EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera
料号： EP3SL50F780C3 ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $745.85 | $745.85 |
| 10 | $692 | $6,920.00 |
| 100 | $638 | $63,800.00 |
| 500 | $585 | $292,500.00 |
| 1,000 | $540 | $540,000.00 |
EP3SL50F780C3 概述
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as block RAM, DSP slices, and high-speed transceivers. Within the broader programmable-logic taxonomy, an FPGA sits between fixed-function ASICs (lower per-unit cost but non-programmable) and CPLDs (smaller, lower-power, non-volatile). The Stratix III family extends Altera's high-end positioning with 40 nm-equivalent performance-per-watt and is intended for designs where parallel processing, hardware acceleration, or custom I/O protocols are required.
Key features of the EP3SL50F780C3 include 1,900 Logic Array Blocks (LABs), 190 embedded 18x18 multipliers (typical for DSP), 12 PLLs for clock management, 24 global clock networks, and support for external memory interfaces including DDR3, DDR2, QDRII+, and RLDRAM II. The device is also equipped with up to 12 high-speed transceivers in larger packages; for this 780-FBGA variant, transceiver count and exact DSP block count are documented in the Stratix III device handbook. Partial reconfiguration is supported, allowing portions of the logic to be reprogrammed while the rest of the design continues operating.
Typical applications include high-end digital signal processing, software-defined radio, video processing pipelines, ASIC prototyping, and industrial control systems. The Stratix III L family specifically addresses wireless baseband processing, medical imaging, and broadcast equipment where high logic density and low dynamic power are simultaneously required.
When designing with this device, pay close attention to PCB-level signal integrity for the high-speed transceivers and DDR3 interfaces. The 780-ball FBGA requires controlled-impedance routing and a multi-layer PCB stack-up with continuous power and ground planes beneath the device for thermal dissipation and return-path integrity.
This page synthesizes distributor pricing, drop-in alternative recommendations, and engineering design notes not found in the manufacturer datasheet alone. The data is current as of 2026-09-10 and has been cross-referenced against DigiKey, Mouser, and Octopart listings.
直接替换替代料： EP3SL50F780C3 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3SL50F780C3 （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Operating Temperature, Family, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
EP3SL50F780C3N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$555 / 个
查看数据手册 →EP3SL50F780C3G
✅ 直接替换✓ 有现货
$625 / 个
查看数据手册 →EP3SL50F780C2
✅ 直接替换✓ 有现货
$199.95 / 个
查看数据手册 →EP3SL50F780C2N
✅ 直接替换✓ 有现货
$312 / 个
查看数据手册 →EP3SL50F780C2G
✅ 直接替换✓ 有现货
$264.9 / 个
查看数据手册 →EP3SE50F780C3
✅ 直接替换✓ 有现货
$890 / 个
查看数据手册 →EP3SL50F780C3 最大额定值与电气特性
| Family | Stratix III L (low-power) |
| Series | Stratix III |
| Logic Elements | 47,500 |
| Logic Array Blocks (LABs) | 1,900 |
| Embedded Memory Bits | 2,184,192 |
| User I/Os | 488 |
| Package Type | 780-BBGA, FCBGA (FineLine) |
| Device Pin Count | 780 |
| 工作温度 | 0C to +85C (Commercial) |
| Speed Grade | 3 |
| PLLs | 12 |
| Global Clock Networks | 24 |
| Process Node | 65 nm TSMC |
| Configuration Method | SRAM-based, supports Partial Reconfiguration |
| RoHS 状态 | Compliant |
| Lead-Free / Halogen-Free | Lead-Free (per package marking); Halogen-Free status unknown |
| 湿敏等级（MSL） | MSL3 (per JEDEC J-STD-020, typical for large FBGA) |
EP3SL50F780C3 780-bbga, fcbga (fineline) 引脚配置指南
EP3SL50F780C3（780-bbga, fcbga (fineline) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3SL50F780C3.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3SL50F780C3 适用于 6 应用s: Telecom Baseband Processing, Software Defined Radio (SDR), Video Processing and Image Pipeline, ASIC Prototyping, Industrial Control and Test Equipment, Medical Imaging Acceleration.
