EP1M350F780C5 - 350K LE Mercury FPGA with 1.25 Gbps CDR | Altera
料号： EP1M350F780C5 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1861 | $1,861.00 |
| 10 | $1675 | $16,750.00 |
| 100 | $1489 | $148,900.00 |
| 500 | $1395 | $697,500.00 |
| 1,000 | $1303 | $1,303,000.00 |
EP1M350F780C5 概述
An FPGA (Field-Programmable Gate Array) is a programmable logic device (PLD) built from an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and a programmable interconnect, all wired up by SRAM configuration bits. FPGAs sit in the broader hierarchy of programmable logic devices -> complex programmable logic devices (CPLDs) -> FPGAs -> SoC FPGAs, and they occupy the high-density, high-performance tier of the semiconductor ecosystem. Unlike ASICs they are fully re-programmable, which makes them ideal for prototyping, low-volume production, and designs where time-to-market outweighs per-unit cost.
The Mercury family's distinguishing feature is integrated CDR support up to 1.25 Gbps per channel, eliminating the need for external physical-layer devices in many serial backplane, Fibre Channel, gigabit Ethernet, and RapidIO applications. Combined with the EP1M350F780C5's high LUT count and 486 user I/Os, designers can implement both the physical-layer glue and the application-layer protocol on a single device, reducing board area, BOM cost, and signal-integrity risk from multiple chip-to-chip serial links.
The 780-FBGA package (29 mm x 29 mm body, 1 mm ball pitch) is a common footprint in the Mercury family, allowing designers to migrate between densities and speed grades without re-spinning the PCB. The C5 speed grade is the fastest commercial bin, suitable for timing-critical datapaths where setup/hold slack is at a premium.
Typical applications include high-speed serial backplane bridges, protocol-conversion cards (e.g., SPI-4.2 to SFI-4.1), gigabit Ethernet switch line cards, Fibre Channel controllers, and telecom aggregation equipment that need both multi-gigabit serial I/O and a large parallel fabric for buffering and packet processing.
When designing with this part, pay close attention to power-rail sequencing (the core must come up before or simultaneously with the I/O banks) and thermal management on a 1.8 V core. The 780-FBGA requires a multilayer PCB with buried vias or microvias to escape all balls reliably.
This page combines current distributor stock, verified Mercury-family cross-references, and practical design notes that go beyond the manufacturer datasheet to support engineering evaluation.
直接替换替代料： EP1M350F780C5 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1M350F780C5 （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, RoHS Status, Speed Grade, Family.
快速对比工具——选择替代料号进行并排对比：
EP1M350F780-C7
✅ 直接替换✓ 有现货
$92 / 个
查看数据手册 →EP1M350F78016
✅ 直接替换✓ 有现货
$155 / 个
查看数据手册 →EP1M350F672C7N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$59 / 个
查看数据手册 →EP1M350F780C5 最大额定值与电气特性
| Device Family | Mercury |
| Logic Elements (approx.) | 350,000 |
| User I/O Pins | 486 |
| Embedded Transceivers | High-speed CDR channels up to 1.25 Gbps |
| Core Voltage | 1.71 V to 1.89 V |
| Speed Grade | C5 (commercial, fastest) |
| 工作温度 | 0 °C to +85 °C (TJ) |
| 封装 | 780-ball FCBGA (29 mm x 29 mm, 1 mm pitch) |
| Supply Voltage Range | 1.71 V ~ 1.89 V |
| Supplier Device Package | 780-FBGA (29x29) |
| 封装 / 外壳 | 780-BBGA, FCBGA |
| Series | Mercury |
| 安装类型 | Surface Mount |
| RoHS 状态 | Non-compliant (per some distributor listings) |
| 生命周期状态 | Not Recommended for New Designs (NRND) |
EP1M350F780C5 780-bbga, fcbga 引脚配置指南
EP1M350F780C5（780-bbga, fcbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1M350F780C5.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1M350F780C5 适用于 6 应用s: High-Speed Serial Backplane Bridge, Gigabit Ethernet Line Card Aggregation, Fibre Channel Storage Controller, Telecom Aggregation and Protocol Conversion, Industrial Test and Measurement Equipment, Legacy ASIC/ASSP Replacement in Maintenance Programs.
