EP3C16E144I7 vs EP3C16E144I7N 对比

详细并排对比 EP3C16E144I7 出自 Intel 和 EP3C16E144I7N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3C16E144I7 EP3C16E144I7N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Cyclone III —
Logic Cells 15,408 —
I/O Count 84 —
封装 144-LQFP Exposed Pad 144-LQFP Exposed Pad (EQFP-144)
Package Code LFQFP —
Package Body Size 20 x 20 mm —
Package Pitch 0.40 mm —
引脚数量 144 —
Terminal Type Gull wing —
Package Shape Square —
Temperature Grade Industrial —
安装类型 Surface Mount Surface Mount
Embedded Memory [DATA_NEEDED: embedded memory specification] —
Core Supply Voltage [DATA_NEEDED: core supply voltage] —
I/O Supply Voltage [DATA_NEEDED: I/O supply voltage] —
工作温度范围 [DATA_NEEDED: operating temperature range] —
Configuration Interface [DATA_NEEDED: configuration interface] —
RoHS 状态 [DATA_NEEDED: RoHS status] —
Series — Cyclone III
Logic Elements — 15,408
Total RAM Bits — 516,096 bits
Maximum User I/O — 84
Number of Logic Array Blocks (LABs) — 963
Embedded 18x18 Multipliers — 56
PLLs — 4
Global Clock Networks — 20
Core Voltage — 1.2 V
I/O Bank Voltage Support — 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V
工作温度 — -40C to +100C (industrial, junction)
Speed Grade — 7 (I7)
Lead-Free / RoHS — Yes (lead-free finish, RoHS compliant per manufacturer product page)
Process Technology — 65 nm low-power CMOS
Configuration Scheme — Active serial, passive serial, JTAG

数据手册与资源

浏览全部产品 创建 BOM 获取报价