EP4CGX110DF27C6N - 109K LE Cyclone IV GX FPGA, 672-FBGA | Intel
Teilenummer: EP4CGX110DF27C6N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $165 | $165,00 |
| 10 | $152 | $1.520,00 |
| 100 | $138.5 | $13.850,00 |
| 250 | $128.75 | $32.187,50 |
| 500 | $119.9 | $59.950,00 |
EP4CGX110DF27C6N Übersicht
What is a Cyclone IV GX FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O that can be re-programmed to implement arbitrary digital logic. The Cyclone IV GX variant extends the base Cyclone IV E family by adding high-speed serial transceivers, placing it in the low-power, low-cost FPGA tier alongside Spartan-6 from Xilinx and LatticeECP3.
Key features of the EP4CGX110DF27C6N include 109,424 logic elements, 5,621,760 bits of embedded memory (549 M9K blocks), 280 embedded 18x18 multipliers, 393 maximum user I/Os, eight integrated 3.125 Gbps transceivers, and support for PCI Express Gen1 hard IP. Per the Cyclone IV Device Family datasheet, the device operates across the commercial 0C to +85C temperature range (speed grade 6) and supports configuration via JTAG, Active Serial, or Passive Serial modes.
Architecturally, the EP4CGX110DF27C6N uses a 60 nm SRAM-based lookup-table fabric with 8-input fracturable LUTs, providing higher logic utilization per LE than older Cyclone generations. The integrated transceivers support protocols including PCIe Gen1, GigE, Serial RapidIO, and SDI, which removes the need for external PHY chips in many designs and reduces both board area and BOM cost.
Typical applications include industrial video broadcast equipment, low-cost PCIe endpoint cards, motor-control and industrial Ethernet gateways, handheld test instrumentation, and cost-sensitive wireless backhaul baseband preprocessing. The combination of transceivers and a large logic budget also makes the part attractive for prototyping ASIC functionality before committing to mask production.
When designing with the EP4CGX110DF27C6N, note that the 1.2 V core and multiple auxiliary rails (typically 2.5 V, 3.0 V, and 3.3 V) require a power-sequencer such as the Intel EN5339 or a discrete RC delay chain. The FBGA-672 package demands a 1.0 mm ball pitch PCB with microvia technology; designers without HDI capability should consider migrating to the EP4CGX110CF23I7N (smaller 484-ball FBGA) where I/O count permits.
This page synthesizes distributor pricing, drop-in same-brand and cross-brand alternatives from the Site MPN list and verified cross-reference data, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für EP4CGX110DF27C6N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP4CGX110DF27C6N (gleiche Bauform und Footprint) – abweichend in Speed Grade, Operating Temperature, Package, Process Technology, Logic Elements.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP4CGX110DF27C7N
✅ Drop-In✓ Auf Lager
$204.2 / Stück
Datenblatt ansehen →EP4CGX110DF27I7N
✅ Drop-In✓ Auf Lager
$198 / Stück
Datenblatt ansehen →EP4CGX110DF27C8N
✅ Drop-In✓ Auf Lager
$152.3 / Stück
Datenblatt ansehen →EP4CGX110DF27I8N
✅ Drop-In✓ Auf Lager
$108.9 / Stück
Datenblatt ansehen →EP4CGX110DF27C6N Grenzwerte & elektrische Eigenschaften
| Family | Cyclone IV GX |
| Logic Elements | 109,424 |
| Logic Array Blocks (LABs) | 6845 |
| Total Memory Bits | 5,621,760 (549 M9K blocks) |
| Embedded 18x18 Multipliers | 280 |
| Maximum User I/O Pins | 393 |
| Transceivers | 8 channels up to 3.125 Gbps |
| PCIe Hard IP | 1x Gen1 endpoint |
| Core Voltage | 1.2 V |
| Process Technology | 60 nm |
| Gehäuse | 672-ball FBGA (F27, 27x27 mm) |
| Betriebstemperatur | 0C to +85C (commercial, C6 speed grade) |
| Speed Grade | 6 (commercial) |
| Configuration Modes | JTAG, Active Serial, Passive Serial |
| RoHS-Status | Compliant |
EP4CGX110DF27C6N 672-ball fbga (f27, 27x27 mm) Pinbelegungsleitfaden
Pinbelegung für EP4CGX110DF27C6N (672-ball fbga (f27, 27x27 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP4CGX110DF27C6N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP4CGX110DF27C6N ist geeignet für 6 Anwendungs: Industrial Video Broadcast Equipment, Low-Cost PCIe Endpoint Cards, Motor Control and Industrial Ethernet Gateways, Handheld Test and Measurement Instrumentation, Wireless Backhaul Baseband Preprocessing, ASIC Prototyping and Emulation.