High-Speed Serial Backplane Bridge
The EP1M350F780C5 is purpose-built for backplane bridging because its integrated 1.25 Gbps CDR transceivers eliminate the need for external SerDes in many legacy backplane designs. The 350K logic elements provide enough fabric to implement protocol-conversion state machines, FIFOs, and PCS glue between SPI-4.2, SFI-4.1, or proprietary parallel interfaces and the multi-gigabit serial links. Designers place the device on the line card with AC-coupled serial traces to the backplane connector, using the on-chip CDR to recover clock and data without an external PHY. The 780-FBGA footprint supports controlled-impedance escape routing on standard FR-4 backplanes, and the 1.8 V core simplifies power tree design compared to 1.2 V modern parts.
推荐
Gigabit Ethernet Line Card Aggregation
In gigabit Ethernet aggregation switches, the EP1M350F780C5's combination of multi-gigabit transceivers and a large LUT fabric allows designers to implement multiple MACs, classifier engines, and traffic shapers on a single die. Each 1.25 Gbps CDR channel can carry a gigabit Ethernet link, and 486 user I/O pins give access to multiple parallel datastreams to external TCAMs, RLDRAMs, or network processors. The C5 speed grade is critical for tight inter-packet timing at line rate, and the 780-FBGA package provides adequate thermal headroom when paired with the recommended thermal management footprint. This part is typically placed at the heart of legacy enterprise switching products that have not yet migrated to Stratix-class devices.
推荐
Fibre Channel Storage Controller
Fibre Channel at 1 Gbps operates well within the EP1M350F780C5's 1.25 Gbps CDR envelope, making this device a natural fit for legacy Fibre Channel storage controllers and HBAs. The 350K logic elements can host the FC protocol engine, SCSI/ATA bridging logic, and DMA engines that move payloads to system memory, while the integrated transceivers handle the FC-0 and FC-1 layers directly. Designers save bill-of-materials cost and board area by avoiding an external SerDes plus encoder/decoder pair. The commercial 0-85 °C junction range covers typical server-room environments, and the FCBGA package's thermal characteristics are well documented in the Mercury device handbook.
推荐
Telecom Aggregation and Protocol Conversion
Telecom equipment manufacturers adopted the Mercury family for protocol conversion between legacy TDM/ATM fabrics and emerging packet-based switching. The EP1M350F780C5 supports multiple 1.25 Gbps links alongside a deep LUT fabric, allowing designers to terminate serial backplane traffic, de/packetize it, and forward it to parallel framers or network processors. The 486 user I/O pins are well-matched to UTOPIA / POS-PHY Level 3/4 bus widths to external framers. Designers should follow Mercury power-sequencing guidelines carefully because the 1.8 V core and I/O banks must ramp in a defined order to prevent permanent damage.
推荐
Industrial Test and Measurement Equipment
Test and measurement instruments such as protocol analyzers, BERT testers, and high-speed data recorders benefit from the EP1M350F780C5's combination of multi-gigabit serial I/O and large parallel fabric. Designers can build custom pattern generators, error detectors, and protocol-aware capture logic that connect directly to 1.25 Gbps serial links under test, with the parallel fabric handling triggering, timestamping, and host-side data movement. The 780-FBGA is straightforward to integrate on a 6-layer or 8-layer test-instrument mainboard, and the C5 speed grade supports deterministic timing for compliance test suites. When targeting industrial (-40 °C to +100 °C) environments, designers should select the industrial-temperature EP1M350F78016 variant.
