 0.1 uF + 10 uF per PLL.
The 256-ball FBGA package has 1.0 mm pitch - escape routing requires microvia HDI PCB stackup (4-4-6 minimum). Route all signal breaks on inner layers to keep top-layer fanout short. Per the Intel FBGA-256 land pattern, four inner-row power/ground balls should be connected to planes with multiple vias for thermal and electrical integrity. Estimated: a 4-layer 1 oz copper stackup with 0.4 mm microvias is sufficient for low-density designs; 6-layer is recommended above 100 MHz.
Avoid hot-swapping JTAG chains when the FPGA is unpowered - this can latch up I/O banks. Always configure unused I/O pins as tri-stated inputs with weak pull-up in the Quartus II pin planner. Do not confuse the EP3C5F256C6N (commercial + lead-free) with the EP3C5F256A7N (industrial temperature) - the speed grade letter and temp suffix are both critical. Use AS mode configuration with a serial flash such as EPCS16 for standalone boot. JTAG pull-up resistors on TCK, TMS, TDI (4.7 kohm to VCCIO_8) prevent configuration errors at power-up.
Place the configuration flash within 25 mm of the FPGA DATA0/DCLK pins to meet Quartus II AS mode timing. Route the clock input on a dedicated CLK pin with controlled-impedance stripline. Match length on DDR/DDR2 SDRAM byte groups to within +/-25 ps. Estimated: the FBGA-256 supports up to 4 DDR byte lanes when configured for external memory. The Intel Cyclone III handbook pinout file lists specific DQ/DQS groupings; consult this before locking the PCB layout.
合规信息
RoHS compliance and lead-free status confirmed by distributor listings (DigiKey, Mouser, LCSC) as of 2026-09-09. REACH, halogen-free, and conflict-minerals declarations are not explicitly stated in the verified web data and should be verified with Intel's environmental compliance documentation before use in restricted markets.
