10AX090R2F40E2SG - Arria 10 GX FPGA 900K LE | Intel
料号： 10AX090R2F40E2SG ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $6226.02 | $6,226.02 |
| 10 | $5800 | $58,000.00 |
| 50 | $5400 | $270,000.00 |
| 100 | $5050 | $505,000.00 |
| 500 | $4750 | $2,375,000.00 |
10AX090R2F40E2SG 概述
What is an FPGA? A Field-Programmable Gate Array is a semiconductor device containing an array of configurable logic blocks (CLBs/LABs), programmable interconnects, and dedicated hardened IP such as transceivers, DSP slices, block RAM, and (in some families) processor cores. FPGAs occupy the position between general-purpose microcontrollers and fixed-function ASICs in the silicon hierarchy: programmable like software, parallel like hardware. The Arria 10 family is Intel's mid-range 20nm line, positioned above Cyclone V/10 and below Stratix 10 in performance and cost, optimized for transceiver-rich, DSP-intensive applications such as wireless baseband, radar, and broadcast video.
Key specifications for the 10AX090R2F40E2SG include 900K logic elements organized into 339,620 LABs/CLBs, 59.23 Mbit embedded RAM, transceivers supporting backplane and chip-to-chip interfaces, and 342 single-ended (or 168 differential-pair) general-purpose I/Os. The package code F40 designates a 1517-ball FCBGA approximately 40mm square, designed for high-density board layouts with full transceiver and memory interface access.
This OPN decodes as: 10AX = Arria 10 GX family, 090 = 900K logic elements, R2 = speed grade 2 with -2 transceiver rating, F40 = 1517-ball FCBGA package, E2 = extended temperature grade -40C to +100C junction, SG = lead-free / RoHS compliant. The Arria 10 architecture integrates partial reconfiguration, hard floating-point DSP blocks, and hardened PCIe Gen2/Gen3 IP cores.
Typical applications include software-defined radio (SDR) baseband processing, 4K video format conversion and bridging, radar signal preprocessing, high-speed serial protocol bridging (PCIe, Serial RapidIO, 10G/40G Ethernet MAC), ASIC prototyping for mid-complexity designs, and medical imaging reconstruction pipelines.
Designers should consult the Arria 10 GX device handbook for transceiver channel placement, PCB stackup recommendations, and SmartVID core voltage requirements. The 1517-ball FCBGA demands a high-layer-count PCB (typically 12+ layers) with matched impedance routing for transceivers and disciplined power-delivery network design.
This page synthesizes distributor pricing, drop-in speed/package variants, and practical design notes not consolidated in the manufacturer datasheet.
直接替换替代料： 10AX090R2F40E2SG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10AX090R2F40E2SG （相同外形与封装尺寸） ——差异在于 Package, DSP Blocks, Speed Grade, Mounting Type, Process Technology.
快速对比工具——选择替代料号进行并排对比：
10AX090R2F40E1SG
✅ 直接替换✓ 有现货
$5750 / 个
查看数据手册 →10AX090R1F40I1SG
✅ 直接替换✓ 有现货
$3783 / 个
查看数据手册 →10AX090R1F40E1SG
✅ 直接替换✓ 有现货
$6700 / 个
查看数据手册 →10AX090R2F40E2LG
✅ 直接替换✓ 有现货
$2920 / 个
查看数据手册 →10AX066N2F40E1SG
✅ 直接替换✓ 有现货
$3350 / 个
查看数据手册 →10AX090R2F40E2SG 最大额定值与电气特性
| Family | Arria 10 GX |
| Logic Elements | 900000 |
| LABs/CLBs | 339620 |
| Total RAM Bits | 59234304 |
| User I/O Count | 342 |
| Package Type | 1517-BBGA, FCBGA |
| Package Code | F40 (approx. 40mm FCBGA) |
| Speed Grade | 2 (R2 -2 transceiver rating) |
| Temperature Grade | E2 (Extended: -40C to +100C junction) |
| Lead-Free / RoHS | Yes (SG suffix) |
| Transceivers | Up to 14.1 Gbps (Arria 10 GX feature) |
| DSP Blocks | Variable-precision, hardened floating-point capable |
| Process Node | TSMC 20nm |
| 安装类型 | Surface Mount (FCBGA ball grid) |
| MSL 等级 | 3 (168 Hours) |
| Packaging | Tray |
10AX090R2F40E2SG f40 (approx. 40mm fcbga) 引脚配置指南
10AX090R2F40E2SG（f40 (approx. 40mm fcbga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10AX090R2F40E2SG.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10AX090R2F40E2SG 适用于 6 应用s: Software-Defined Radio (SDR) Baseband, 4K Video Format Conversion and Bridging, Radar Signal Preprocessing, High-Speed Serial Protocol Bridging, ASIC Prototyping for Mid-Complexity Designs, Medical Imaging Reconstruction Pipeline.
