EP3C16E144I7 - 15,408 L-Cell Cyclone III FPGA | Intel
料号： EP3C16E144I7 ✓ 量产中EP3C16E144I7 概述
An FPGA is a reconfigurable digital semiconductor. Its lookup logic, registers, programmable interconnect, and memory resources can be configured after manufacture to implement a defined digital circuit. Within the product hierarchy, the EP3C16E144I7 is a Cyclone III FPGA, a member of the field-programmable gate array and programmable-logic semiconductor family. It is selected when designers need hardware-level parallelism and updateable logic rather than the fixed peripheral set and sequential execution model of a microcontroller.
The verified device listing identifies 15,408 logic cells, 84 I/O, and a 144-LQFP exposed-pad package. Its industrial temperature grade supports equipment intended for factory, industrial-control, communications, and embedded-processing environments. The exposed thermal pad provides a direct thermal path from the device to the PCB, but designers still need an appropriate land pattern, vias, and copper area to dissipate junction heat effectively.
The 144-pin package is described in the verified data as a 20 x 20 mm square LFQFP with 0.40 mm pitch and 144 terminals. Fine pitch requires careful PCB design, particularly for via-in-pad avoidance, solder-paste control, assembly cleaning, and inspection. The exposed pad should be connected to the intended ground plane according to the manufacturer's package guidance and should not be treated as an interchangeable thermal-only feature without checking the land pattern.
Typical uses include industrial automation, communications infrastructure, embedded control, video and image processing, test equipment, and general-purpose digital prototyping. Because the logic fabric is programmable, the same FPGA family can support multiple interface standards and parallel data paths. The 84 available I/O are particularly relevant for designs requiring parallel sensors, data buses, control signals, status indicators, or high-speed external interfaces.
Before layout or sourcing, engineers should download the Cyclone III device handbook and EP3C16 device documentation, then verify the exact pin names, bank voltages, power requirements, configuration method, and exposed-pad connection against the intended design. The supplied search evidence confirms the core identity and package but does not include a complete pin table or electrical limits, so those details must not be inferred from the 144-pin count alone.
This product record combines verified distributor identity, package, logic-cell, and I/O information with same-package migration guidance, selection criteria, and practical design considerations. It distinguishes confirmed attributes from unavailable specifications, helping engineers identify candidates without confusing a package-compatible option with a fully verified functional replacement.
直接替换替代料： EP3C16E144I7 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3C16E144I7 （相同外形与封装尺寸） ——差异在于 Package, Process Technology, Operating Temperature, RoHS Status, Total Memory Bits.
EP3C16E144C8N
✅ 直接替换联系询价
查看数据手册 →EP3C16E144A7N
✅ 直接替换📋 参考替代料（不在目录中）
EP3C10E144I7N
✅ 直接替换联系询价
查看数据手册 →EP3C16E144I7N
✅ 直接替换联系询价
查看数据手册 →EP3C16Q144I7N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP3C16E144I7 最大额定值与电气特性
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Cyclone III |
| Logic Cells | 15,408 |
| I/O Count | 84 |
| 封装 | 144-LQFP Exposed Pad |
| Package Code | LFQFP |
| Package Body Size | 20 x 20 mm |
| Package Pitch | 0.40 mm |
| 引脚数量 | 144 |
| Terminal Type | Gull wing |
| Package Shape | Square |
| Temperature Grade | Industrial |
| 安装类型 | Surface Mount |
EP3C16E144I7 square 引脚配置指南
EP3C16E144I7（square 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3C16E144I7.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3C16E144I7 适用于 6 应用s: Industrial Automation and Control, Communications and Network Interface, Embedded Control Platform, Video and Image Processing, Test and Measurement Equipment, Programmable Logic and Prototyping.
Industrial Automation and Control
The Intel EP3C16E144I7 fits industrial control systems that combine machine I/O, sequencing, interlocks, and communications in one programmable device. Its verified 84 I/O provide external connections for sensors, actuators, encoders, status indicators, and field-bus transceivers, while 15,408 logic cells can implement control logic, state machines, and protocol handling. The industrial temperature classification supports factory equipment, subject to confirmation of the full operating limits. Designers should assign compatible I/O standards to the correct power banks and verify timing through Quartus. The exposed pad requires a thermal-via array and uninterrupted copper connection to the recommended ground plane.
推荐
Communications and Network Interface
The EP3C16E144I7 is suitable for configurable communications front ends that must combine framing, packet filtering, buffering, and control logic. Its 15,408 logic cells provide parallel hardware implementation, while the verified 84 I/O can connect transceivers, clock signals, resets, and status indicators without relying entirely on a sequential processor. A design could implement a custom protocol bridge or low-rate telemetry engine around Ethernet, serial, or industrial-network PHYs. Engineers must confirm supported I/O standards, bank voltages, and timing from the official documentation before assigning external interfaces, and should use the same speed-grade migration tables used for any alternative FPGA.
