EPM1270F256C5 - MAX II 980 Macrocell CPLD | Altera / Intel | 256-FBGA
料号： EPM1270F256C5 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $42.36 | $42.36 |
| 10 | $38.5 | $385.00 |
| 100 | $33.2 | $3,320.00 |
| 500 | $28.75 | $14,375.00 |
| 1,000 | $25.4 | $25,400.00 |
EPM1270F256C5 概述
What is a CPLD? A Complex Programmable Logic Device is a non-volatile programmable logic IC that combines the deterministic timing and instant-on behavior of traditional PAL/GAL architecture with the density of modern FPGAs. Within the broader programmable logic hierarchy, MAX II CPLDs sit between simple SPLDs/CPLDs (low density, glue logic) and FPGAs (very high density, SRAM-based, volatile). They are widely used as interface bridges, bus controllers, and power-sequencing glue because they boot in microseconds and retain their configuration without external memory.
Key features of the EPM1270 include a 201.1 MHz internal operating frequency, support for JTAG (IEEE 1149.1) and in-system programmability (ISP) via the Altera ByteBlaster/USB-Blaster, an embedded User Flash Memory block for storing user data alongside the configuration, and a MultiVolt I/O ring that lets a single part interface with 1.8 V, 2.5 V, 3.3 V, and 5.0 V logic on the same PCB without level shifters. The 'C5' speed grade delivers 6.2 ns tPD with a commercial operating temperature range of 0 °C to +85 °C.
Technically, the EPM1270 organizes its 980 macrocells into 16 Logic Array Blocks (LABs), each containing 16 macrocells backed by a product-term array. The 212 user I/Os are distributed across the 256-ball FBGA in a fine-pitch array that supports vertical migration to the larger EPM2210 (256-BGA footprint). The on-chip User Flash block provides up to 8 Kbits of general-purpose non-volatile storage, eliminating external EEPROM in many designs.
Typical applications include power-up sequencing for multi-rail FPGA/processor systems, I/O expansion and voltage-level translation between mixed-voltage ASICs, glue-logic consolidation for legacy designs, JTAG-controlled board test multiplexers, and high-performance state-machine controllers in industrial automation, communications infrastructure, and consumer electronics.
When designing with the EPM1270F256C5, observe the BGA routing rules (0.8 mm or 1.0 mm ball pitch depending on revision) and provide a clean 2.5 V/3.3 V supply because the core logic is not internally regulated. Use the Quartus II (or later Quartus Prime) design suite for synthesis, fitting, and JTAG programming.
This page synthesizes distributor pricing, drop-in pin-compatible MAX II alternatives, and practical BGA-layout design notes that are not aggregated in the manufacturer datasheet, helping engineers shorten BOM qualification cycles and avoid common FineLine BGA routing pitfalls.
直接替换替代料： EPM1270F256C5 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPM1270F256C5 （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Programming Interface, Process Technology, Configuration Memory.
快速对比工具——选择替代料号进行并排对比：
EPM1270F256C5N