Software-Defined Radio (SDR) Baseband
The 10AX090R2F40E2SG is a strong fit for SDR baseband processing because its 900K logic elements and hardened variable-precision DSP blocks deliver 1.5 TMACs of compute for FFT, channelization, and modulation/demodulation. With transceivers up to 14.1 Gbps and 342 I/Os, the device interfaces to multi-antenna RF front-ends and high-bandwidth ADC/DAC sample streams. In typical deployments the FPGA sits between a wideband ADC and a host CPU/GPU, performing real-time OFDM demodulation or beamforming. The 1517-ball FCBGA provides the I/O density needed for parallel LVDS ADC data capture plus multiple 10GbE links back to the host processor.
推荐
4K Video Format Conversion and Bridging
Arria 10 GX devices like the 10AX090R2F40E2SG are widely deployed in broadcast video infrastructure for 4K/UHD format conversion, scaling, and protocol bridging (HDMI 2.0, DisplayPort 1.4, SDI). The 900K logic elements support multi-stream scaling engines, color-space conversion, and frame-buffer management in external DDR4. Transceivers handle SDI (up to 12G-SDI) and HDMI/DP serialized streams while 342 I/Os interface to parallel video buses and external memory controllers. The E2 temperature grade supports the operating ranges of broadcast studio and outdoor LED-wall environments.
推荐
Radar Signal Preprocessing
The 10AX090R2F40E2SG serves as a real-time radar preprocessing engine in phased-array and SAR systems, where its 900K logic elements and floating-point-capable DSP blocks perform pulse compression, MTI filtering, and CFAR detection. The -2 transceiver rating supports digital IF sampling links from ADC ASICs at rates up to 14.1 Gbps, while 342 user I/Os provide antenna-element digital control interfaces. The extended E2 temperature range allows deployment in outdoor radar installations and military/aerospace platforms where junction temperatures can exceed commercial-grade limits during high-utilization DSP workloads.
推荐
High-Speed Serial Protocol Bridging
In datacenter and telecom equipment, the 10AX090R2F40E2SG bridges between PCIe Gen3, 10/40 Gigabit Ethernet, Serial RapidIO, and proprietary serial protocols. Hardened PCIe Gen3 IP cores and 14.1 Gbps transceivers eliminate soft-IP timing closure risk, while 342 I/Os handle parallel side-channels and management interfaces. The device typically sits on a carrier card as a fan-out bridge between a host CPU and multiple line-card ASICs, providing protocol conversion, packet buffering, and clock-domain crossing in a single chip.
推荐
ASIC Prototyping for Mid-Complexity Designs
The 10AX090R2F40E2SG is a popular ASIC prototyping platform for designs in the 5M-15M ASIC-gate range. Its 900K logic elements, abundant block RAM, and 342 I/Os map well to mid-complexity SoCs and can host multiple ASIC partitions in parallel with FPGA-to-FPGA child-card expansion via serial transceivers. Quartus Prime TimeQuest timing analysis and the Arria 10 partial reconfiguration flow allow designers to swap in RTL revisions quickly during bring-up, while the 1517-ball FCBGA exposes enough user I/O to bring out most ASIC peripheral interfaces for system-level validation.
