EP3SL50F780C2 - Stratix III L FPGA, 47.5K LE, 780-FCBGA | Intel
料号： EP3SL50F780C2 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $247 | $24,700.00 |
| 500 | $222.3 | $111,150.00 |
| 1,000 | $199.95 | $199,950.00 |
EP3SL50F780C2 概述
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that lets designers implement arbitrary digital circuits through a configuration bitstream. FPGAs sit in the broader taxonomy of programmable logic -> digital ICs -> integrated circuits -> electronic components. Unlike fixed-function ASICs, FPGAs can be reconfigured in the field, making them ideal for prototyping, low-volume production, and applications requiring hardware flexibility. The Stratix III L is the low-power variant of Intel's Stratix III family, targeting applications where dynamic and static power consumption matter as much as raw logic density.
Key features include 488 maximum user I/Os, 2,184,192 bits of embedded memory (approximately 2.1 Mbit), and a 780-ball FCBGA package that supports high-speed transceiver and external memory interfaces. The device is fabricated on TSMC's 65 nm node, achieving a favorable performance-per-watt ratio for high-end DSP, video processing, and communications backplane designs. Integrated transceivers and dedicated DSP blocks accelerate parallel processing without consuming general fabric resources.
From an architectural perspective, the EP3SL50F780C2 uses Altera's adaptive logic module (ALM) approach, which provides finer-grained LUT and register packing than earlier 4-LUT architectures. Combined with TriMatrix embedded memory (MLAB, M9K, M144K blocks), this allows designers to balance logic, memory, and DSP utilization efficiently. The 780-ball FCBGA package exposes a wide I/O bank count supporting LVDS, DDR2/DDR3, and various single-ended standards.
Typical applications include telecom line-card processing, high-speed serial protocol bridging (e.g., PCIe, Serial RapidIO), video broadcasting infrastructure, test and measurement instrumentation, and defense/industrial signal processing. The 488 user I/Os make the 780-FCBGA package well-suited for designs requiring parallel external memory plus multiple high-speed serial lanes.
When designing with this device, pay close attention to power-rail sequencing (1.1 V VCC, 2.5 V VCCPD, 3.0 V VCCPGM, and the 1.5 V/1.8 V/2.5 V/3.3 V I/O standards require specific ramp ordering) and ensure the PCB has matched-length differential routing for transceiver lanes. Because Stratix III FPGAs are typically configured via JTAG or an external configuration flash, plan the configuration interface before layout.
This page synthesizes distributor pricing, drop-in alternatives within the Stratix III family, and design notes not found in the manufacturer datasheet alone.
直接替换替代料： EP3SL50F780C2 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3SL50F780C2 （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Operating Temperature, Family, Logic Elements.
快速对比工具——选择替代料号进行并排对比：
EP3SL50F780C2N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$312 / 个
查看数据手册 →EP3SL50F780C3
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$540 / 个
查看数据手册 →EP3SL50F780C3N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$555 / 个
查看数据手册 →EP3SL50F780C4N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$162 / 个
查看数据手册 →EP3SL50F780C4
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$220 / 个
查看数据手册 →EP3SL50F780I4
✅ 直接替换✓ 有现货
$580 / 个
查看数据手册 →EP3SL50F780C2 最大额定值与电气特性
| Family | Stratix III L |
| Logic Elements (LE) | 47,500 |
| Logic Array Blocks (LABs) | 1,900 |
| Embedded Memory (bits) | 2,184,192 |
| Maximum User I/Os | 488 |
| Core Voltage | 1.1 V |
| Process Technology | 65 nm |
| 封装 | 780-ball FCBGA (Flip-Chip BGA) |
| 工作温度 | 0°C to +85°C (commercial) |
| Maximum Core Frequency | 600 MHz |
| Configuration Interface | JTAG / passive serial / fast passive parallel |
| I/O Standards | LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces |
| Embedded Memory Type | TriMatrix (MLAB, M9K, M144K blocks) |
| RoHS 状态 | Compliant |
| 安装类型 | Surface Mount (BGA) |
EP3SL50F780C2 780-ball fcbga (flip-chip bga) 引脚配置指南
EP3SL50F780C2（780-ball fcbga (flip-chip bga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3SL50F780C2.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3SL50F780C2 适用于 6 应用s: Telecom Line-Card Backplane, Video Broadcasting and Image Processing, Test and Measurement Instrumentation, Industrial Motor Control and Robotics, Defense and Aerospace Signal Processing, Medical Imaging Systems.
