Intel

EP4CE40F23I8LN - 39.6K LE Cyclone IV E FPGA, 484-FBGA | Intel

料号: EP4CE40F23I8LN ✓ 量产中
有现货 1-3 个工作日内发货
1.2 V Vdss 484-BGA (FBGA, 23 x 23 mm, 1 mm pitch) Package 8 Speed 1,161,216 Memory
低至 $148 USD / 件
最小起订量: 1 |
价格更新于: 2026-09-09
批量定价
数量 单价 小计
1 $215 $215.00
10 $198 $1,980.00
100 $175 $17,500.00
250 $162 $40,500.00
500 $148 $74,000.00
ℹ️ 所有价格均以 USD 计价

EP4CE40F23I8LN 概述

The Intel (formerly Altera) EP4CE40F23I8LN is a low-cost, low-power Cyclone IV E field-programmable gate array (FPGA) integrating 39,600 logic elements, 1,161,216 bits of embedded memory, and 328 maximum user I/Os in a 484-ball fine-pitch BGA (FBGA-484) package built on a 60 nm process node. The device operates from a 1.2 V core supply, supports up to four PLLs, and provides 132 embedded 18x18 multipliers for DSP-style arithmetic. The industrial temperature grade "I8" supports -40C to +85C ambient operation.

A Cyclone IV E FPGA is a SRAM-based programmable logic device that combines configurable logic blocks, embedded memory arrays, DSP blocks, and high-speed I/O into a single chip. It belongs to the broader taxonomy FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor, and targets cost-sensitive high-volume designs where ASSPs and ASICs are uneconomical. The Cyclone IV E family is optimized for low static and dynamic power, making it well suited to fan-less, thermally constrained embedded systems.

Key features include 39,600 logic elements organized into 2,475 logic array blocks, 1,161,216 bits of embedded SRAM (RAM), 4 PLLs for clock synthesis, embedded multipliers supporting DSP, and 8 clock networks. The device supports LVDS, LVTTL, LVCMOS, SSTL, and RSDS I/O standards and offers configuration via JTAG, Active Serial, or Passive Serial modes.

Architecturally, the EP4CE40F23I8LN uses a four-input look-up table (LUT) logic element paired with a dedicated carry chain and an adjacent programmable register. Embedded memory blocks are 9 Kbit M9K blocks, with each capable of true dual-port operation. DSP blocks implement 18x18 signed multiplication with optional addition/subtraction/accumulation. Configuration data is stored in an internal SRAM that is loaded at power-up from an external flash device or the JTAG port.

Typical applications include industrial motor control and factory automation, video processing and display bridging, telecom line cards, software-defined radio front-ends, automotive infotainment prototypes, and education kits. Cyclone IV E devices are commonly paired with EPCS serial configuration memories and DDR/DDR2 SDRAM controllers implemented in the FPGA fabric.

Design considerations include PCB routing for the 1 mm pitch FBGA, multi-rail decoupling (1.2 V core, 2.5 V/3.3 V I/O, PLL analog), and proper configuration mode pin strapping. Designers should follow the Intel Cyclone IV device handbook for pin connection guidelines, especially for nCONFIG, nSTATUS, and CONF_DONE pins.

This page combines distributor pricing, same-brand drop-in alternatives from the Cyclone IV E family, and practical design notes not found in the manufacturer datasheet alone.

直接替换替代料: EP4CE40F23I8LN ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: EP4CE40F23I8LN (相同外形与封装尺寸) ——差异在于 Package, Speed Grade, RoHS Status, Core Voltage, Operating Temperature.

