EP4CGX110DF27C6N - 109K LE Cyclone IV GX FPGA, 672-FBGA | Intel
料号： EP4CGX110DF27C6N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $165 | $165.00 |
| 10 | $152 | $1,520.00 |
| 100 | $138.5 | $13,850.00 |
| 250 | $128.75 | $32,187.50 |
| 500 | $119.9 | $59,950.00 |
EP4CGX110DF27C6N 概述
What is a Cyclone IV GX FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O that can be re-programmed to implement arbitrary digital logic. The Cyclone IV GX variant extends the base Cyclone IV E family by adding high-speed serial transceivers, placing it in the low-power, low-cost FPGA tier alongside Spartan-6 from Xilinx and LatticeECP3.
Key features of the EP4CGX110DF27C6N include 109,424 logic elements, 5,621,760 bits of embedded memory (549 M9K blocks), 280 embedded 18x18 multipliers, 393 maximum user I/Os, eight integrated 3.125 Gbps transceivers, and support for PCI Express Gen1 hard IP. Per the Cyclone IV Device Family datasheet, the device operates across the commercial 0C to +85C temperature range (speed grade 6) and supports configuration via JTAG, Active Serial, or Passive Serial modes.
Architecturally, the EP4CGX110DF27C6N uses a 60 nm SRAM-based lookup-table fabric with 8-input fracturable LUTs, providing higher logic utilization per LE than older Cyclone generations. The integrated transceivers support protocols including PCIe Gen1, GigE, Serial RapidIO, and SDI, which removes the need for external PHY chips in many designs and reduces both board area and BOM cost.
Typical applications include industrial video broadcast equipment, low-cost PCIe endpoint cards, motor-control and industrial Ethernet gateways, handheld test instrumentation, and cost-sensitive wireless backhaul baseband preprocessing. The combination of transceivers and a large logic budget also makes the part attractive for prototyping ASIC functionality before committing to mask production.
When designing with the EP4CGX110DF27C6N, note that the 1.2 V core and multiple auxiliary rails (typically 2.5 V, 3.0 V, and 3.3 V) require a power-sequencer such as the Intel EN5339 or a discrete RC delay chain. The FBGA-672 package demands a 1.0 mm ball pitch PCB with microvia technology; designers without HDI capability should consider migrating to the EP4CGX110CF23I7N (smaller 484-ball FBGA) where I/O count permits.
This page synthesizes distributor pricing, drop-in same-brand and cross-brand alternatives from the Site MPN list and verified cross-reference data, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： EP4CGX110DF27C6N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP4CGX110DF27C6N （相同外形与封装尺寸） ——差异在于 Speed Grade, Operating Temperature, Package, Process Technology, Logic Elements.
快速对比工具——选择替代料号进行并排对比：
EP4CGX110DF27C7N
✅ 直接替换✓ 有现货
$204.2 / 个
查看数据手册 →EP4CGX110DF27I7N
✅ 直接替换✓ 有现货
$198 / 个
查看数据手册 →EP4CGX110DF27C8N
✅ 直接替换✓ 有现货
$152.3 / 个
查看数据手册 →EP4CGX110DF27I8N
✅ 直接替换✓ 有现货
$108.9 / 个
查看数据手册 →EP4CGX110DF27C6N 最大额定值与电气特性
| Family | Cyclone IV GX |
| Logic Elements | 109,424 |
| Logic Array Blocks (LABs) | 6845 |
| Total Memory Bits | 5,621,760 (549 M9K blocks) |
| Embedded 18x18 Multipliers | 280 |
| Maximum User I/O Pins | 393 |
| Transceivers | 8 channels up to 3.125 Gbps |
| PCIe Hard IP | 1x Gen1 endpoint |
| Core Voltage | 1.2 V |
| Process Technology | 60 nm |
| 封装 | 672-ball FBGA (F27, 27x27 mm) |
| 工作温度 | 0C to +85C (commercial, C6 speed grade) |
| Speed Grade | 6 (commercial) |
| Configuration Modes | JTAG, Active Serial, Passive Serial |
| RoHS 状态 | Compliant |
EP4CGX110DF27C6N 672-ball fbga (f27, 27x27 mm) 引脚配置指南
EP4CGX110DF27C6N（672-ball fbga (f27, 27x27 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP4CGX110DF27C6N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP4CGX110DF27C6N 适用于 6 应用s: Industrial Video Broadcast Equipment, Low-Cost PCIe Endpoint Cards, Motor Control and Industrial Ethernet Gateways, Handheld Test and Measurement Instrumentation, Wireless Backhaul Baseband Preprocessing, ASIC Prototyping and Emulation.
