EP4CE40F29I8LN - 39.6K LE Cyclone IV E FPGA, 780-FBGA | Intel
料号： EP4CE40F29I8LN ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $220 | $220.00 |
| 10 | $205 | $2,050.00 |
| 100 | $185 | $18,500.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $150 | $150,000.00 |
EP4CE40F29I8LN 概述
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit in the programmable-logic tier of the broader digital IC hierarchy between ASICs (higher NRE, higher performance) and microcontrollers (lower performance, software-driven), enabling hardware-level parallelism, deterministic latency, and field upgradability for applications where general-purpose processors cannot meet throughput or timing requirements.
Key features of the EP4CE40F29I8LN include 4 input look-up tables (LUTs), 113 18x18 hardware multipliers, four general-purpose PLLs, 116 Kbits of distributed RAM, and 532 maximum user I/O pins routed through eight I/O banks supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards. The device also integrates dedicated configuration logic supporting passive serial (PS), active serial (AS), and JTAG configuration modes.
The Cyclone IV E architecture balances logic density, embedded memory, and DSP capability with low static and dynamic power, achieved through the 60 nm process and per-bank I/O voltage scaling. The 780-FBGA package exposes the maximum I/O count of the EP4CE40 device family, enabling high-bandwidth parallel interfaces to external memory and high-speed peripherals.
Typical applications include industrial motor control and drive systems, factory automation controllers, video processing and display pipelines, telecommunications line cards, and military/aerospace avionics subsystems. The wide industrial temperature range and robust logic capacity make the EP4CE40F29I8LN well-suited to designs that require deterministic real-time performance with hardware parallelism.
When designing with this device, plan I/O bank assignments carefully to avoid VCCIO bank supply conflicts, and follow the Quartus II / Quartus Prime power-up and configuration sequencing recommendations. Because the 780-FBGA package is large and BGA-routed, PCB stack-up, microvia design, and thermal management must be addressed in the early schematic/layout phase.
直接替换替代料： EP4CE40F29I8LN ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP4CE40F29I8LN （相同外形与封装尺寸） ——差异在于 Package, Configuration Modes, Embedded Multipliers (18x18), Process Node, Speed Grade.
快速对比工具——选择替代料号进行并排对比：
EP4CE40F29I8L
✅ 直接替换✓ 有现货
$91.74 / 个
查看数据手册 →EP4CE40F29I7N
✅ 直接替换✓ 有现货
$124 / 个
查看数据手册 →EP4CE40F29C8LN
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →EP4CE40F29C9LN
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →EP4CE30F29I8LN
✅ 直接替换✓ 有现货
$109.95 / 个
查看数据手册 →EP4CE40F23I8LN
✅ 直接替换✓ 有现货
$148 / 个
查看数据手册 →EP4CE40F29I8LN 最大额定值与电气特性
| Family | Cyclone IV E |
| Logic Elements (LE) | 39,600 |
| Embedded Memory Bits | 1,161,216 bits |
| Maximum User I/O | 532 |
| Operating Supply Voltage (Core) | 1.2 V |
| Number of PLLs | 4 |
| 18x18 Hardware Multipliers | 113 |
| Process Technology | 60 nm |
| 封装 | 780-FBGA |
| Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | 8 |
| 安装类型 | Surface Mount (BGA) |
| RoHS 状态 | Compliant |
| Configuration Modes | PS, AS, JTAG |
| Lead-Free | Yes |
EP4CE40F29I8LN 780-fbga 引脚配置指南
EP4CE40F29I8LN（780-fbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP4CE40F29I8LN.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP4CE40F29I8LN 适用于 6 应用s: Industrial Motor Control & Drives, Factory Automation Controllers (PLC / PAC), Video Processing & Display Pipelines, Telecommunications Line Cards & Backplanes, Military & Aerospace Avionics Subsystems, Test & Measurement Instrumentation.
Industrial Motor Control & Drives
The EP4CE40F29I8LN is a strong fit for industrial motor control and AC/servo drive designs because it combines 39,600 logic elements with 113 hardware 18x18 multipliers and 4 PLLs, enabling field-oriented control (FOC), space-vector PWM, and encoder interfaces in deterministic hardware. Its industrial -40 °C to 100 °C temperature rating suits factory-floor enclosures and outdoor cabinet installations, while the 780-FBGA exposes 532 user I/Os for parallel ADC feedback, multiple resolver/Hall channels, and isolated communication links. Compared with running motor control on a microcontroller, the FPGA delivers deterministic sub-microsecond loop times critical for high-RPM servo performance. Typically the FPGA sits alongside the MCU/DSP, offloading PWM generation, current sampling windows, and safety interlocks.
推荐
Factory Automation Controllers (PLC / PAC)
For PLC, PAC, and distributed I/O designs, the EP4CE40F29I8LN offers the logic density to implement custom industrial protocols (Modbus TCP, EtherCAT, PROFINET slave stacks), multiple high-speed counters, and PID loops in parallel hardware. The 60 nm process and 1.2 V core keep dynamic power low enough for fan-less DIN-rail enclosures, while 532 I/Os accommodate multi-axis control and dense digital I/O banks. The industrial temperature grade (-40 °C to 100 °C) supports deployment in unheated shop-floor cabinets. Compared with discrete MCU + ASIC designs, this FPGA allows late-stage customization for protocol and I/O mix without re-spinning the PCB.