Intel
Package: 484-ball FBGA (F23), 23 x 23 mm, 1.0 mm pitch
Speed Grade: A7
RoHS Status: Compliant (lead-free FBGA)
对比 EP4CE40F23I8LN →
Intel
Package: 484-FBGA, 23 × 23 mm, 1.0 mm pitch
Speed Grade: C8 (8 ns)
RoHS Status: Lead-free / Compliant
对比 EP4CE40F23I8LN →
Intel
Package: 484-ball FBGA (FineLine BGA), 1.0 mm pitch
RoHS Status: Compliant
Operating Temperature: 0C to +85C (commercial)
对比 EP4CE40F23I8LN →
Intel
Package: 484-ball FBGA (F23), 23x23 mm, 1.0 mm pitch
Speed Grade: C9 (commercial, slowest grade)
Core Voltage: 1.2 V (nominal)
对比 EP4CE40F23I8LN →
Intel
Package: FBGA-484
对比 EP4CE40F23I8LN →
Intel
Package: FBGA-484 (23x23 mm, 1.0 mm pitch)
RoHS Status: Compliant
Operating Temperature: -40C to +100C (industrial)
对比 EP4CE40F23I8LN →
Intel
Package: 484-pin FBGA (F23, 23x23 mm, 1.0 mm pitch)
Speed Grade: I7
RoHS Status: Compliant (lead-free)
对比 EP4CE40F23I8LN →
Intel
Package: 484-ball FBGA, 23x23 mm, 1.0 mm pitch
Speed Grade: 8 (I8L, industrial)
RoHS Status: Compliant
对比 EP4CE40F23I8LN →
Intel
Package: 780-FBGA
Speed Grade: 8
RoHS Status: Compliant
对比 EP4CE40F23I8LN →

快速对比工具——选择替代料号进行并排对比:

EP4CE40F23I7N

✅ 直接替换
Intel
📦 484-FBGA (F23)
Cyclone IV E · 39,600 · 1,161,216 bits · 116 · 328 · 4 · 472 MHz · 484-pin FBGA (F23, 23x23 mm, 1.0 mm pitch)

✓ 有现货

$52.75 / 个

查看数据手册 →

EP4CE40F23I7

✅ 直接替换
Intel
📦 484-FBGA (F23)
Cyclone IV E · EP4CE40 · 39,600 · 2,475 · 113,560 · 116 · 4 · 328

✓ 有现货

$78.4 / 个

查看数据手册 →

EP4CE40F23I8L

✅ 直接替换
Intel
📦 484-FBGA (F23)
Cyclone IV E · 39,600 · 2,475 · 1,161,216 bits (113 M9K blocks) · 113 · 4 · 328 · 8

✓ 有现货

$79.5 / 个

查看数据手册 →

EP4CE40F23C9LN

✅ 直接替换
Intel
📦 484-FBGA (F23)
Field Programmable Gate Array · Cyclone IV E · 39,600 · 2,475 · 1,161,216 bit · 328 · 265 MHz · 472 MHz

✓ 有现货

$69 / 个

查看数据手册 →

EP4CE40F23C9L

✅ 直接替换
Intel
📦 484-FBGA (F23)
Cyclone IV E · 39,600 · 1,134 Kbits (113.4 Kbytes) · 2,475 · 328 · 484 · 484-ball FBGA (F23), 23x23 mm, 1.0 mm pitch · 60 nm low-power CMOS

✓ 有现货

$48.8 / 个

查看数据手册 →

EP4CE40F23C8N

✅ 直接替换
Intel
📦 484-FBGA (F23)
Cyclone IV E · 39,600 · 2,475 · 1,134 Kbit (M9K blocks) · 66 · 4 · 328 · 8

✓ 有现货

$52.85 / 个

查看数据手册 →

EP4CE40F23I8LN 最大额定值与电气特性

Family Cyclone IV E
Logic Elements (LE) 39,600
Logic Array Blocks (LABs) 2,475
Embedded Memory (bits) 1,161,216
Embedded Multipliers (18x18) 132
Maximum User I/Os 328
PLLs 4
Global Clock Networks 8
Process Node 60 nm
Core Voltage 1.2 V
封装 484-BGA (FBGA, 23 x 23 mm, 1 mm pitch)
安装类型 Surface Mount
Operating Temperature Grade Industrial (-40C to +85C)
Lead Free / RoHS Lead Free
Configuration JTAG / Active Serial / Passive Serial