推荐
Medical Imaging Reconstruction Pipeline
In CT, MRI, and ultrasound systems, the 10AX090R2F40E2SG accelerates image reconstruction algorithms such as filtered backprojection and iterative reconstruction. Its 900K logic elements and floating-point DSP blocks deliver the parallel compute needed for real-time 3D volume reconstruction at clinical frame rates. Transceivers accept raw data streams from multi-element detector arrays at up to 14.1 Gbps per lane, while 342 user I/Os interface to LVDS data acquisition ADCs and external DDR4 memory buffers. The E2 temperature range supports operation in the controlled environment of medical imaging carts and stationary scanners.
推荐
推荐产品汇总
工程参考数据： 10AX090R2F40E2SG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10AX090R2F40E1SG | 10AX090R1F40I1SG | 10AX090R1F40E1SG | 10AX090R2F40E2LG | 10AX066N2F40E1SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-BBGA FCBGA (F40) | 1517-BBGA FCBGA (F40) - same | 1517-BBGA FCBGA (F40) - same | 1517-BBGA FCBGA (F40) - same | 1517-BBGA FCBGA (F40) - same | 1517-BBGA FCBGA (F40) - same |
| Logic Elements | 900000 | 900000 | 900000 | 900000 | 900000 | 660000 |
| Speed Grade | -2 (R2) | -1 (slower) | -1 (slower) | -1 (slower) | -2 (same) | -2 (same) |
| Temperature Grade | E2 (Extended: -40C to +100C junction) | E2 (same) | I1 (Industrial) | E1 (Commercial) | E2 (same) | E1 (Commercial) |
| Transceiver Rate | Up to 14.1 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 14.1 Gbps | Up to 12.5 Gbps |
| RoHS / Lead-Free Suffix | SG (lead-free RoHS) | SG (same) | SG (same) | SG (same) | LG (alternate finish) | SG (same) |
关键差异点
- 900K logic elements in same F40 footprint as 660K tier （对比 10AX066N2F40E1SG)
- -2 speed grade with 14.1 Gbps transceivers （对比 10AX090R2F40E1SG)
- E2 extended temperature for ruggedized applications （对比 10AX090R1F40E1SG)
设计说明
The 1517-ball FCBGA package requires a high-layer-count PCB (typically 12+ layers) with microvia or stacked-via technology for breakout routing. Transceiver channels demand 85-100 ohm differential impedance control with matched trace lengths within 5 mils. Reference the Altera Arria 10 GX PCB Design Guidelines for via pattern, antipad geometry, and decoupling capacitor placement recommendations specific to the F40 package.
Estimated: At typical utilization (80% logic, 70% DSP, all transceivers active at 10 Gbps), the 10AX090R2F40E2SG consumes 15-25W from 0.9V SmartVID core plus transceiver supplies. SmartVID dynamically adjusts core voltage from 0.85V to 0.95V based on silicon speed bin. Provide at least 4 voltage rails (VCC, VCCPT, VCCA_FPLL, VCCIO_x) with bulk decoupling and a power-sequencing controller to meet Arria 10 power-up requirements.
The E2 temperature grade allows junction temperature up to 100C, but most designs should target Tj <= 85C for long-term reliability. With FCBGA packages, thermal management depends heavily on PCB copper area and airflow. A 4x4 BGA footprint with full ground via array beneath the exposed die gives theta_J-A of approximately 10-15 C/W with adequate airflow; without airflow or with limited copper, junction can exceed safe limits at high utilization.
Common pitfalls when designing with the 10AX090R2F40E2SG include: (1) failing to assign transceiver reference clock pins correctly - refer to the pinout file for your exact OPN; (2) exceeding the maximum of 24 transceiver channels per bank; (3) ignoring MSL3 moisture sensitivity and skipping bake-out before reflow; (4) using the wrong Quartus Prime device library revision for the -2 speed grade. Always validate the pinout against the Quartus Prime Pin Planner before PCB fab.
合规信息
RoHS compliant per SG suffix in OPN. Not AEC-Q100 qualified (automotive qualification not typically pursued for high-end FPGAs; consult Intel automotive-grade roadmap if required). Halogen-free status not explicitly stated in verified data.