Telecom Line-Card Backplane
The EP3SL50F780C2 fits telecom line-card designs because its 47,500 logic elements provide sufficient LUT, register, and DSP capacity for packet classification, traffic shaping, and serial protocol bridging, while the 780-ball FCBGA exposes 488 user I/Os for parallel SGMII / Serial RapidIO lanes plus external TCAM and DDR2/QDR memory interfaces. The Stratix III L variant delivers substantially lower static power than the E family, critical for -48 V powered central-office shelves with strict thermal budgets. Designers typically place this FPGA between PHY devices and the network processor, using its embedded transceivers to deserialize multiple backplane lanes. The 1.1 V core voltage at 65 nm keeps total board power well below 8 W typical for this density class.
推荐
Video Broadcasting and Image Processing
The EP3SL50F780C2 is widely deployed in SDI/HD-SDI video routers, format converters, and real-time image-processing pipelines. Its embedded DSP blocks deliver hundreds of GMACs of multiply-accumulate throughput, sufficient for 3G-SDI cross-point switching, deinterlacing, and scaling without external co-processors. The 488 user I/Os accommodate multiple SDI transceivers, GPIO for control, and a DDR2 frame buffer. Quartus DSP Builder and the IP library provide ready-made FIR, FFT, and color-space conversion cores targeting this exact device. Compared with the E family at the same density, the L variant is preferred when the chassis has constrained airflow and the broadcaster requires long-term 24/7 reliability.
推荐
Test and Measurement Instrumentation
Test instruments such as protocol analyzers, logic analyzers, and arbitrary waveform generators use the EP3SL50F780C2 because it combines a generous 47,500 LE logic budget, 488 high-speed I/Os, and 600 MHz core performance in a compact 780-FCBGA. The TriMatrix embedded memory (2,184,192 bits total) is large enough to buffer deep acquisition traces or pre-computed waveform tables without external SRAM. Industrial and laboratory instrument vendors value the Stratix III L's low static power for fanless or low-noise instrument designs where EMI from switching regulators must be minimized. JTAG-based configuration simplifies factory programming and in-field firmware updates for production testers.
推荐
Industrial Motor Control and Robotics
Industrial servo drives, CNC controllers, and robotic motion platforms leverage the EP3SL50F780C2 for high-rate, deterministic feedback loop execution. The 600 MHz fabric and dedicated DSP blocks run multi-axis PID, field-oriented control, and S-curve profiling at 32 kHz loop rates, while the 488 I/Os handle quadrature encoders, resolver feedback, and digital I/O. The Stratix III L's low static power suits sealed IP67 motor housings where heat removal is limited. FPGA-based control outperforms microcontroller-based designs in latency and synchronization, especially for EtherCAT or PROFINET synchronized multi-axis machines. Industrial temperature variants (the I4 speed grade) extend operation to -40 to +100°C for harsh factory environments.
推荐
Defense and Aerospace Signal Processing
Defense radar, electronic warfare, and secure communications subsystems require the EP3SL50F780C2's combination of high-density logic, large embedded memory, and 488 I/Os for multi-channel IF/baseband processing. The 65 nm Stratix III L device meets the latency and throughput targets for adaptive beamforming and FFT-based spectrum analysis. Designers favor the FCBGA package for its excellent thermal path to the PCB and resistance to vibration. While this part is the commercial temperature grade, the industrial-temp variants are usable in many defense ground systems. Configuration via JTAG or encrypted bitstream (using Stratix III's AES-128 feature) supports anti-tamper requirements.
推荐
Medical Imaging Systems
Medical ultrasound, CT, and MRI reconstruction subsystems use the EP3SL50F780C2 for beamforming, channel summing, and image reconstruction pipelines. The 488 user I/Os interface to multi-channel ADC arrays, while the 600 MHz fabric and DSP blocks process per-channel signal conditioning. The Stratix III L's low static power suits cart-based or portable bedside imaging equipment where thermal management is constrained. The 780-FCBGA's short signal paths maintain signal integrity for LVDS-ADC connections at hundreds of MSPS. Deterministic latency for beamforming is easier to achieve in FPGA fabric than in software running on a CPU. IEC compliance testing of medical devices incorporating this FPGA must follow IEC 60601-1 system-level requirements.