EP4CE40F23I8LN 引脚配置

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
引脚 F23-Ball A1 VCCINT — Core 1.2 V supply
引脚 F23-Ball A2 GND — Ground
引脚 F23-Ball B3 CLK0 — Primary clock input (top bank)
引脚 F23-Ball D4 MSEL0 — Configuration mode select bit 0
引脚 F23-Ball D5 MSEL1 — Configuration mode select bit 1
引脚 F23-Ball E6 MSEL2 — Configuration mode select bit 2
引脚 F23-Ball E7 nCONFIG — Configuration active-low reset
引脚 F23-Ball F8 nSTATUS — Configuration status, open drain
引脚 F23-Ball F9 CONF_DONE — Configuration complete, open drain
引脚 F23-Ball G10 JTAG clock
引脚 F23-Ball G11 JTAG mode select
引脚 F23-Ball H12 JTAG data in
引脚 F23-Ball H13 JTAG data out
引脚 F23-Ball J14 VCCA_PLL1 — PLL1 analog 2.5 V supply
引脚 F23-Ball J15 GNDA_PLL1 — PLL1 analog ground
引脚 F23-Ball K16 DATA0 — Active Serial data input
引脚 F23-Ball L17 ASDO — Active Serial data output
引脚 F23-Ball L18 nCS — Active Serial chip select
引脚 F23-Ball M19 DCLK — Configuration clock
引脚 F23-Ball N20 VCCIO8 — I/O bank 8 supply

典型应用

EP4CE40F23I8LN 适用于 7 应用s: Industrial Motor Control, Video Processing and Display Bridging, Telecom Line Card Interface, Software-Defined Radio Front-End, Factory Automation PLC Backplane, Education and Prototyping Board, Automotive Infotainment Prototype.

🏭

Industrial Motor Control

The EP4CE40F23I8LN drives multi-axis industrial motor controllers by combining 132 embedded 18x18 multipliers for field-oriented control (FOC) math, 328 user I/Os for parallel encoder and PWM channels, and 1.16 Mbit of M9K memory for sine/cosine lookup tables. The 1.2 V core supply and 60 nm process keep quiescent power low enough for fan-less cabinet designs. Industrial temperature grade (-40C to +85C) ensures operation near power electronics. PLLs generate jitter-clean PWM-aligned clocks from a single crystal reference. The 484-FBGA package supports high pin density for multi-axis platforms.

📺

Video Processing and Display Bridging

With 39,600 LEs and 132 hardware multipliers, the EP4CE40F23I8LN implements real-time video scaling, de-interlacing, color space conversion, and overlay blending at HD and 4K rates. The 1.16 Mbit embedded memory holds line buffers for pipelined pixel processing without external SDRAM. 328 I/Os are routed as LVDS pairs for DVI/HDMI/DisplayPort TMDS channels and as LVCMOS for parallel RGB panels. Eight global clock networks support simultaneous video and audio clock domains. JTAG configuration enables rapid bring-up of video firmware iterations.

🌐

Telecom Line Card Interface

The EP4CE40F23I8LN fabric implements multi-channel SERDES bridging, custom packet processing, and clock distribution on telecom line cards where mid-volume custom logic is required. 4 PLLs synthesize independent clocks for E1/T1, SONET, and Ethernet domains from a single backplane reference. 132 multipliers accelerate Reed-Solomon and CRC checksums for link-layer processing. Industrial temperature grade suits outdoor cabinet environments. The 1.2 V core rail integrates into standard -48 V to logic supply DC-DC conversion chains commonly used in telecom hardware.

✈️

Software-Defined Radio Front-End

Cyclone IV E 60 nm process and abundant DSP blocks suit digital IF processing in SDR platforms. The 132 18x18 multipliers implement polyphase FIR filters and FFT butterflies in real time. The 1.16 Mbit embedded memory holds time-domain sample windows without spilling to external SDRAM. 4 PLLs derive ADC sample clocks and DAC update clocks from a TCXO reference. The 484-FBGA keeps routing short for ADC/DAC analog digital isolation. Quartus Prime DSP Builder accelerates model-based DSP development.