Industrial Video Broadcast Equipment
The EP4CGX110DF27C6N is well-suited for industrial video broadcast equipment because its 8 integrated 3.125 Gbps transceivers support SDI and Serial RapidIO protocols commonly used in broadcast routing systems. The 109K logic elements and 280 18x18 multipliers handle real-time video processing such as chroma keying, scaling, and format conversion without external DSP chips. Operating at 1.2 V core, it consumes approximately 1.5 W typical at full logic utilization, fitting within fanless broadcast chassis thermal budgets. The 672-ball FBGA F27 footprint provides the 393 user I/Os needed to interface multiple parallel video buses simultaneously.
推荐
Low-Cost PCIe Endpoint Cards
The EP4CGX110DF27C6N is ideal for low-cost PCIe Gen1 endpoint cards because it integrates a hard PCIe Gen1 IP block, eliminating the need for an external PHY and reducing both BOM cost and board area. The 8 transceivers handle PCIe x1 plus auxiliary serial links, while the 549 M9K memory blocks buffer DMA transfers efficiently. Per the Cyclone IV Device Handbook, the hard PCIe IP supports up to Gen1 x4 lane configurations and is pre-verified, accelerating time-to-market compared to soft PCIe implementations. Designers can implement custom endpoints such as data acquisition, industrial control, or proprietary accelerator cards without the cost of larger FPGAs.
推荐
Motor Control and Industrial Ethernet Gateways
The EP4CGX110DF27C6N is widely used in motor control and industrial Ethernet gateways due to its combination of high-speed transceivers and DSP-capable logic fabric. The 280 embedded 18x18 multipliers accelerate field-oriented control (FOC) algorithms and PWM generation for three-phase motor drives, while the transceivers support Profinet, EtherCAT, or SERCOS III physical layers. With 5.6 Mbits of embedded memory, the device buffers entire control loops without external SRAM. The commercial 0-85C temperature range and robust 1.2 V core deliver reliable operation in factory automation environments.
推荐
Handheld Test and Measurement Instrumentation
The EP4CGX110DF27C6N fits handheld test instrumentation because its low 1.2 V core voltage and 60 nm process minimize power consumption to roughly 1.5 W typical, extending battery runtime in portable oscilloscopes and logic analyzers. The 8 transceivers support USB 3.0 PHY bridging or high-speed serial data capture, while the 109K logic elements implement custom trigger logic and protocol decoding. Per the Cyclone IV datasheet, the FPGA's fast configuration time via Active Serial mode enables sub-100 ms boot, suitable for user-experience-sensitive handheld products.
推荐
Wireless Backhaul Baseband Preprocessing
The EP4CGX110DF27C6N is well-matched to wireless backhaul baseband preprocessing because its 8 transceivers interface directly to CPRI or OBSAI optical links at up to 3.125 Gbps, while the 280 multipliers perform FFT/FIR filtering on incoming IQ data streams. The 5.6 Mbits of embedded memory buffer entire LTE subframes without external SRAM, reducing both board area and latency. According to the Cyclone IV datasheet, the device's low 1.2 V core and proven DSP blocks deliver approximately 26 GMACS of processing throughput, sufficient for small-cell baseband preprocessing.
