EP3SE260H780C2 - Stratix III E 260K LE FPGA | Altera | 780-BGA
料号： EP3SE260H780C2 ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2450 | $2,450.00 |
| 10 | $2380 | $23,800.00 |
| 100 | $2295 | $229,500.00 |
| 500 | $2210 | $1,105,000.00 |
| 1,000 | $2150 | $2,150,000.00 |
EP3SE260H780C2 概述
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and high-speed transceivers into a single silicon die. Stratix III sits in the FPGA -> programmable logic -> semiconductor hierarchy and is widely used in applications requiring parallel processing, high throughput DSP, and tight integration of memory with logic. The EP3SE260 logic-density variant is the largest of the Stratix III Enhanced (E) family.
Key features include 16,672,768 bits of embedded RAM (approximately 2,040 Kbytes), 768 18x18 multipliers for DSP, support for external memory interfaces up to DDR3/RLDRAM II/QDR II+ at 533 MHz, and rich clock-management via PLLs. The device is offered in this 780-ball FCBGA with 488 user I/Os in the commercial 0C to 85C temperature grade.
Typical applications include high-end ASIC prototyping, wireline telecommunications line-card processing, military/aerospace signal processing, broadcast video infrastructure, and high-performance computing accelerators. The wide memory bandwidth and abundant DSP make it ideal for parallel algorithms such as FFTs, channel cards, and radar baseband.
When designing, plan for the 780-ball FCBGA's 1.0 mm ball pitch, which requires microvia-capable PCB stack-ups and matched-length routing on high-speed memory interfaces. Sequential power sequencing on the multiple core and I/O rails is mandatory during power-up.
This page synthesizes current distributor inventory, same-brand Stratix III variants, and design notes for engineers evaluating a drop-in replacement or sourcing alternatives for the EP3SE260H780C2.
直接替换替代料： EP3SE260H780C2 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3SE260H780C2 （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, RoHS Status, Core Voltage, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
EP3SE260H780C3N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1325 / 个
查看数据手册 →EP3SE260H780C4
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3150 / 个
查看数据手册 →EP3SE260H780I4N
✅ 直接替换✓ 有现货
$2150 / 个
查看数据手册 →EP3SE260H780C2N
✅ 直接替换✓ 有现货
$3600 / 个
查看数据手册 →EP3SE260H780C2G
✅ 直接替换📋 参考替代料（不在目录中）
EP3SE260H780C2 最大额定值与电气特性
| Family | Stratix® III E |
| Series | Stratix III |
| Logic Elements (LE) | 255,000 |
| Adaptive Logic Modules (ALM) | 102,000 |
| Embedded Memory (bits) | 16,672,768 |
| User I/Os | 488 |
| Number of LABs/CLBs | 10,200 |
| Process Node | 65 nm |
| Core Voltage | 0.86 V to 1.15 V |
| 封装 | 780-BBGA, FCBGA |
| 安装类型 | Surface Mount |
| 工作温度 | 0C to +85C (Commercial) |
| RoHS 状态 | Compliant |
| Lead Free | Yes |
| MSL 等级 | 3 (per JEDEC J-STD-020) |
EP3SE260H780C2 780-bbga, fcbga 引脚配置指南
EP3SE260H780C2（780-bbga, fcbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3SE260H780C2.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3SE260H780C2 适用于 6 应用s: ASIC Prototyping, Wireline Telecom Line Card, Military and Aerospace Signal Processing, Broadcast Video Infrastructure, High-Performance Computing Accelerator, Medical Imaging Back-End.
ASIC Prototyping
The EP3SE260H780C2's 255,000 logic elements, 16,672,768 bits of embedded memory, and 768 18x18 multipliers make it one of the few devices in 2010-2014 era capable of absorbing full-complexity ASIC RTL for pre-silicon verification. Place between a host workstation and the final ASIC to run real-world workloads at near-silicon speed using the Stratix III 65 nm process. The 488 user I/Os in the 780-BBGA package map to ASIC pads with 1:1 pin assignment, and Quartus II's DesignPartitions feature lets the team split RTL across multiple FPGAs. Compared with ASIC tapeout, the cost-per-engineering-hour for bring-up drops by an order of magnitude when ASICs are validated on this device first.
推荐
Wireline Telecom Line Card
The Stratix III E family was designed for 40G/100G optical line cards, and EP3SE260H780C2 specifically handles multi-channel SerDes aggregation, packet classification, and traffic management with deterministic latency. The 488 user I/Os and dedicated DDR3 controllers at 533 MHz support deep packet buffering, while the 768 DSP blocks accelerate FEC and encryption. Industrial-temperature equivalent (EP3SE260H780I4N) is the same die in the same package, easing deployment in outdoor or central-office edge cabinets.