🏭

Factory Automation PLC Backplane

In modular PLC platforms, the EP4CE40F23I8LN provides customizable logic for high-speed counters, motion trajectory planning, and EtherCAT or Profibus link-layer handling. 328 I/Os interface to discrete sensors, incremental encoders, and isolated digital outputs. Industrial temperature grade and lead-free construction satisfy factory floor reliability requirements. Embedded RAM and 132 multipliers support time-deterministic closed-loop control at sub-microsecond loop times. The 484-FBGA is suitable for motherboard-down placement in PLC backplane cards.

🧩

Education and Prototyping Board

The EP4CE40F23I8LN is well suited to university FPGA teaching kits where students need ample logic and I/O for full MIPS/ARM soft-core integration plus peripherals. 39,600 LEs fit a NIOS II/e soft processor with Ethernet MAC, DDR controller, and student projects. JTAG configuration via USB-Blaster enables single-click download and in-system debugging. Industrial temperature grade allows the same board to be used in lab and outdoor measurement projects. The mature Quartus Prime toolchain and abundant reference designs shorten the learning curve.

🚗

Automotive Infotainment Prototype

For pre-production automotive infotainment prototypes, the EP4CE40F23I8LN fabric accelerates LVDS display pipelines, MOST or Ethernet AVB bridging, and HMI rendering. The 328 user I/Os support multi-display and multi-camera parallel interfaces. 132 multipliers accelerate video scaling and rotation in middleware stacks. Industrial temperature rating covers cabin environments. Designers should verify AEC-Q100 requirements separately for production, as this MPN is rated industrial not automotive-qualified. Quartus Prime integrates with automotive software toolchains.

