EP3SL70F780I4N - 67.5K LE Stratix III L FPGA 780-FBGA | Intel
料号： EP3SL70F780I4N ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1121.83 | $1,121.83 |
| 10 | $1080.5 | $10,805.00 |
| 100 | $985.2 | $98,520.00 |
| 250 | $920 | $230,000.00 |
| 500 | $875.4 | $437,700.00 |
EP3SL70F780I4N 概述
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware resources such as block RAM, DSP slices, PLLs, and high-speed I/O serializers. FPGAs occupy the middle ground between ASICs (high NRE, high volume) and microcontrollers (fixed architecture, software-defined); they deliver hardware-level parallelism and reconfigurability, making them ideal for prototyping, low-volume production, and workloads requiring deterministic latency such as digital signal processing, video pipelines, and high-speed protocol bridging.
Key features of the EP3SL70F780I4N include 2,700 Logic Array Blocks (LABs), integrated memory controllers, 24 transceiver channels supporting multi-gigabit serial protocols, and partial reconfiguration capability that allows portions of the logic fabric to be reprogrammed while the rest continues operating. The device supports industrial-grade operating conditions (-40C to +100C junction) and uses Altera's Quartus II design suite for synthesis, place-and-route, and timing closure.
Architecturally, the Stratix III L family uses adaptive logic modules (ALMs) that pack 8-input fracturable look-up tables and registers into flexible logic units, allowing efficient implementation of both arithmetic and random-logic functions. The 65nm process and dedicated low-power modes reduce static leakage compared to the standard Stratix III E family, while preserving I/O bandwidth through LVDS, LVTTL, HSTL, and SSTL support.
Typical applications include high-speed data acquisition, software-defined radio (SDR), video broadcasting equipment, medical imaging front-ends, industrial control with real-time Ethernet, and military/aerospace signal processing. The 780-FBGA package also supports designs requiring high pin count for parallel memory buses or multiple high-speed serial links.
Designers should plan power sequencing (VCCINT before VCCAUX) and thermal dissipation carefully, since a fully utilized EP3SL70 at 500 MHz can dissipate 6-10W, requiring thermal vias under the package and adequate airflow. Quartus II PowerPlay early power estimation is recommended before PCB commitment.
This page synthesizes distributor pricing, same-family drop-in Stratix III L alternatives, and practical FPGA design notes not found in the manufacturer datasheet alone.
直接替换替代料： EP3SL70F780I4N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3SL70F780I4N （相同外形与封装尺寸） ——差异在于 Speed Grade, Package, Core Voltage, Process Technology, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
EP3SL70F780I4LN
✅ 直接替换✓ 有现货
$1245 / 个
查看数据手册 →EP3SL70F780I3N
✅ 直接替换✓ 有现货
$1240 / 个
查看数据手册 →EP3SL70F780I4
✅ 直接替换✓ 有现货
$1850 / 个
查看数据手册 →EP3SL50F780I4N
✅ 直接替换✓ 有现货
$545 / 个
查看数据手册 →EP3SL70F780C4N
✅ 直接替换✓ 有现货
$1210 / 个
查看数据手册 →EP3SL70F780C3N
✅ 直接替换✓ 有现货
$198 / 个
查看数据手册 →EP3SL70F780I4N 最大额定值与电气特性
| Family | Stratix III L (low-power) |
| Logic Elements (LE) | 67,500 |
| Logic Array Blocks (LABs) | 2,700 |
| Embedded Memory Bits | 2,699,264 |
| User I/Os | 488 |
| 封装 | 780-Ball FC-FBGA (29x29 mm) |
| Process Technology | 65 nm CMOS |
| Core Voltage (VCCINT) | 1.1 V |
| Auxiliary Voltage (VCCAUX) | 0.9 V |
| Maximum Operating Frequency | 500 MHz |
| Transceivers | 24 channels |
| DSP Blocks | Yes (18x18 multipliers) |
| 工作温度 | -40C to +100C (Industrial) |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| Speed Grade | I4 (faster) |
| Lead-Free | Yes |
EP3SL70F780I4N 780-ball fc-fbga (29x29 mm) 引脚配置指南
EP3SL70F780I4N（780-ball fc-fbga (29x29 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3SL70F780I4N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3SL70F780I4N 适用于 7 应用s: High-Speed Data Acquisition Systems, Software Defined Radio (SDR) Baseband, Video Broadcasting and Image Processing, Industrial Real-Time Ethernet Control, Medical Imaging Front-End Processing, Military and Aerospace Signal Processing, ASIC Prototyping and Emulation.