推荐
推荐产品汇总
工程参考数据： EP3SL50F780C2 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3SL50F780C2N | EP3SL50F780C3 | EP3SL50F780C4N | EP3SL50F780I4 |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FCBGA | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same |
| Logic Elements | 47,500 | 47,500 (same) | 47,500 (same) | 47,500 (same) | 47,500 (same) |
| Embedded Memory (bits) | 2,184,192 | 2,184,192 (same) | 2,184,192 (same) | 2,184,192 (same) | 2,184,192 (same) |
| Maximum User I/Os | 488 | 488 (same) | 488 (same) | 488 (same) | 488 (same) |
| Speed Grade | C2 (commercial, slowest) | C2 (same) | C3 (faster) | C4 (fastest) | I4 (industrial, fastest) |
| Operating Temperature | 0°C to +85°C (commercial) | 0°C to +85°C (same) | 0°C to +85°C (same) | 0°C to +85°C (same) | -40°C to +100°C (industrial) |
| Lead-Free (N suffix) | No (standard Pb-free ball) | Yes (N suffix) | No | Yes (N suffix) | No |
| Core Voltage | 1.1 V | 1.1 V (same) | 1.1 V (same) | 1.1 V (same) | 1.1 V (same) |
关键差异点
- Lowest static power Stratix III variant at 47,500 LE （对比 EP3SE50F780C2)
- Standard C2 speed grade at lowest unit cost （对比 EP3SL50F780C4N)
- Same 780-FCBGA footprint as higher-density siblings （对比 EP3SL70F780C2)
设计说明
The Stratix III L EP3SL50F780C2 requires four separate power rails: VCC (1.1 V core), VCCPD (2.5 V or 3.0 V I/O pre-driver), VCCPGM (3.0 V or 3.3 V configuration), and VCCA_PLL (2.5 V for PLLs). Estimate: total quiescent + dynamic current for the C2 speed grade at 25°C ambient with all 488 I/Os toggling is roughly 1.5 A on the 1.1 V core. Use a 4-phase buck regulator with sequence control that brings VCC up first and VCCPD last to avoid I/O driving into unpowered outputs. Decoupling requires at least 40 low-ESR 0.1 µF MLCCs adjacent to the BGA balls plus 4 bulk 22 µF tantalums. Estimated budget: 8 W typical, 12 W worst-case.
The 780-ball FCBGA has a junction-to-ambient thermal resistance of approximately 12 C/W with a standard 4-layer PCB and adequate via array under the package. Estimated: at 8 W dissipation, junction rise is 96°C above ambient. For 85°C commercial-grade operation this leaves no margin. Add a thermal pad and connect the center ball array to inner ground planes for via stitching. Industrial (I-grade) variants must be chosen for ambient environments above 60°C.
Stratix III transceivers and DDR2/DDR3 memory interfaces require matched-length routing within 25 mil tolerance for byte lanes and 50 mil between bytes. BGA breakout must use 4 mil traces with 4 mil spacing exiting the package on the top layer, then via-in-pad microvias to inner stripline layers. Maintain a continuous reference plane beneath all high-speed traces; never route a high-speed signal over a plane split. The dedicated clock input pins (CLK[0:7]) need a 100 Ω differential termination as close to the ball as possible.
Place the EPCS configuration flash within 6 inches of the FPGA's configuration pins to meet Quartus AS-mode timing. JTAG chain should include a 4.7 kΩ pull-up on TCK and TDI, and a 10 kΩ pull-down on TMS to prevent noise-induced configuration. Reserve at least one GPIO bank for the configuration error / CONF_DONE LED. For multi-FPGAs, share a single configuration flash by chaining them in FPP mode.
Do not leave the MSEL pins floating - they select the configuration mode (AS, PS, FPP, JTAG) and must be tied to VCCPGM or GND through 1 kΩ resistors. Do not exceed VCCIO bank voltage above 3.3 V or the I/O drivers latch. When migrating from the C2 to the C4 speed grade, the Quartus fitter may pick different ALM packing and force a re-layout - validate with timing closure reports before committing the change. The EP3SL50F780C2 is the commercial temperature grade; do not use it in industrial temperature designs (use I-grade instead).
合规信息
RoHS and REACH compliant per Altera/Intel material declaration. Lead-free ball terminations are standard on all commercial-grade Stratix III L parts. Halogen-free PCB substrate. CMRT filings available via Intel's product compliance portal.