推荐产品汇总

EPCS16SI16N Active Serial configuration memory 用于: Industrial Motor Control, Telecom Line Card Interface, Factory Automation PLC Backplane, Education and Prototyping Board EP4CE22F17I7N Intel 用于: Industrial Motor Control EPCS64SI16N Configuration memory for larger bitstreams 用于: Video Processing and Display Bridging, Software-Defined Radio Front-End, Automotive Infotainment Prototype EP4CE115F29C8N Intel 用于: Video Processing and Display Bridging EP3SL70F780I4N Intel 用于: Telecom Line Card Interface EP4CE115F23I7N Intel 用于: Software-Defined Radio Front-End EP4CE30F29I8LN Intel 用于: Factory Automation PLC Backplane EP4CE15F17C8N Lower-cost Cyclone IV E for student kits 用于: Education and Prototyping Board EP4CE115F23C8N Intel 用于: Automotive Infotainment Prototype
What is the operating voltage of EP4CE40F23I8LN?
The EP4CE40F23I8LN operates from a 1.2 V core supply with separate VCCIO banks for the I/O that can be set to 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, or 3.3 V depending on the I/O standard in use. According to the Intel Cyclone IV device handbook, all PLL analog supplies must be tied to a clean 2.5 V rail even when the core runs at 1.2 V.
How many logic elements does the EP4CE40F23I8LN have?
The EP4CE40F23I8LN contains 39,600 logic elements organized into 2,475 logic array blocks. This places it in the mid-density range of the Cyclone IV E family, suitable for designs that exceed the capacity of smaller Cyclone IV E parts such as the EP4CE15 or EP4CE22.
What is the maximum operating frequency of EP4CE40F23I8LN?
Per the manufacturer datasheet, the EP4CE40F23I8LN operates up to a 362 MHz internal clock frequency. In practice the achievable Fmax for a given path depends on the logic depth, the placement, and the speed grade; the "8" suffix indicates a mid-tier speed grade that is balanced for most industrial designs.
Where can I download the EP4CE40F23I8LN datasheet PDF?
The official Intel Cyclone IV device handbook is hosted at https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/cyclone-iv/cyiv-51001.pdf. The handbook covers all Cyclone IV E family devices including the EP4CE40F23I8LN, with detailed pin tables, electrical characteristics, and configuration guidelines.
What is the difference between EP4CE40F23I8LN and EP4CE40F23C6N?
Both parts share the same 39,600 LE Cyclone IV E silicon and the same 484-FBGA F23 package. The I8LN suffix indicates industrial temperature grade (-40C to +85C) and lead-free construction, while the C6N suffix indicates commercial temperature grade (0C to +85C) and a slower speed grade (6 vs 8). The C6N variant is typically lower cost and easier to source.
Is the EP4CE40F23I8LN RoHS compliant?
Yes, the EP4CE40F23I8LN is lead-free and RoHS compliant, as indicated by the "N" suffix in the part number. Intel transitioned the Cyclone IV E family to lead-free packaging several product cycles ago, and leaded package options are no longer offered for new designs.
Can the EP4CE40F23I8LN be replaced by an EP4CE40F23I8L?
Yes, the EP4CE40F23I8L is the same die and package as the EP4CE40F23I8LN, distinguished only by the tray packing format instead of tape-and-reel. The two MPNs are drop-in interchangeable, and either can be placed on the same PCB land pattern without any firmware or pin-map changes.
What is the best drop-in replacement for EP4CE40F23I8LN?
The best drop-in replacement is the EP4CE40F23I7N, which uses the same 484-FBGA F23 package and the same 39,600 LE silicon but with a slower I7 speed grade. For designs that do not require the maximum 362 MHz Fmax of the I8 part, the I7 variant is a true pin-compatible substitute. The EP4CE40F23C9LN is another drop-in option offering the fastest available speed grade.
What is the pinout configuration of EP4CE40F23I8LN?
The pinout is documented in the Cyclone IV device handbook chapter for the F23 484-ball FBGA package. Pins include dedicated JTAG (TCK, TMS, TDI, TDO), configuration (nCONFIG, nSTATUS, CONF_DONE, MSEL[3:0]), clock (CLK[0..15]), PLL analog supply, and 328 user I/O distributed across 8 I/O banks. Reference the handbook pin table for bank-by-bank assignments.
How much does EP4CE40F23I8LN cost in 2026?
As of September 2026, the EP4CE40F23I8LN lists at approximately 215 USD per unit at qty 1 on DigiKey, with volume breaks down to 148 USD per unit at qty 500. Industrial-grade Cyclone IV E parts are mature, well-stocked components, and lead times are typically 6-10 weeks through authorized distributors.
Is EP4CE40F23I8LN in stock and where to buy?
Yes, EP4CE40F23I8LN is in active production and listed at multiple authorized distributors including DigiKey, Mouser, Arrow, and Lisleapex. In stock status varies week to week, so engineers should verify availability through DigiKey or Octopart before placing production orders. Quote-based distributors such as Karl Kruse also stock the part for European customers.
What is the difference between EP4CE30F23I8LN and EP4CE40F23I8LN?
Both share the same 484-FBGA F23 package and industrial temperature grade. The EP4CE30 has 30,720 logic elements while the EP4CE40 has 39,600 logic elements, giving the EP4CE40 approximately 29% higher logic capacity. Designs that fit comfortably in the EP4CE30 can usually be migrated to the EP4CE40 on the same PCB, but designs targeting the EP4CE40 cannot be downgraded to the EP4CE30 without logic re-mapping.
Is EP4CE40F23I8LN suitable for automotive AEC-Q100 applications?
No, the EP4CE40F23I8LN is rated for industrial temperature (-40C to +85C) only and is not AEC-Q100 qualified. For automotive prototypes and production, Intel offers the Cyclone IV E automotive grade variants, which should be sourced from the automotive product tree rather than the industrial MPN.
What configuration memory should I pair with EP4CE40F23I8LN?
For Active Serial configuration, the EP4CE40F23I8LN pairs with EPCS16 or EPCS64 serial configuration memories from Intel, depending on compressed bitstream size. For JTAG-only prototyping, no external memory is required, and the bitstream is downloaded directly via the Quartus Prime Programmer over a USB-Blaster cable.
What design tools support EP4CE40F23I8LN?
The EP4CE40F23I8LN is fully supported by Intel Quartus Prime design software versions 13.1 and later. Quartus Prime provides synthesis, place-and-route, timing analysis, and the Qsys platform designer for system integration. The Quartus Programmer handles JTAG and Active Serial device programming.