Telecom Baseband Processing
The EP3SL50F780C3 fits telecom baseband designs because its 47.5K logic elements and 2,184,192 bits of embedded block RAM deliver the parallel DSP capacity required for multi-carrier modulation, channel coding (LTE, WCDMA, GSM), and digital up/down conversion. The 488 user I/Os accommodate multiple CPRI / OBSAI / JESD204B links plus parallel DSP data paths, while the 12 PLLs generate the multiple low-jitter clocks needed for baseband, IF, and serial-link sections. The Stratix III L sub-family specifically targets lower dynamic power, critical for thermally constrained indoor BTS line cards. Designers typically pair this FPGA with TI DACs/ADCs and external DDR3 memory for buffering.
推荐
Software Defined Radio (SDR)
The EP3SL50F780C3 is well suited to software-defined radio platforms where hardware-accelerated DSP must process wideband IF streams from ADC front ends. Its 190+ embedded 18x18 multipliers support the FIR filtering, FFT/iFFT, and channelization required for multi-channel SDR receivers, and the 47.5K LE capacity allows multiple waveforms (LTE, Wi-Fi, custom) to coexist as soft cores. The 488 user I/Os include LVDS pairs for ADC/DAC connectivity and parallel control buses. Stratix III L devices support partial reconfiguration, enabling dynamic waveform switching at runtime. The trade-off versus newer Agilex devices is lower DSP performance per watt, but the Quartus II IP ecosystem remains mature for SDR algorithm deployment.
推荐
Video Processing and Image Pipeline
The EP3SL50F780C3 supports multi-stream video processing pipelines (broadcast, surveillance, medical imaging) where parallel pixel processing demands high logic density and ample internal memory. Its 2.18 Mbit embedded RAM buffers full-HD lines in real time without external memory access stalls, while the 488 user I/Os accept multiple parallel camera inputs, HDMI/DVI receivers, and SDI decoders. LVDS I/O capability handles sub-LVDS and SLVS sensor interfaces directly. Designers implement de-Bayering, color-space conversion, scaling, and overlay functions in custom RTL or DSP Builder blocks. The 780-FBGA package supports the dense I/O count, but thermal design must accommodate sustained processing of multiple 1080p60 streams.
推荐
ASIC Prototyping
The EP3SL50F780C3 is widely used for ASIC prototyping because its 47.5K logic elements can absorb large RTL blocks during design bring-up and validation. Multiple devices can be cascaded via LVDS or MGT links on multi-FPGA boards (e.g. DINI, Synopsys HAPS). Quartus II provides industry-standard synthesis, place-and-route, and timing closure flows familiar to ASIC engineers, and the Stratix III device handbook documents multi-FPGA partitioning guidelines. The trade-off is that the EP3SL50F780C3 lacks the hard PCIe, memory controller, and high-speed transceivers of newer Agilex 7 FPGAs, so designers must evaluate whether external transceiver chips or modern FPGAs better fit their prototype throughput requirements.
推荐
Industrial Control and Test Equipment
The EP3SL50F780C3 suits industrial control and automated test equipment (ATE) where custom timing, parallel sensor aggregation, and deterministic real-time response are required. The 488 user I/Os accept multi-channel analog front ends via SPI/I2C, parallel LVCMOS control buses, and encoder/counter inputs; the 12 PLLs generate the precisely synthesized clocks needed for sensor excitation, ADC sampling, and motor drive timing. Industrial-grade EMI/ESD considerations require careful PCB layout of the 780-FBGA, including decoupling networks and ground stitching vias around the perimeter. The commercial temperature grade (0C to +85C) covers most indoor industrial enclosures but excludes outdoor or unconditioned environments.
推荐
Medical Imaging Acceleration
The EP3SL50F780C3 accelerates medical imaging workloads such as ultrasound beamforming, CT reconstruction, and MRI gradient control where deterministic low-latency DSP is essential. Its 2.18 Mbit embedded RAM supports per-channel sample storage for synthetic-aperture beamforming across 64 to 128 transducer elements, while the 47.5K LE capacity implements multi-tap FIR filtering and envelope detection pipelines. The 780-FBGA package footprint suits high-channel-count ultrasound front-end cards where board area is constrained. Medical designs require IEC 60601-1 isolation, which the FPGA itself does not provide - isolation barriers and medical-grade power supplies must be added externally. The Last Time Buy status means new medical programs should evaluate Agilex 7 or Cyclone 10 GX for long-term availability.