推荐
Embedded Control Platform
The Intel EP3C16E144I7 can serve as a dedicated embedded-logic controller when deterministic parallel operation and reconfigurable hardware are more valuable than a microcontroller’s software ecosystem. The 15,408 logic cells can implement multiple state machines, counters, timing units, arithmetic blocks, and hardware interlocks, while the 84 I/O support sensors and actuators. A practical architecture may pair the FPGA with external flash for configuration and a microcontroller for supervisory functions. Before schematic release, verify configuration pins, supported clock sources, core voltage, I/O bank restrictions, and exposed-pad grounding against the Cyclone III handbook and the selected board power plan.
推荐
Video and Image Processing
The EP3C16E144I7 is applicable to parallel pixel pipelines, timing generation, color processing, and interface bridging where programmable logic offers deterministic throughput. Its verified 84 I/O are useful for low-resolution or segmented video interfaces, and the 15,408 logic cells can implement parallel filters, line buffers, counters, and synchronization logic. The device is better suited to modest parallel pipelines than resource-intensive high-definition codecs unless an external processor handles those functions. Engineers should establish exact timing budgets, I/O voltage compatibility, and clock-domain constraints in Quartus, while ensuring the exposed pad and PCB vias are designed for worst-case activity and temperature.
推荐
Test and Measurement Equipment
The EP3C16E144I7 can implement programmable timing, pattern generation, acquisition control, and instrument-interface logic in industrial test and measurement products. Its parallel architecture supports deterministic sequences across the 84 I/O, while 15,408 logic cells allow multiple counters, trigger paths, and data-formatting blocks to coexist. This is useful where precise timing must be maintained without the latency variability of general-purpose software. Designers should verify clock quality, I/O standards, and timing closure for the required measurement bandwidth. If replacing the target with an E144 migration option, compare timing grades explicitly because the package match alone does not establish equivalent performance.
推荐
Programmable Logic and Prototyping
The Intel EP3C16E144I7 is appropriate for FPGA prototyping, custom accelerator development, and education platforms where 15,408 logic cells and 84 I/O provide substantial design capacity in a 144-LQFP package. Engineers can implement parallel datapaths, instruction decoding, memory interfaces, and peripheral bridges while keeping the assembly footprint compact. The fine 0.40 mm package pitch requires a capable PCB process and careful assembly process control, especially when using the exposed-pad option. Project teams should also confirm configuration storage, clock connectivity, supported I/O standards, and the exact pin map before releasing a new PCB because the available search data does not enumerate the 144 pins.
推荐
推荐产品汇总
工程参考数据： EP3C16E144I7 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3C16E144C8N | EP3C16E144A7N | EP3C10E144I7N | EP3C16E144I7N | EP3C16Q144I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad |
| FPGA Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
| Ordering Suffix | I7 | C8N | A7N | I7N | I7N | I7N |
关键差异点
- Higher logic density than the EP3C10 migration option （对比 EP3C10E144I7N)
- Direct industrial-temperature ordering （对比 EP3C16E144C8N)
- Same-package migration family without package conversion （对比 EP3C16E144A7N)
- Broader density margin than the EP3C10 candidate （对比 EP3C10E144I7N)
设计说明
Treat the exposed pad as both a package feature and a required PCB thermal path. Follow the official E144 land-pattern drawing for pad dimensions, antipads, and via arrangement. Connect the pad to the recommended ground plane with multiple thermal vias rather than relying on a single via. Because the supplied sources do not provide junction-temperature limits or thermal resistance, final thermal qualification must use the manufacturer data and worst-case ambient temperature, core activity, and supply voltage.
The 0.40 mm pitch LQFP requires a PCB process and assembly process capable of resolving 144 fine-pitch leads plus the exposed pad. Verify pad-to-mask and paste-to-pad ratios with the assembly house, control solder bridging during reflow, and plan adequate inspection. Do not substitute a generic 144-LQFP footprint: the verified target is specifically the E144 exposed-pad variant, so exposed-pad geometry, lead dimensions, and via placement must be checked against the official package drawing.
Do not treat a matching package name as proof that every ordering code is a drop-in replacement. EP3C16E144C8N and EP3C16E144A7N appear in verified comparisons, but their speed or grade ordering differs from I7. EP3C10E144I7N has a different density, while the EP3C16Q144I7N candidate needs exact resource and pin verification. Before substitution, compare the Cyclone III migration table, timing grade, temperature grade, power behavior, configuration scheme, pin map, and Quartus fit.
Design the supply rails only after assigning every external signal to a compatible I/O bank and checking the official voltage limits for core, auxiliary, and I/O supplies. Decoupling should follow the manufacturer’s recommended network, with short, low-impedance connections and return paths referenced to the same ground plane. The supplied excerpts do not identify rail voltages or permitted combinations, so values must not be inferred from the package or logic-cell count.
Route clocks, high-speed interfaces, and configuration signals with controlled return paths, while keeping the exposed-pad thermal-via array clear of unintended voids. Match external interface standards to the correct I/O bank and keep sensitive inputs away from noisy switching nodes where practical. Because no complete verified pinout or bank map is present in the supplied data, the final schematic and layout must be cross-checked against the official Cyclone III E144 pin and package documents.
合规信息
The supplied excerpts do not state target-specific RoHS, REACH, lead-free, halogen-free, conflict-minerals, or automotive-qualification status. AEC-Q100 is not applicable because the device is an industrial-grade FPGA rather than an automotive-qualified component in the supplied data.
