EP3SL340H1152C2 - Stratix III L FPGA, 337.5K Cells, 1152-BGA | Intel
料号： EP3SL340H1152C2 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $22602.24 | $22,602.24 |
| 5 | $20000 | $100,000.00 |
| 10 | $18500 | $185,000.00 |
| 25 | $17200 | $430,000.00 |
| 50 | $16500 | $825,000.00 |
| 100 | $15800 | $1,580,000.00 |
EP3SL340H1152C2 概述
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that combines the flexibility of software-configurable logic with the performance of application-specific integrated circuits. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which also include CPLDs and PALs, and they are widely used for prototyping ASICs, accelerating compute-intensive workloads, and implementing custom parallel processing pipelines. The Stratix III family specifically targets designs that need the highest logic density and DSP performance available at low power budgets, with features like high-speed transceivers and rich on-chip memory.
Key features of the EP3SL340H1152C2 include 744 user I/O pins supporting a wide range of single-ended and differential I/O standards, up to 18.8 Mbits of embedded RAM organized in M9K and MLAB blocks for flexible buffering and FIFO implementation, dedicated DSP blocks for high-throughput arithmetic operations, and clock management tiles that enable multiple clock domains with low jitter. The 1152-BGA FCBGA package provides a compact footprint relative to its I/O count while offering controlled-impedance signal paths ideal for high-speed memory and transceiver interfaces.
Typical applications include high-throughput digital signal processing in software-defined radio (SDR), radar, and beamforming systems; telecommunication infrastructure such as baseband processing and high-speed packet inspection; ASIC prototyping and design verification for networking ASICs and processor emulation; high-performance computing accelerators in data centers and test equipment; video and image processing pipelines requiring wide memory bandwidth; and industrial control and automation systems with real-time deterministic latency requirements.
When designing with this FPGA, engineers should pay close attention to the PCB layout for the 1152-ball BGA, ensuring proper decoupling, power-plane integrity, and via-in-pad or microvia construction to maintain signal integrity at high toggle frequencies. Plan a robust power distribution network using multiple voltage rails (core, PLL, I/O banks, transceiver) and follow the manufacturer's recommended power-on sequencing. Thermal management requires sufficient airflow or heatsinking because the device's high logic density produces non-trivial power dissipation under sustained workload.
This page synthesizes distributor pricing, parametric context, and design guidance that is not available from the manufacturer datasheet alone, providing a single reference for engineers evaluating the EP3SL340H1152C2 for new designs or replacements.
直接替换替代料： EP3SL340H1152C2 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3SL340H1152C2 （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Operating Temperature, Operating Temperature Grade, Core Voltage.
快速对比工具——选择替代料号进行并排对比：
EP3SL340H1152I3N
✅ 直接替换✓ 有现货
$14250 / 个
查看数据手册 →EP3SL340H1152C3N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1895 / 个
查看数据手册 →EP3SL340H1152C4N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1245 / 个
查看数据手册 →EP3SL340H1152C2N
✅ 直接替换✓ 有现货
$3400 / 个
查看数据手册 →EP3SL340H1152I4N
✅ 直接替换✓ 有现货
$2150 / 个
查看数据手册 →EP3SL340F1152C2N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP3SL340H1152C2 最大额定值与电气特性
| Manufacturer | Intel (formerly Altera) |
| Family | Stratix III L |
| Series | Stratix III |
| Logic Elements / Cells | 337500 |
| Embedded Memory | 18822144 bits (approx. 18.8 Mbits) |
| User I/O Count | 744 |
| Number of LABs/CLBs | 13500 |
| Package Type | 1152-BBGA, FCBGA (Flip-Chip BGA) |
| Process Technology | 65 nm CMOS |
| Core Supply Voltage | 1.1 V |
| Operating Temperature Grade | Commercial (0C to +85C) |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| Lead-Free | Yes |
| Speed Grade | C2 |
EP3SL340H1152C2 1152-bbga, fcbga (flip-chip bga) 引脚配置指南
EP3SL340H1152C2（1152-bbga, fcbga (flip-chip bga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3SL340H1152C2.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3SL340H1152C2 适用于 6 应用s: Software-Defined Radio (SDR) Baseband Processing, Telecommunications Infrastructure / Base Station, ASIC Prototyping and Design Verification, High-Performance Computing Accelerator Card, Radar Signal Processing and Beamforming, Video Broadcast Processing Pipeline.
Software-Defined Radio (SDR) Baseband Processing
The EP3SL340H1152C2's 337,500 logic cells and 18.8 Mbits of embedded memory are well aligned to SDR baseband workloads that require massive DSP parallelism and large on-chip buffers for symbol-to-chip-rate conversion. Its 744 user I/O supports wide DDR2/DDR3 interfaces to external memory for sample buffering. Compared with smaller FPGAs, the Stratix III L variant in the 1152-BGA package offers sufficient headroom for multi-channel receive chains with up to tens of MHz instantaneous bandwidth.
推荐
Telecommunications Infrastructure / Base Station
The 1152-BGA package's 744 user I/O count enables multiple SFP+/SFP28 interfaces, CPRI links to baseband units, and DDR3 memory channels for protocol stack processing, all from a single FPGA. The 1.1 V core and Stratix III low-power variant reduce thermal load relative to prior-generation Stratix II parts. Compared with ASIC implementations, the EP3SL340H1152C2 allows rapid iteration on LTE/5G NR PHY algorithms without re-spinning silicon.