High-Speed Data Acquisition Systems
The EP3SL70F780I4N's 488 user I/Os, 24 transceiver channels, and 2.7Mbit embedded memory make it well-suited for multi-channel data acquisition front-ends. Its 65nm architecture supports parallel LVDS capture at up to 840 Mbps per channel, allowing aggregate throughput above 10 Gbps into on-chip block RAM buffers. The 780-FBGA package provides ample balls for differential pair routing and separate analog/digital ground domains.
推荐
Software Defined Radio (SDR) Baseband
For SDR baseband processing, the EP3SL70F780I4N's DSP blocks (18x18 multipliers) and high-speed transceivers handle multi-carrier digital down-conversion, channelization, and demodulation in a single fabric. The Stratix III L variant reduces static leakage compared to the E family, important in always-on base stations. Its industrial temperature range and 500 MHz Fmax meet outdoor small-cell requirements.
推荐
Video Broadcasting and Image Processing
The EP3SL70F780I4N delivers sufficient logic and memory bandwidth for 3G-SDI, HD-SDI, and emerging 4K/UHD video pipelines. Its embedded multipliers accelerate motion estimation and DCT/IDCT transforms, while 488 I/Os accept multiple parallel video streams from sensor arrays. Quartus II Video and Image Processing Suite (VIP) provides ready-to-use IP cores for color space conversion and scaling.
推荐
Industrial Real-Time Ethernet Control
With 488 I/Os and industrial temperature grade, the EP3SL70F780I4N handles EtherCAT, PROFINET IRT, or TSN protocol stacks with deterministic sub-microsecond latency. Its 65 nm low-power architecture suits factory-floor PLCs and motor controllers. The 780-FBGA package supports multiple MII/RGMII interfaces for redundant Ethernet ports and fieldbus gateways.
推荐
Medical Imaging Front-End Processing
In CT, MRI, and ultrasound systems, the EP3SL70F780I4N's parallel logic fabric performs beamforming, image reconstruction, and real-time filtering. Its industrial temp grade and high reliability suit medical equipment operating 24/7. The 2.7Mbit embedded memory buffers raw ADC samples before DMA to host processors; partial reconfiguration enables mode switching (preview vs diagnostic) without downtime.
推荐
Military and Aerospace Signal Processing
The EP3SL70F780I4N industrial temperature grade and high logic density suit ruggedized signal processing in avionics, radar, and electronic warfare subsystems. Its transceivers support protocol-agnostic serial links to RF front-ends and backplane fabrics. The 780-FBGA substrate tolerates conformal coating and the thermal envelopes typical of sealed military enclosures when properly heat-sunk.
推荐
ASIC Prototyping and Emulation
The EP3SL70F780I4N's 67.5K LEs provide ample capacity for partitioning and prototyping medium-complexity ASIC designs before tape-out. Quartus II incremental compilation allows multiple engineers to work in parallel on the same device. The 780-FBGA package exposes abundant GPIO for bridging to external test fixtures and logic analyzers during ASIC bring-up.