Industrial Video Broadcast Equipment
The EP4CGX110DF27C6N is well-suited for industrial video broadcast equipment because its 8 integrated 3.125 Gbps transceivers support SDI and Serial RapidIO protocols commonly used in broadcast routing systems. The 109K logic elements and 280 18x18 multipliers handle real-time video processing such as chroma keying, scaling, and format conversion without external DSP chips. Operating at 1.2 V core, it consumes approximately 1.5 W typical at full logic utilization, fitting within fanless broadcast chassis thermal budgets. The 672-ball FBGA F27 footprint provides the 393 user I/Os needed to interface multiple parallel video buses simultaneously.
Empfohlen
Low-Cost PCIe Endpoint Cards
The EP4CGX110DF27C6N is ideal for low-cost PCIe Gen1 endpoint cards because it integrates a hard PCIe Gen1 IP block, eliminating the need for an external PHY and reducing both BOM cost and board area. The 8 transceivers handle PCIe x1 plus auxiliary serial links, while the 549 M9K memory blocks buffer DMA transfers efficiently. Per the Cyclone IV Device Handbook, the hard PCIe IP supports up to Gen1 x4 lane configurations and is pre-verified, accelerating time-to-market compared to soft PCIe implementations. Designers can implement custom endpoints such as data acquisition, industrial control, or proprietary accelerator cards without the cost of larger FPGAs.
Empfohlen
Motor Control and Industrial Ethernet Gateways
The EP4CGX110DF27C6N is widely used in motor control and industrial Ethernet gateways due to its combination of high-speed transceivers and DSP-capable logic fabric. The 280 embedded 18x18 multipliers accelerate field-oriented control (FOC) algorithms and PWM generation for three-phase motor drives, while the transceivers support Profinet, EtherCAT, or SERCOS III physical layers. With 5.6 Mbits of embedded memory, the device buffers entire control loops without external SRAM. The commercial 0-85C temperature range and robust 1.2 V core deliver reliable operation in factory automation environments.
Empfohlen
Handheld Test and Measurement Instrumentation
The EP4CGX110DF27C6N fits handheld test instrumentation because its low 1.2 V core voltage and 60 nm process minimize power consumption to roughly 1.5 W typical, extending battery runtime in portable oscilloscopes and logic analyzers. The 8 transceivers support USB 3.0 PHY bridging or high-speed serial data capture, while the 109K logic elements implement custom trigger logic and protocol decoding. Per the Cyclone IV datasheet, the FPGA's fast configuration time via Active Serial mode enables sub-100 ms boot, suitable for user-experience-sensitive handheld products.
Empfohlen
Wireless Backhaul Baseband Preprocessing
The EP4CGX110DF27C6N is well-matched to wireless backhaul baseband preprocessing because its 8 transceivers interface directly to CPRI or OBSAI optical links at up to 3.125 Gbps, while the 280 multipliers perform FFT/FIR filtering on incoming IQ data streams. The 5.6 Mbits of embedded memory buffer entire LTE subframes without external SRAM, reducing both board area and latency. According to the Cyclone IV datasheet, the device's low 1.2 V core and proven DSP blocks deliver approximately 26 GMACS of processing throughput, sufficient for small-cell baseband preprocessing.