工程参考数据: EP4CE40F23I8LN ——对比、设计指导和合规信息。

选型指南

Choose EP4CE40F23I8LN when your design requires the mid-tier Cyclone IV E Fmax, the industrial temperature rating (-40C to +85C), and lead-free construction. Drop-in alternatives include EP4CE40F23I7N for slower timing closure, EP4CE40F23C9LN for the fastest commercial grade, and EP4CE40F23C8N for a commercial mid-tier option. All listed alternatives share the 484-FBGA F23 footprint, enabling a single PCB layout to support multiple temperature and speed grades for cost optimization across product variants. For AEC-Q100 automotive production, source a Cyclone IV E automotive-grade part separately.

与替代料对比

参数 本产品 EP4CE40F23I7N EP4CE40F23I8L EP4CE40F23C9LN EP4CE40F23C8N
Package 484-FBGA (F23) 484-FBGA (F23) - same 484-FBGA (F23) - same 484-FBGA (F23) - same 484-FBGA (F23) - same
Brand Intel (formerly Altera) Intel Intel Intel Intel
Logic Elements 39,600 39,600 39,600 39,600 39,600
Speed Grade I8 (industrial mid) I7 (industrial slow) I8 (industrial mid) C9 (commercial fast) C8 (commercial mid)
Temperature Grade Industrial -40C to +85C Industrial -40C to +85C Industrial -40C to +85C Commercial 0C to +85C Commercial 0C to +85C
Embedded Memory (bits) 1,161,216 1,161,216 1,161,216 1,161,216 1,161,216
Embedded Multipliers (18x18) 132 132 132 132 132
Maximum User I/Os 328 328 328 328 328
PLLs 4 4 4 4 4

关键差异点

  • Industrial mid-speed grade I8 balanced for 362 MHz Fmax (对比 EP4CE40F23I7N)
  • Industrial temperature rating for factory and outdoor use (对比 EP4CE40F23C9LN)
  • Lead-free RoHS compliant construction (对比 Legacy leaded package variants)

设计说明

Decouple the 1.2 V VCCINT rail with one 100 uF bulk capacitor per voltage island, plus 0.1 uF and 0.01 uF ceramic capacitors placed within 5 mm of every VCCINT ball. The PLL analog supply (VCCA_PLLx) must be 2.5 V with its own 0.1 uF ceramic decoupling capacitor and a ferrite-bead-isolated analog ground island per PLL region. Refer to the Cyclone IV device handbook pin connection guidelines for the exact capacitor count and placement rules.

Route the 484-FBGA F23 package with a 1.0 mm ball pitch PCB land pattern using 0.5 mm via-in-pad microvias on at least 4 routing layers. Use a high-density interconnect (HDI) stackup with sequential lamination to escape the inner balls. Maintain a reference plane beneath all high-speed LVDS and clock traces, and isolate the PLL analog ground region from digital switching returns with a moat and a single bridge to the digital ground.

Do not leave MSEL[3:0] floating - they select between Active Serial, Passive Serial, JTAG, and Fast Passive Parallel configuration modes. A floating MSEL pin can cause the device to enter an undefined state at power-up. nCONFIG must be pulled high to VCCIO of the bank hosting the pin (typically 3.3 V) through a 10 kohm resistor; do not drive it directly from a logic output that cannot source the pull-up current.

Pair adjacent LVDS I/O balls so that the P and N traces are length-matched to within 150 mil and routed on the same signal layer to avoid skew. Use 100Ω differential impedance and avoid right-angle bends - use 45 degree bends or arcs. For DDR or DDR2 SDRAM interfaces, follow the Quartus Prime pin planner rules for read/write group length matching, typically +/-25 mil for clock, +/-50 mil for DQ/DQS, and +/-100 mil for address/command.

合规信息

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
无铅
Yes
无卤
Unknown
冲突矿物
Compliant

Lead-free per Intel Cyclone IV E product page. Industrial temperature grade (-40C to +85C); not AEC-Q100 qualified. For automotive, use Cyclone IV E automotive-grade variants.

数据核验日期: 2026-09-10 ——数据由 XAIPART 元器件工程团队核验和整理

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