推荐
推荐产品汇总
工程参考数据： EP3SL70F780I4N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3SL70F780I4LN | EP3SL70F780I3N | EP3SL70F780I4 | EP3SL50F780I4N | EP3SL70F780C4N |
|---|---|---|---|---|---|---|
| Package | 780-Ball FC-FBGA (29x29 mm) | 780-Ball FC-FBGA (29x29 mm) - same | 780-Ball FC-FBGA (29x29 mm) - same | 780-Ball FC-FBGA (29x29 mm) - same | 780-Ball FC-FBGA (29x29 mm) - same | 780-Ball FC-FBGA (29x29 mm) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 67,500 | 67,500 - same | 67,500 - same | 67,500 - same | 51,800 (-23%) | 67,500 - same |
| Speed Grade | I4 | I4 - same | I3 (slower) | I4 - same | I4 - same | C4 (commercial temp, I4 speed) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial - same | Industrial - same | Industrial - same | Industrial - same | Commercial (0C to +85C) |
| User I/Os | 488 | 488 - same | 488 - same | 488 - same | 488 - same | 488 - same |
| Embedded Memory (bits) | 2,699,264 | 2,699,264 - same | 2,699,264 - same | 2,699,264 - same | 2,143,872 (-21%) | 2,699,264 - same |
| Process / Core Voltage | 65 nm / 1.1 V | 65 nm / 1.1 V - same | 65 nm / 1.1 V - same | 65 nm / 1.1 V - same | 65 nm / 1.1 V - same | 65 nm / 1.1 V - same |
| Lifecycle | NRND | NRND | NRND | NRND | NRND | NRND |
关键差异点
- I4 speed grade provides highest Fmax in Stratix III L 780-FBGA family （对比 EP3SL70F780I3N)
- Industrial temperature grade covers widest operating range in same package （对比 EP3SL70F780C4N)
- Highest LE count in 780-FBGA I4 industrial speed grade （对比 EP3SL50F780I4N)
- Low-power Stratix III L family reduces static leakage vs Stratix III E （对比 EP3SE50F780I4N)
设计说明
Estimated: A fully utilized EP3SL70F780I4N at 500 MHz with high toggle rates can dissipate 6-10 W. The 1.1V VCCINT rail must supply up to 5 A with less than 30 mV peak-to-peak ripple - use a buck converter with at least 20% current headroom (e.g., 6 A rated) and bulk-decoupling of 4x 220 uF polymer plus 20x 100 nF ceramics near the package. Power sequencing (VCCINT before VCCAUX, VCCAUX before VCCIO) is mandatory to prevent latch-up; use a sequencer IC such as the LM3880 or TPS3808.
The 780-FBGA has a typical theta_JB of 4 C/W; with a 7 W dissipation, junction-to-board temperature rise is ~28C. Design PCB with a full thermal-via array (0.3 mm pitch) under the package center connected to internal copper planes; for ambient > 60C or chassis-mounted applications, attach a heatsink with thermal interface material. Quartus II PowerPlay early power estimator should be run with realistic toggle rates before layout commitment.
Use 1.0 mm ball pitch BGA fanout with microvia-in-pad or 8-mil dogbone escape routing. Maintain 100-ohm differential impedance for LVDS pairs (typical 4-mil/8-mil stripline in 0.2 mm stackup). Split ground planes: digital ground for I/O banks and transceivers, analog ground for PLL/JTAG; join at a single point under the package. Match length within 25 mils for high-speed LVDS groups.
Do not use EP3SL70F780I4N for new designs - it is NRND; consider Stratix V (5SGXEA7) or Cyclone V (5CEFA7) instead, but note these require different packages. When migrating a design, re-run timing closure since architecture differences between L and E variants affect DSP block inference. JTAG chain ordering matters: place the EP3SL70 first in the chain for boundary-scan bring-up. Always validate configuration mode (AS, PS, FPP, JTAG) using the actual EPCS/EPCQ flash part number shipped, not the generic Quartus assignment.
Transceiver channels require AC-coupled differential routing with characteristic impedance of 85-100 ohms; reference plane continuity is critical across the entire channel. Place AC-coupling capacitors (10 nF X7R) within 100 mils of the receiver pins. For LVDS inputs at > 600 Mbps, add a 100-ohm differential source termination at the FPGA pin side. Use IBIS or HSpice simulation for critical interfaces, since the Quartus II Fitter does not model transmission-line effects.
合规信息
RoHS compliance confirmed per Intel/Altera product declaration. AEC-Q100 not applicable (FPGA is not an automotive-qualified part number; consult Intel auto-grade Cyclone or Arria for AEC-Q100 needs). Halogen-free status not explicitly published for this part - marked unknown.