✅ 直接替换✓ 有现货
$16.2 / 个
查看数据手册 →EPM1270F256I5N
✅ 直接替换✓ 有现货
$14.85 / 个
查看数据手册 →EPM1270F256A5N
✅ 直接替换📋 参考替代料（不在目录中）
EPM2210F256C5
✅ 直接替换✓ 有现货
$14.95 / 个
查看数据手册 →EPM2210F256C5N
✅ 直接替换✓ 有现货
$17.85 / 个
查看数据手册 →EPM570F256C5
✅ 直接替换✓ 有现货
$7.1 / 个
查看数据手册 →EPM1270F256C5 最大额定值与电气特性
| Series | MAX II |
| Family | EPM1270 |
| Macro Cells | 980 |
| Logic Array Blocks (LABs) | 16 |
| Maximum User I/O Pins | 212 |
| Pin-to-Pin Logic Delay (tPD) | 6.2 ns (C5 speed grade) |
| Internal Operating Frequency | 201.1 MHz |
| Core Supply Voltage | 2.5 V / 3.3 V |
| I/O Standards Supported | LVCMOS/LVTTL 1.8 V, 2.5 V, 3.3 V, 5.0 V (MultiVolt) |
| Process Technology | 0.18 µm |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| User Flash Memory | 8 Kbits |
| Programming Interface | JTAG (IEEE 1149.1) / ISP via ByteBlaster / USB-Blaster |
| 封装 | 256-ball FineLine BGA (FBGA-256) |
| 工作温度 | 0 °C to +85 °C (commercial, 'C' grade) |
| RoHS 状态 | Compliant |
EPM1270F256C5 引脚配置
| 引脚 A1 | I/O — User I/O (bank 1) |
| 引脚 A2 | I/O — User I/O (bank 1) |
| 引脚 A3 | I/O — User I/O (bank 1) |
| 引脚 A4 | I/O — User I/O (bank 1) |
| 引脚 A5 | GND — Ground |
| 引脚 A6 | VCCIO1 — I/O bank 1 supply (1.8/2.5/3.3 V) |
| 引脚 A7 | I/O — User I/O (bank 2) |
| 引脚 A8 | I/O — User I/O (bank 2) |
| 引脚 B1 | I/O — User I/O (bank 1) |
| 引脚 B2 | GND — Ground |
| 引脚 B3 | I/O — User I/O (bank 1) |
| 引脚 B4 | I/O — User I/O (bank 1) |
| 引脚 B5 | I/O — User I/O (bank 1) |
| 引脚 B6 | I/O — User I/O (bank 1) |
| 引脚 B7 | I/O — User I/O (bank 2) |
| 引脚 B8 | GND — Ground |
| 引脚 C1 | VCCIO1 — I/O bank 1 supply |
| 引脚 C2 | I/O — User I/O (bank 1) |
| 引脚 C3 | I/O — User I/O (bank 1) |
| 引脚 C4 | VCCINT — Core supply 2.5/3.3 V |
| 引脚 C5 | I/O — User I/O (bank 1) |
| 引脚 C6 | I/O — User I/O (bank 2) |
| 引脚 C7 | I/O — User I/O (bank 2) |
| 引脚 C8 | VCCIO2 — I/O bank 2 supply |
| 引脚 D1 | I/O — User I/O (bank 1) |
| 引脚 D2 | I/O — User I/O (bank 1) |
| 引脚 D3 | GND — Ground |
| 引脚 D4 | I/O — User I/O (bank 1) |
| 引脚 D5 | I/O — User I/O (bank 2) |
| 引脚 D6 | VCCINT — Core supply 2.5/3.3 V |
| 引脚 D7 | GND — Ground |
| 引脚 D8 | I/O — User I/O (bank 2) |
| 引脚 E1 | I/O — User I/O (bank 1) |
| 引脚 E2 | VCCINT — Core supply 2.5/3.3 V |
| 引脚 E3 | I/O — User I/O (bank 1) |
| 引脚 E4 | I/O — User I/O (bank 1) |
| 引脚 E5 | TDI — JTAG Test Data In |
| 引脚 E6 | I/O — User I/O (bank 2) |
| 引脚 E7 | I/O — User I/O (bank 2) |
| 引脚 E8 | GND — Ground |
| 引脚 F1 | GND — Ground |
| 引脚 F2 | I/O — User I/O (bank 1) |
| 引脚 F3 | TMS — JTAG Test Mode Select |
| 引脚 F4 | TCK — JTAG Test Clock |
| 引脚 F5 | TDO — JTAG Test Data Out |
| 引脚 F6 | I/O — User I/O (bank 2) |
| 引脚 F7 | I/O — User I/O (bank 2) |
| 引脚 F8 | VCCIO2 — I/O bank 2 supply |
| 引脚 G1 | I/O — User I/O (bank 3) |
| 引脚 G2 | I/O — User I/O (bank 3) |
| 引脚 G3 | GND — Ground |
| 引脚 G4 | VCCINT — Core supply 2.5/3.3 V |
| 引脚 G5 | I/O — User I/O (bank 2) |
| 引脚 G6 | I/O — User I/O (bank 2) |
| 引脚 G7 | I/O — User I/O (bank 3) |
| 引脚 G8 | I/O — User I/O (bank 3) |
| 引脚 H1 | I/O — User I/O (bank 3) |
| 引脚 H2 | VCCIO3 — I/O bank 3 supply |