Empfohlen
ASIC Prototyping and Emulation
The EP4CGX110DF27C6N is commonly used as an ASIC prototyping platform because its 109K logic elements, 549 M9K memory blocks, and 280 multipliers provide enough capacity to map meaningful ASIC blocks for early software development. The 8 transceivers enable high-speed chip-to-chip or board-to-board bridging, allowing multiple FPGAs to be chained for larger ASIC prototypes. Per Intel documentation, the Quartus Prime design flow supports rapid iteration with incremental compile times under 30 minutes for typical designs, accelerating ASIC verification cycles before committing to mask production.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP4CGX110DF27C6N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP4CGX110DF27C7N | EP4CGX110DF27I7N | EP4CGX110DF27C8N | EP4CGX110DF23I7N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 672-ball FBGA (F27) | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same | 484-ball FBGA (F23) - different |
| Logic Elements | 109,424 | 109,424 | 109,424 | 109,424 | 109,424 |
| Speed Grade | C6 (commercial) | C7 (commercial, faster) | I7 (industrial, faster) | C8 (commercial, slower) | I7 (industrial, faster) |
| Temperature Range | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Transceivers | 8x 3.125 Gbps | 8x 3.125 Gbps | 8x 3.125 Gbps | 8x 3.125 Gbps | 8x 3.125 Gbps |
| Maximum User I/Os | 393 | 393 | 393 | 393 | 310 |
| Embedded Memory | 5,621,760 bits | 5,621,760 bits | 5,621,760 bits | 5,621,760 bits | 5,621,760 bits |
| Embedded 18x18 Multipliers | 280 | 280 | 280 | 280 | 280 |
| PCIe Hard IP | 1x Gen1 endpoint | 1x Gen1 endpoint | 1x Gen1 endpoint | 1x Gen1 endpoint | 1x Gen1 endpoint |
Wichtigste Unterscheidungsmerkmale
- Largest Cyclone IV GX device in commercial temperature grade (vs. EP4CGX75/50/30 series)
- Integrated 3.125 Gbps transceivers eliminate external PHY cost (vs. EP4CE115F29C8N (Cyclone IV E, no transceivers))
- F27 package provides maximum 393 user I/Os (vs. EP4CGX110CF23I7N (F23 package))
Designhinweise
Estimated: The EP4CGX110DF27C6N requires four supply rails - 1.2 V core, 2.5 V PLL analog, 3.0 V transceiver, and 3.3 V I/O. Total worst-case power consumption at full utilization with all 8 transceivers active at 3.125 Gbps reaches approximately 5 W. Use the Intel PowerPlay Early Power Estimator spreadsheet to validate thermal design before PCB layout. A power sequencer such as the EN5339QI or LTC3589 is recommended to enforce proper rail ramp order; mis-sequenced supplies can cause permanent device damage.
The 672-ball FBGA package uses a 1.0 mm ball pitch requiring High-Density Interconnect (HDI) PCB technology with microvias on at least the BGA breakout layer. Estimated: stackup of 8-10 layers with sequential lamination is typical. Place all decoupling capacitors within 100 mil of their respective supply pins - use 0.1 uF X7R ceramics for each power pin plus 10 uF bulk caps per supply rail. Per the Cyclone IV Device Handbook, expose all ground balls to a solid ground plane on layer 2 for optimal thermal dissipation and signal return paths.
Do not confuse the F27 (672-ball) and F23 (484-ball) package variants - they share the same EP4CGX110 silicon die but have different ball counts and pinout assignments. Estimated: routing a F27 design as if it were F23 will result in approximately 60-80 signals mis-mapped, causing prototype failures. Always verify the package code in the OPN matches the PCB footprint before assembly. Also note that C6/C7/C8 speed grades affect timing closure - using a slower part than needed will force frequency-down design changes.
Compliance-Informationen
RoHS compliant per Intel/Altera product page. Not AEC-Q100 qualified - choose industrial-grade EP4CGX110DF27I7N for harsh-environment designs.