推荐
ASIC Prototyping and Design Verification
ASIC prototyping benefits from the EP3SL340H1152C2's high logic density and rich I/O, allowing multi-million-gate ASIC designs to be partitioned across one or more FPGAs for pre-silicon software development and hardware verification. The 18.8 Mbits of embedded RAM replicate ASIC memory blocks without external storage. Compared with smaller FPGAs, the 337K-cell device enables prototyping of large SoCs and networking ASICs in fewer devices, simplifying bring-up and debugging.
推荐
High-Performance Computing Accelerator Card
In HPC accelerators, the EP3SL340H1152C2 implements low-latency compute pipelines, packet parsers, and crypto engines where its parallel DSP and logic resources translate directly into throughput. The 1152-BGA package supports PCIe Gen2 x8 host interfaces, multiple DDR3 channels, and high-density I/O to onboard SRAM/QDR memory. Compared with CPU-only implementations, the FPGA delivers deterministic latency and orders-of-magnitude acceleration for fixed-function compute kernels.
推荐
Radar Signal Processing and Beamforming
Phased-array radar systems require massive DSP parallelism to compute beam weights, FFTs, and pulse compression in real time. The EP3SL340H1152C2's DSP blocks and 337K logic cells provide the headroom for multi-channel radar processing, while its 744 I/O enables AD9680-class ADC and DAC interface arrays. Compared with DSP processors, the FPGA's parallel architecture delivers deterministic sub-microsecond latency for closed-loop beam steering.
推荐
Video Broadcast Processing Pipeline
The EP3SL340H1152C2 supports multi-stream video processing such as 4K/UHD format conversion, scaling, and codec pre-processing with its high logic density and large embedded memory for line and frame buffering. The 744 I/O enable HDMI/SDI input arrays plus DDR3 frame-store memory. Compared with software-only pipelines, FPGA acceleration provides deterministic per-frame latency and zero CPU overhead, freeing host processors for higher-level application logic.
推荐
推荐产品汇总
工程参考数据： EP3SL340H1152C2 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3SL340H1152I3N | EP3SL340H1152C3N | EP3SL340H1152C4N | EP3SL340H1152C2N | EP3SL340H1152I4N | EP3SL340F1152C2N |
|---|---|---|---|---|---|---|---|
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BGA | 1152-BGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Cells | 337500 | 337500 | 337500 | 337500 | 337500 | 337500 | 337500 |
| Embedded Memory | 18.8 Mbits | 18.8 Mbits | 18.8 Mbits | 18.8 Mbits | 18.8 Mbits | 18.8 Mbits | 18.8 Mbits |
| User I/O Count | 744 | 744 | 744 | 744 | 744 | 744 | 744 |
| Speed Grade | C2 | I3 | C3 | C4 | C2 | I4 | C2 |
| Temperature Grade | Commercial | Industrial | Commercial | Commercial | Commercial | Industrial | Commercial |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Transceivers (H vs F variant) | Yes (H variant includes transceivers) | Yes (H) | Yes (H) | Yes (H) | Yes (H) | Yes (H) | No (F variant, no transceivers) |
关键差异点
- High-density Stratix III L with 337.5K cells and 744 user I/O （对比 EP3SL200F1152C2)
- C2 commercial speed grade at 1152-BGA （对比 EP3SL340H1152I4N)
- H variant includes high-speed transceivers （对比 EP3SL340F1152C2N)
设计说明
The 1152-ball FBGA package requires via-in-pad or microvia PCB construction to route signals out from the dense ball array. Use a multi-layer PCB with dedicated ground and power planes for the 1.1 V core supply and I/O bank voltages, and follow the Stratix III PCB design guidelines for BGA breakout, decoupling capacitor placement, and stack-up. Signal traces must maintain 50 ohm single-ended or 100 ohm differential impedance for high-speed memory and transceiver interfaces.
Estimated: At typical Stratix III L power dissipation of 8-12 W under sustained workload, a 1152-BGA device without heatsinking may exceed its 85C junction limit. Designers should provide thermal vias under the BGA thermal pad, copper pours on inner layers, and optionally a heatsink for high-utilization designs. Industrial-grade (I3/I4) speed grades should be considered for systems with elevated ambient temperatures.
The EP3SL340H1152C2 requires multiple voltage rails (core 1.1 V, PLL analog, I/O banks at 1.2-3.0 V, transceiver if present). Use the Stratix III power-sequencing guidelines: core must come up before I/O. Decoupling capacitors should be placed as close as possible to each power pin with a mix of bulk, mid-frequency, and high-frequency values per the device handbook. Power-on reset behavior must be validated with the chosen configuration scheme.
Common pitfalls when designing with the EP3SL340H1152C2 include insufficient PCB layer count for BGA breakout, ignoring the recommended power-up sequencing (causing I/O latch-up), insufficient decoupling (causing core voltage droop during configuration), and over-constraining timing without specifying the correct speed grade. Always validate pin assignments against the Stratix III pinout file and verify that the chosen speed grade meets your Fmax requirements.
合规信息
RoHS compliance per Intel/Altera product page for the Stratix III family. REACH and conflict minerals declarations should be requested from Intel for production-grade compliance documentation.