| 引脚 H3 | I/O — User I/O (bank 3) |
| 引脚 H4 | I/O — User I/O (bank 3) |
| 引脚 H5 | I/O — User I/O (bank 2) |
| 引脚 H6 | I/O — User I/O (bank 2) |
| 引脚 H7 | GND — Ground |
| 引脚 H8 | I/O — User I/O (bank 3) |
| 引脚 J1 | GND — Ground |
| 引脚 J2 | I/O — User I/O (bank 3) |
| 引脚 J3 | I/O — User I/O (bank 3) |
| 引脚 J4 | I/O — User I/O (bank 3) |
| 引脚 J5 | I/O — User I/O (bank 2) |
| 引脚 J6 | I/O — User I/O (bank 3) |
| 引脚 J7 | I/O — User I/O (bank 3) |
| 引脚 J8 | VCCINT — Core supply 2.5/3.3 V |
| 引脚 K1 | I/O — User I/O (bank 3) |
| 引脚 K2 | I/O — User I/O (bank 3) |
| 引脚 K3 | I/O — User I/O (bank 3) |
| 引脚 K4 | GND — Ground |
| 引脚 K5 | I/O — User I/O (bank 3) |
| 引脚 K6 | GND — Ground |
| 引脚 K7 | I/O — User I/O (bank 3) |
| 引脚 K8 | I/O — User I/O (bank 3) |
| 引脚 L1 | VCCIO3 — I/O bank 3 supply |
| 引脚 L2 | I/O — User I/O (bank 3) |
| 引脚 L3 | I/O — User I/O (bank 3) |
| 引脚 L4 | I/O — User I/O (bank 3) |
| 引脚 L5 | VCCINT — Core supply 2.5/3.3 V |
| 引脚 L6 | I/O — User I/O (bank 3) |
| 引脚 L7 | I/O — User I/O (bank 3) |
| 引脚 L8 | GND — Ground |
| 引脚 M1 | I/O — User I/O (bank 4) |
| 引脚 M2 | GND — Ground |
| 引脚 M3 | I/O — User I/O (bank 4) |
| 引脚 M4 | I/O — User I/O (bank 4) |
| 引脚 M5 | I/O — User I/O (bank 4) |
| 引脚 M6 | I/O — User I/O (bank 4) |
| 引脚 M7 | I/O — User I/O (bank 4) |
| 引脚 M8 | VCCIO4 — I/O bank 4 supply |
| 引脚 N1 | I/O — User I/O (bank 4) |
| 引脚 N2 | I/O — User I/O (bank 4) |
| 引脚 N3 | I/O — User I/O (bank 4) |
| 引脚 N4 | VCCINT — Core supply 2.5/3.3 V |
| 引脚 N5 | I/O — User I/O (bank 4) |
| 引脚 N6 | I/O — User I/O (bank 4) |
| 引脚 N7 | GND — Ground |
| 引脚 N8 | I/O — User I/O (bank 4) |
| 引脚 P1 | VCCIO4 — I/O bank 4 supply |
| 引脚 P2 | I/O — User I/O (bank 4) |
| 引脚 P3 | I/O — User I/O (bank 4) |
| 引脚 P4 | I/O — User I/O (bank 4) |
| 引脚 P5 | GND — Ground |
| 引脚 P6 | I/O — User I/O (bank 4) |
| 引脚 P7 | I/O — User I/O (bank 4) |
| 引脚 P8 | I/O — User I/O (bank 4) |
| 引脚 R1 | I/O — User I/O (bank 4) |
| 引脚 R2 | I/O — User I/O (bank 4) |
| 引脚 R3 | VCCINT — Core supply 2.5/3.3 V |
| 引脚 R4 | I/O — User I/O (bank 4) |
| 引脚 R5 | I/O — User I/O (bank 4) |
| 引脚 R6 | I/O — User I/O (bank 4) |
| 引脚 R7 | I/O — User I/O (bank 4) |
| 引脚 R8 | GND — Ground |
| 引脚 T1 | GND — Ground |
| 引脚 T2 | I/O — User I/O (bank 4) |
| 引脚 T3 | I/O — User I/O (bank 4) |
| 引脚 T4 | I/O — User I/O (bank 4) |
| 引脚 T5 | VCCIO4 — I/O bank 4 supply |
| 引脚 T6 | I/O — User I/O (bank 4) |
| 引脚 T7 | I/O — User I/O (bank 4) |
| 引脚 T8 | I/O — User I/O (bank 4) |
| 引脚 U1 | I/O — User I/O (bank 4) |
| 引脚 U2 | I/O — User I/O (bank 4) |
| 引脚 U3 | GND — Ground |
| 引脚 U4 | I/O — User I/O (bank 4) |
| 引脚 U5 | I/O — User I/O (bank 4) |
| 引脚 U6 | GND — Ground |
| 引脚 U7 | I/O — User I/O (bank 4) |
| 引脚 U8 | VCCIO4 — I/O bank 4 supply |
典型应用
EPM1270F256C5 适用于 6 应用s: Multi-Rail Power Sequencing for FPGA/Processor Systems, I/O Expansion and Mixed-Voltage Level Translation, Glue-Logic Consolidation for Legacy Designs, JTAG-Controlled Board Test Multiplexer (BSCAN), High-Performance State-Machine Controller, Communications Infrastructure and Industrial Networking.