推荐
Video Processing & Display Pipelines
The EP4CE40F29I8LN suits mid-range video bridging, scaling, and overlay designs where its 39,600 LEs and 113 hardware multipliers implement color-space conversion, deinterlacing, and chroma resampling at pixel-clock rates. Its 532 I/Os enable wide parallel RGB/YCbCr buses, BT.656/1120 video ports, and LCD timing interfaces without external bus switches. The 1.2 V core and per-bank VCCIO scaling allow direct connection to 1.8 V, 2.5 V, and 3.3 V video ADCs/DACs. Typical placements include surveillance video walls, medical imaging preview stages, and broadcast up/down-converters where deterministic latency is more important than raw pixel throughput.
推荐
Telecommunications Line Cards & Backplanes
Telecom line-card and backplane designers value the EP4CE40F29I8LN's 532 I/Os for parallel LVDS-based switching fabrics, framer/HDLC interfaces, and TDM bus aggregation. With 4 PLLs the FPGA generates multiple independent clocks for backplane SERDES-equivalent links, T1/E1 framers, and SyncE timing. The 60 nm process keeps static leakage low enough for hot-aisle deployments, and the industrial temperature range tolerates forced-air cooled chassis. Pair with external PHYs/transceivers for full CPRI/OBSAI or Ethernet MAC front ends. Compared with an ASIC, the FPGA allows last-minute protocol updates without respin.
推荐
Military & Aerospace Avionics Subsystems
The EP4CE40F29I8LN is widely used in defense and avionics subsystems where deterministic real-time behavior, radiation-tolerant design practices, and mid-density logic capacity are required. Its industrial temperature range (-40 °C to 100 °C) covers most cockpit and ground-vehicle environments, and the 780-FBGA provides high I/O density for MIL-STD-1553, ARINC 429, and discrete avionics I/O. The hardware DSP blocks accelerate radar signal conditioning, and 4 PLLs support multiple synchronized clocks for sensor fusion. Typical deployments include flight control peripherals, data recorders, and ruggedized mission computers.
推荐
Test & Measurement Instrumentation
For bench and ATE instrumentation, the EP4CE40F29I8LN implements custom timing engines, parallel stimulus/response capture, and protocol decoding in deterministic hardware. The 532 I/Os accommodate dense pogo-pin beds and multiple serial bus analyzers, while the 1,161,216 bits of block RAM capture deep waveform traces without external memory. The 4 PLLs let engineers synthesize jitter-cleaning clocks for high-precision ADC interfaces. Compared with discrete logic, this FPGA shortens development cycles by replacing ASIC design spins with programmable logic.
推荐
推荐产品汇总
工程参考数据： EP4CE40F29I8LN ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP4CE40F29I8L | EP4CE40F29I7N | EP4CE40F29C8LN | EP4CE40F29C9LN | EP4CE30F29I8LN |
|---|---|---|---|---|---|---|
| Package | 780-FBGA | 780-FBGA | 780-FBGA | 780-FBGA | 780-FBGA | 780-FBGA |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 | 28,848 |
| Speed Grade | 8 | 8 | 7 (faster) | 8 | 9 (slower) | 8 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Embedded Memory (bits) | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 608,256 |
| Max User I/O | 532 | 532 | 532 | 532 | 532 | 532 |
| 18x18 Multipliers | 113 | 113 | 113 | 113 | 113 | 66 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
关键差异点
- Highest-density 780-FBGA EP4CE40 with industrial temperature range （对比 EP4CE40F29C8LN)
- Faster speed grade available in same package （对比 EP4CE40F29C9LN)
- Full-density logic + DSP for high-end motor control （对比 EP4CE30F29I8LN)
设计说明
The 780-FBGA package requires a PCB stack-up with sub-0.5 mm pitch escape routing. Use microvia (laser-drilled) technology in HDI builds rather than through-hole fan-out, and provide continuous ground/power planes under the BGA to control impedance and reduce return-path inductance. Estimate: a 4-6 layer HDI stack-up with 0.4 mm BGA pitch is typical for production designs.
Estimated: at maximum toggle rate with all 532 I/Os switching, the EP4CE40F29I8LN can dissipate 1.5-2.5 W. Without forced airflow, the 780-FBGA theta_JA of approximately 15-20 C/W will allow a junction rise well within the 100 C industrial limit, but in enclosed cabinets add thermal vias under the central BGA grid and consider a small heatsink for sustained industrial operation.
Cyclone IV E devices require proper power sequencing: VCCINT (1.2 V) must ramp before or simultaneously with VCCIO, and configuration pins (nCONFIG, nSTATUS, CONF_DONE) must be valid before the device releases into user mode. Failing to sequence correctly produces intermittent configuration failures. Also, the LVDS I/O requires a 100 ohm differential termination near the receiver; absent termination will distort high-speed signals at >400 Mbps.
合规信息
Per Intel/Altera product page, EP4CE40F29I8LN is RoHS compliant and lead-free (N suffix). AEC-Q100 not applicable for FPGAs. Conflict-minerals CMRT filed by Intel.