推荐
推荐产品汇总
工程参考数据： EP3SL50F780C3 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3SL50F780C3N | EP3SL50F780C3G | EP3SL50F780C2 | EP3SL50F780C2N | EP3SL50F780C2G | EP3SE50F780C3 |
|---|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 780-FBGA (FCBGA) | 780-FBGA (FCBGA) - same | 780-FBGA (FCBGA) - same | 780-FBGA (FCBGA) - same | 780-FBGA (FCBGA) - same | 780-FBGA (FCBGA) - same | 780-FBGA (FCBGA) - same |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| Speed Grade | 3 | 3 | 3 | 2 (slower) | 2 (slower) | 2 (slower) | 3 |
| Sub-Family | Stratix III L (low-power) | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III E (enhanced) |
| Lead-Free Termination | Per marking (consult lot) | Yes (Pb-Free) | Yes (Pb-Free) | Per marking (consult lot) | Yes (Pb-Free) | Yes (Pb-Free) | Per marking (consult lot) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
关键差异点
- Stratix III L sub-family for power-sensitive designs （对比 EP3SE50F780C3)
- Speed grade 3 for balanced Fmax and power （对比 EP3SL50F780C2)
- 780-ball FBGA pin-compatible with same-density alternatives （对比 EP3SL50F780C3G)
设计说明
The 780-FBGA package (1.0 mm ball pitch, approximately 29 mm x 29 mm body) requires a multi-layer PCB with at least 6 layers including dedicated power and ground planes. Use 0.8 mm microvias or smaller for breakout routing and stagger vias to maintain return-path continuity. Place 0.1 uF decoupling capacitors within 2 mm of each power pin and bulk decoupling (10 to 100 uF) per power rail within 25 mm. All signal layers between the FPGA and high-speed memory must maintain 50 ohm single-ended or 100 ohm differential impedance with length matching within 25 mils for DDR3 byte lanes.
Estimated: at sustained high utilization (90% logic, 80% toggle rate) with VCCINT at nominal core voltage, the EP3SL50F780C3 can dissipate 5 to 8 W. With a typical JEDEC-compliant 8-layer PCB and 1 m/s airflow, theta_JA is approximately 12 to 15 C/W, yielding a junction-to-ambient temperature rise of 60 to 120 C above ambient. Place a thermal pad array of 25 to 49 thermal vias (0.3 mm diameter, 1.0 mm pitch) directly beneath the package center on the top ground plane, plus optional heatsink for industrial environments. Designers must validate the thermal model against the Stratix III packaging thermal data.
Common pitfalls when designing with the EP3SL50F780C3: (1) underestimating the configuration time for 47.5K LE - AS mode with EPCQ256 takes approximately 200 ms and must fit within system boot budgets; (2) failing to provision separate VCCPD (pre-driver) and VCCIO (I/O bank) rails for mixed-voltage I/O standards; (3) ignoring JTAG chain integrity - place a 33 ohm series resistor on TMS, TDI, and TCK near the FPGA; (4) ignoring nCONFIG and nSTATUS signal conditioning during power-up; (5) using inappropriate Quartus II Pin Planner assignments without verifying them against the device pin-out tables in the Stratix III device handbook.
Differential pair routing (LVDS, LVPECL) for high-speed serial links must maintain 100 ohm differential impedance with intra-pair skew below 10 mils. Place AC-coupling capacitors within 200 mils of the FPGA transmitter pins when interfacing with external transceiver ICs. For DDR3 interfaces, follow Micron's fly-by topology recommendations and use Quartus II's DDR3 controller IP with the integrated PHY wizard to auto-generate length-matched constraints. The 780-FBGA ball map requires careful planning to route all 488 user I/Os - leverage all 8 I/O banks for optimal placement.
合规信息
RoHS compliance verified via Altera/Intel product documentation. AEC-Q100 not applicable - this is an industrial/commercial-grade FPGA, not an automotive-qualified part. Lead-free termination confirmed per JEDEC J-STD-609 for the "G" suffix variants; non-"G" lots should be verified case-by-case. Halogen-free status not explicitly stated in the verified web data - set to unknown.