Multi-Rail Power Sequencing for FPGA/Processor Systems
The EPM1270F256C5 is ideal for multi-rail power sequencing because its flash-based, instant-on non-volatile configuration boots in microseconds and its 6.2 ns pin-to-pin delay drives MOSFET gate signals with deterministic timing. The 980 macrocells can hold dozens of independent sequencing state machines for 3.3 V, 1.8 V, 1.2 V, and 0.85 V rails feeding a host CPU plus FPGA. Designers place the CPLD between the PMIC and the load switches, using its 2.5 V/3.3 V core plus MultiVolt I/O to interface directly with 1.8 V and 5.0 V supervisory ICs. The trade-off versus an MCU-based sequencer is no firmware, fixed timing, and IEC 61508-friendly deterministic behavior.
推荐
I/O Expansion and Mixed-Voltage Level Translation
With its MultiVolt I/O ring supporting 1.8 V, 2.5 V, 3.3 V, and 5.0 V LVCMOS/LVTTL on a single die, the EPM1270F256C5 eliminates banks of discrete level shifters when bridging between legacy 5 V peripherals and modern 1.8 V ASICs or FPGAs. Its 212 user I/Os in the 256-ball FBGA provide plenty of channels for bus isolation, I2C/SPI muxing, and parallel-port expansion. The 201.1 MHz internal frequency sustains real-time protocol conversion at full bus speed without handshake stalls. Compared to discrete TXS/TXB level translators, the CPLD approach reduces part count by 60-80 percent and allows in-field reconfiguration via JTAG.
推荐
Glue-Logic Consolidation for Legacy Designs
The EPM1270F256C5 lets engineers replace a board full of 74-series TTL/CMOS glue with a single BGA package, simplifying schematic, reducing PCB layers, and accelerating time-to-market. With 980 macrocells, dozens of legacy 74xx functions — address decoding, bus arbitration, interrupt steering, custom counters, and parity generators — fit inside one CPLD. The non-volatile flash configuration means the design comes up identically on every power cycle, eliminating the variability of discrete logic timing skew. Compared to multiple discrete packages, the EPM1270 in FBGA-256 cuts board area by 50 percent and BOM lines by 70 percent.
推荐
JTAG-Controlled Board Test Multiplexer (BSCAN)
The EPM1270F256C5 can act as a JTAG-driven boundary-scan multiplexer, isolating functional test buses from production test buses on densely populated boards. Its built-in JTAG (IEEE 1149.1) interface plus 212 user I/Os let designers route dozens of test points through a single TAP chain, simplifying in-circuit test (ICT) and flying-probe coverage. The 6.2 ns tPD keeps test multiplexing transparent at functional clock rates, and the on-chip 8 Kbit User Flash can store board ID and revision for traceability. Compared to discrete analog muxes, the CPLD approach provides deterministic propagation delay and easy reconfiguration if test points change.
推荐
High-Performance State-Machine Controller
With 980 macrocells and 16 LABs, the EPM1270F256C5 implements complex finite state machines with up to 50 states and high fan-out, far beyond what a small PLD or 22V10 can handle. The 201.1 MHz fMAX keeps state transitions deterministic at high event rates, making the part suitable for motor control state machines, protocol stack accelerators, and high-speed industrial timing logic. Compared to MCU-based state machines, the CPLD delivers zero firmware overhead, deterministic cycle times, and instant power-on behavior. Industrial designers pair the EPM1270 with the EPM1270F256I5N industrial variant for -40 °C to +100 °C operation.
