EP3SL50F780C2 vs EP3SL50F780C3 对比

详细并排对比 EP3SL50F780C2 出自 Intel 和 EP3SL50F780C3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3SL50F780C2 EP3SL50F780C3
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 最后采购期
库存状态 有库存 有库存
单价(USD) $199.95 $540.00
Family Stratix III L Stratix III L (low-power)
Logic Elements (LE) 47,500 —
Logic Array Blocks (LABs) 1,900 1,900
Embedded Memory (bits) 2,184,192 —
Maximum User I/Os 488 —
Core Voltage 1.1 V —
Process Technology 65 nm —
封装 780-ball FCBGA (Flip-Chip BGA) —
工作温度 0°C to +85°C (commercial) 0C to +85C (Commercial)
Maximum Core Frequency 600 MHz —
Configuration Interface JTAG / passive serial / fast passive parallel —
I/O Standards LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces —
Embedded Memory Type TriMatrix (MLAB, M9K, M144K blocks) —
RoHS 状态 Compliant Compliant
安装类型 Surface Mount (BGA) —
Series — Stratix III
Logic Elements — 47,500
Embedded Memory Bits — 2,184,192
User I/Os — 488
Package Type — 780-BBGA, FCBGA (FineLine)
Device Pin Count — 780
Speed Grade — 3
Supply Voltage (Core) — [DATA_NEEDED: VCCINT nominal value]
PLLs — 12
Global Clock Networks — 24
Process Node — 65 nm TSMC
Configuration Method — SRAM-based, supports Partial Reconfiguration
Lead-Free / Halogen-Free — Lead-Free (per package marking); Halogen-Free status unknown
湿敏等级(MSL) — MSL3 (per JEDEC J-STD-020, typical for large FBGA)

数据手册与资源

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