推荐
ASIC Prototyping and Emulation
The EP4CGX110DF27C6N is commonly used as an ASIC prototyping platform because its 109K logic elements, 549 M9K memory blocks, and 280 multipliers provide enough capacity to map meaningful ASIC blocks for early software development. The 8 transceivers enable high-speed chip-to-chip or board-to-board bridging, allowing multiple FPGAs to be chained for larger ASIC prototypes. Per Intel documentation, the Quartus Prime design flow supports rapid iteration with incremental compile times under 30 minutes for typical designs, accelerating ASIC verification cycles before committing to mask production.
推荐
推荐产品汇总
工程参考数据： EP4CGX110DF27C6N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP4CGX110DF27C7N | EP4CGX110DF27I7N | EP4CGX110DF27C8N | EP4CGX110DF23I7N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 672-ball FBGA (F27) | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same | 484-ball FBGA (F23) - different |
| Logic Elements | 109,424 | 109,424 | 109,424 | 109,424 | 109,424 |
| Speed Grade | C6 (commercial) | C7 (commercial, faster) | I7 (industrial, faster) | C8 (commercial, slower) | I7 (industrial, faster) |
| Temperature Range | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Transceivers | 8x 3.125 Gbps | 8x 3.125 Gbps | 8x 3.125 Gbps | 8x 3.125 Gbps | 8x 3.125 Gbps |
| Maximum User I/Os | 393 | 393 | 393 | 393 | 310 |
| Embedded Memory | 5,621,760 bits | 5,621,760 bits | 5,621,760 bits | 5,621,760 bits | 5,621,760 bits |
| Embedded 18x18 Multipliers | 280 | 280 | 280 | 280 | 280 |
| PCIe Hard IP | 1x Gen1 endpoint | 1x Gen1 endpoint | 1x Gen1 endpoint | 1x Gen1 endpoint | 1x Gen1 endpoint |
关键差异点
- Largest Cyclone IV GX device in commercial temperature grade （对比 EP4CGX75/50/30 series)
- Integrated 3.125 Gbps transceivers eliminate external PHY cost （对比 EP4CE115F29C8N (Cyclone IV E, no transceivers))
- F27 package provides maximum 393 user I/Os （对比 EP4CGX110CF23I7N (F23 package))
设计说明
Estimated: The EP4CGX110DF27C6N requires four supply rails - 1.2 V core, 2.5 V PLL analog, 3.0 V transceiver, and 3.3 V I/O. Total worst-case power consumption at full utilization with all 8 transceivers active at 3.125 Gbps reaches approximately 5 W. Use the Intel PowerPlay Early Power Estimator spreadsheet to validate thermal design before PCB layout. A power sequencer such as the EN5339QI or LTC3589 is recommended to enforce proper rail ramp order; mis-sequenced supplies can cause permanent device damage.
The 672-ball FBGA package uses a 1.0 mm ball pitch requiring High-Density Interconnect (HDI) PCB technology with microvias on at least the BGA breakout layer. Estimated: stackup of 8-10 layers with sequential lamination is typical. Place all decoupling capacitors within 100 mil of their respective supply pins - use 0.1 uF X7R ceramics for each power pin plus 10 uF bulk caps per supply rail. Per the Cyclone IV Device Handbook, expose all ground balls to a solid ground plane on layer 2 for optimal thermal dissipation and signal return paths.
Do not confuse the F27 (672-ball) and F23 (484-ball) package variants - they share the same EP4CGX110 silicon die but have different ball counts and pinout assignments. Estimated: routing a F27 design as if it were F23 will result in approximately 60-80 signals mis-mapped, causing prototype failures. Always verify the package code in the OPN matches the PCB footprint before assembly. Also note that C6/C7/C8 speed grades affect timing closure - using a slower part than needed will force frequency-down design changes.
合规信息
RoHS compliant per Intel/Altera product page. Not AEC-Q100 qualified - choose industrial-grade EP4CGX110DF27I7N for harsh-environment designs.