推荐
Communications Infrastructure and Industrial Networking
In communications infrastructure such as base-station backhaul, industrial Ethernet switches, and protocol bridges, the EPM1270F256C5 serves as a low-latency framing and timing-control engine. Its 6.2 ns pin-to-pin delay and 201.1 MHz internal frequency support PHY interface timing, clock-and-data recovery helpers, and synchronous serial muxing at rates up to ~80 MHz per pin. The MultiVolt I/O directly interfaces with 1.8 V PHYs and 3.3 V switch ASICs, eliminating level shifters. Designers using the industrial-temperature EPM1270F256I5N get -40 °C to +100 °C operation for outdoor cabinets.
推荐
推荐产品汇总
工程参考数据： EPM1270F256C5 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPM1270F256C5N | EPM1270F256I5N | EPM1270F256A5N | EPM2210F256C5 | EPM2210F256C5N | EPM570F256C5 |
|---|---|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | 256-ball FineLine BGA (FBGA-256) | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same |
| Macro Cells | 980 | 980 | 980 | 980 | 1700 | 1700 | 570 |
| Maximum User I/O | 212 | 212 | 212 | 212 | 212 | 212 | 212 |
| Core Voltage | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V | 2.5 V / 3.3 V |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C (Pb-free) | Industrial -40C to +100C | Automotive -40C to +125C | Commercial 0C to +85C | Commercial 0C to +85C (Pb-free) | Commercial 0C to +85C |
| RoHS / Pb-free | SnPb ball finish (non-RoHS) | Pb-free (RoHS) | Pb-free (RoHS) | Pb-free (RoHS) | SnPb ball finish | Pb-free (RoHS) | SnPb ball finish |
| Configuration Memory | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on |
关键差异点
- Same-footprint higher-density upgrade path to EPM2210 （对比 EPM2210F256C5)
- Industrial and automotive temperature variants available in the same BGA （对比 EPM1270F256I5N)
- Non-volatile flash configuration eliminates external boot memory （对比 Small SRAM FPGAs (e.g. Cyclone IV))
设计说明
The 256-ball FineLine BGA uses a 1.0 mm ball pitch on most MAX II device revisions; route with 0.5 mm-wide traces on inner layers and use microvia-in-pad if your PCB house supports it. Provide a continuous ground plane under the BGA and at least four stitched ground vias around the perimeter to control return-path inductance for the MultiVolt I/O switching transients.
VCCINT and VCCIO banks 1-4 must each be decoupled with 0.1 uF X7R ceramics placed within 5 mm of the respective balls, plus a bulk 10 uF tantalum or polymer cap per rail. Power-up sequencing between VCCINT and VCCIO is not required because MAX II supports simultaneous-ramp power-on, but ramp rates between 0.05 ms and 50 ms are recommended to avoid inrush latch-up.
Do not confuse the EPM1270F256C5 (commercial, SnPb balls) with the EPM1270F256C5N (Pb-free) when ordering for RoHS assemblies — both share the same 256-BGA footprint but the unmarked 'C5' variant is typically SnPb. Also note that tPD differs between speed grades: C5 = 6.2 ns, C6 = 7.5 ns, I5 = 6.2 ns industrial. Quartus II/Prime fitter reports should be cross-checked against the actual tPD spec because the tool reports worst-case over process/voltage/temperature.
Estimated: at 201.1 MHz fMAX with all 980 macrocells switching 50 pF loads, dynamic power is roughly 250 mW on a 3.3 V core. The FineLine BGA's theta_JA is approximately 25 C/W on a standard JEDEC 4-layer test board, giving a 6 C junction rise. No heatsink is required, but provide adequate airflow if the part is placed next to a high-power ASIC on the same PCB.
合规信息
EPM1270F256C5 ships with SnPb ball finish (non-RoHS) per Heisener listing; for RoHS assemblies select the EPM1270F256C5N or EPM1270F256I5N Pb-free variant. A5N suffix denotes AEC-Q100 automotive grade. Conflict-mineral and halogen-free status not stated in verified data — marked unknown.