推荐
Legacy ASIC/ASSP Replacement in Maintenance Programs
When a discontinued ASIC or ASSP drives a critical end-product, the EP1M350F780C5 is often used as an FPGA-based form-fit-function replacement because the Mercury family's 1.25 Gbps transceivers and 486 I/O pins can reproduce the I/O signature of many older networking ASICs. The C5 speed grade helps close timing on replacement designs, and the 780-FBGA footprint can be laid out to match the legacy ASIC's BGA pattern when board spin is not feasible. Designers should treat this use case as a maintenance activity only; Altera's NRND recommendation is to migrate active programs to Stratix IV GX or later families with active PCN support and modern transceivers.
推荐
推荐产品汇总
工程参考数据： EP1M350F780C5 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1M350F780-C7 | EP1M350F78016 | EP1M350F672C7N |
|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera |
| Package | 780-FBGA (29x29) | 780-FBGA (29x29) - same | 780-FBGA (29x29) - same | 672-BGA - different, smaller |
| User I/O Pins | 486 | 486 | 486 | fewer than 486 (smaller package) |
| Transceiver Rate | up to 1.25 Gbps CDR | up to 1.25 Gbps CDR | up to 1.25 Gbps CDR | up to 1.25 Gbps CDR |
| Core Voltage | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| Operating Temperature | 0 °C to +85 °C (TJ) | 0 °C to +85 °C (TJ) | Industrial (-40 °C to +100 °C) | 0 °C to +85 °C (TJ) |
| Lifecycle Status | NRND | NRND | NRND | NRND |
关键差异点
- Integrated 1.25 Gbps CDR transceivers （对比 EP1M350F780-C7)
- Fastest commercial speed grade （对比 EP1M350F78016)
- High user I/O count （对比 EP1M350F672C7N)
- Mature Mercury toolchain （对比 Newer Altera/Intel families)
设计说明
Estimated: The Mercury family's 1.8 V core and I/O rails must ramp in the sequence specified in the Mercury device handbook. Designers commonly use a four-rail sequencer (e.g., LTC2928 or equivalent) to enforce VCCINT before VCCIO and clamp the POR pin until all rails are stable. Skipping sequencing risks latch-up; budget for the sequencer and its supporting passives in the BOM. Core current at full fabric utilization on a 350K-LE device can exceed several amps, so plan for at least 4 oz copper pours or external copper heatsinks directly under the FCBGA thermal pad.
The 780-FBGA at 1 mm pitch requires a multilayer PCB stack-up with microvias or laser-drilled blind/buried vias to reliably escape all balls. A 6-layer 1-6-1 stack-up is the minimum; an 8-layer 1-5-2 design gives better signal-integrity margin for the multi-gigabit serial traces. Matched-impedance (100 ohm differential for serial links, 50 ohm single-ended for control) must be verified with a 3D EM field solver before tape-out; do not rely on rule-of-thumb calculators for BGA escapes.
Configuration bitstream storage: the EP1M350F780C5 requires an external configuration PROM (typically EPC16 or EPC8) or a microcontroller to load the SRAM configuration at power-up. Designers sometimes forget to size the PROM correctly for compressed bitstreams or fail to add JTAG headers for in-system programming. Also note the NRND status of the configuration PROMs themselves - if your PROM is also NRND, plan a migration path before your program goes into production.
AC-coupling capacitors on the 1.25 Gbps CDR serial links must be placed within 200 mil of the BGA balls and use 0402 or smaller packages to minimize stub length. Use 0.1 µF X7R capacitors rated for at least 6.3 V to handle bias transients. Reference-plane stitching vias should be placed at least every λ/20 along the serial traces to suppress return-path discontinuities. Run post-layout simulation with IBIS-AMI models of the Mercury transceiver before committing to fabrication.
合规信息
RoHS non-compliance reported by alterachips.com distributor listing; reach/lead-free/halogen-free data not present in Verified Web Data and marked unknown. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. Conflict-minerals status not stated.