推荐
Military and Aerospace Signal Processing
Defense radar and electronic-warfare subsystems leverage the EP3SE260H780C2's massive DSP throughput - 768 18x18 multipliers running at 600 MHz deliver over 400 GMACs - and its wide memory bandwidth for radar-pulse buffering. With industrial-grade screening (EP3SE260H780I4N variant), the same die operates from -40C to +100C, which is why the part continues to be specified on legacy MIL-STD-810 platforms. PowerPlay power analysis lets designers trade toggle rate against junction temperature before the rad-hard validation step.
推荐
Broadcast Video Infrastructure
Real-time 4K and 8K video processing demands wide data paths and large on-chip frame buffers, both of which the EP3SE260H780C2 delivers through 16.7 Mbits of embedded SRAM and 488 I/Os. Designers typically use the FPGA as a multi-stream SDI switch or a H.264/HEVC pre-processor, with the DDR3 controllers streaming pixel data into external RLDRAM II memory. The 65 nm Stratix III power optimization reduces heat-sink size in compact 1U broadcast chassis.
推荐
High-Performance Computing Accelerator
FPGA-accelerated compute clusters historically used the EP3SE260H780C2 for the compute node itself, with PCIe Gen2 x8 channels and QPI-style fabric links aggregating results across the card. The 255K LEs accommodate full floating-point pipelines built on the 768 DSP blocks, and Quartus II's OpenCL support lets software developers target the device without RTL expertise. For new HPC designs the migration target is Agilex 7 AGF027/AGF035, but the Stratix III E remains in active service in many research labs.
推荐
Medical Imaging Back-End
CT, MRI, and ultrasound systems need parallel processing of high-resolution scans at deterministic frame rates. The EP3SE260H780C2 hosts the image reconstruction pipeline - back-projection, beamforming, or FFT-based reconstruction - inside the 255K LEs, with 16 Mbits of embedded memory absorbing tile-level intermediate results. Medical IEC 60601-1 platforms typically pair this device with an industrial-temperature variant for stable operation in controlled hospital environments.
推荐
推荐产品汇总
工程参考数据： EP3SE260H780C2 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3SE260H780C3N | EP3SE260H780C4 | EP3SE260H780I4N |
|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 780-BBGA, FCBGA | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same |
| Logic Elements | 255,000 | 255,000 | 255,000 | 255,000 |
| Speed Grade | -2 | -3 (slower) | -4 (slowest) | -4 (industrial) |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C |
| Embedded Memory (bits) | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 |
| User I/Os | 488 | 488 | 488 | 488 |
| Transceivers | None (E variant) | None | None | None |
| Lifecycle | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
关键差异点
- Largest density in Stratix III E family （对比 EP3SE110F780C3)
- Industrial temperature grade available in same package （对比 EP3SE260H780C2)
- No transceivers - lowest cost in Stratix III family （对比 EP3SGX110F780C2)
设计说明
The 780-BBGA package has a 1.0 mm ball pitch and requires a PCB with microvia (laser-drilled) stack-up, typically 8-12 layers. Per JEDEC JESD51-9, use a high-Tg FR-4 or low-loss PCB material; place GND stitching vias on a 1.0 mm grid around the BGA escape region to control return-current paths and reduce SSO noise. Power-plane capacitance must hold the core voltage within 3% during simultaneous-switching events.
Estimated: at 0.85 V core, 60% utilization DSP-heavy workload, and 300 MHz toggle rate, junction power is approximately 9 W. With theta_JA around 12-15 C/W (still-air, JEDEC 4-layer board), junction temperature rise is roughly 130-150 C above ambient, which violates the 125 C junction limit unless airflow or a heatsink is added. Add 200 LFM of forced air or a thermal-management BGA lid for reliable operation.
Common pitfalls include omitting the POR (power-on-reset) sequencing - Stratix III requires VCC and VCCAUX to be monotonic and within 100 ms of each other. Decoupling must be per the pin-connection guidelines: 0603-size 0.1 uF X7R on every VCC pin, plus 22 uF bulk caps per voltage rail. Skipping dedicated GND vias under the BGA center creates ground-bounce that corrupts DDR3 read/write timing margins.
For DDR3 up to 533 MHz, follow the Stratix III External Memory Interface Handbook: matched-length within 50 mils on DQ/DQS, 100 ohm differential impedance on DQS pairs, and 1.5 V SSTL or 1.35 V SSTL POD signaling. Use on-chip termination (OCT) to eliminate external series resistors, and validate timing with Quartus II TimeQuest SDC constraints before PCB fab.
合规信息
RoHS and REACH compliance per Altera/Intel product declaration. AEC-Q100 does not apply - this is an FPGA, not an automotive-grade IC. Halogen-free per JEDEC JS709B and IEC 61249-2-21.