EP3SL70F780C3G - Stratix III L FPGA, 67.5K LE, 488 I/O | Intel
料号： EP3SL70F780C3G ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $262.5 | $2,625.00 |
| 100 | $235 | $23,500.00 |
| 500 | $210 | $105,000.00 |
| 1,000 | $185 | $185,000.00 |
EP3SL70F780C3G 概述
A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon features such as block RAM, DSP slices, and high-speed transceivers. Stratix III L FPGAs extend the Stratix III architecture into lower-static-power variants, placing them in the taxonomy of programmable logic -> FPGA -> high-performance FPGA -> low-power Stratix series. The 'L' (low-power) variants reduce static power consumption by approximately 50% versus standard Stratix III devices while maintaining comparable performance.
Key features include 67,500 logic elements, 2,699,264 embedded memory bits organized into M9K and M144K blocks, 384 (18x18) multipliers for DSP operations, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device also integrates up to 4 PLL blocks and 12 global clock networks for advanced clock management.
The Stratix III L architecture employs adaptive logic modules (ALMs) with 8-input fracturable look-up tables (LUTs), allowing efficient mapping of combinational and registered logic. The 40nm process enables high core frequencies while the low-power variant reduces leakage, making EP3SL70F780C3G suitable for both performance-critical and power-constrained designs.
Typical applications include high-performance digital signal processing, telecommunications infrastructure, broadcast video processing, high-speed serial protocol bridging, and ASIC prototyping. The 488 user I/Os support board-level integration with external memory, high-speed data converters, and backplane interfaces.
When designing with the EP3SL70F780C3G, ensure proper power supply sequencing (2.5V VCCBAT, 0.9V VCC, 1.1V VCCPT) and adequate thermal management via PCB thermal vias beneath the FBGA. Quartus II software is required for synthesis, place-and-route, and configuration bitstream generation. Use JTAG or active serial configuration for in-system programming.
This page synthesizes distributor pricing, FPGA family drop-in alternatives, and Stratix III L design notes not found in the manufacturer datasheet alone.
直接替换替代料： EP3SL70F780C3G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3SL70F780C3G （相同外形与封装尺寸） ——差异在于 Speed Grade, Package, Mounting Type, Family, Process Technology.
快速对比工具——选择替代料号进行并排对比：
EP3SL70F780C3
✅ 直接替换✓ 有现货
$780 / 个
查看数据手册 →EP3SL70F780C2G
✅ 直接替换✓ 有现货
$1185 / 个
查看数据手册 →EP3SL70F780C4G
✅ 直接替换✓ 有现货
$835 / 个
查看数据手册 →EP3SL50F780C3G
✅ 直接替换✓ 有现货
$625 / 个
查看数据手册 →EP3SE50F780C3G
✅ 直接替换✓ 有现货
$1030 / 个
查看数据手册 →EP3SL70F780C3G 最大额定值与电气特性
| Family | Stratix® III L |
| Series | EP3SL70 |
| Logic Elements | 67,500 |
| Embedded Memory | 2,699,264 bits |
| Number of I/O | 488 |
| 封装 | 780-BBGA, FCBGA (29x29 mm) |
| Speed Grade | -3 |
| Temperature Grade | Commercial (0C to +85C) |
| Process Technology | 40 nm |
| Voltage - Supply | 0.9 V, 1.1 V, 2.5 V |
| 安装类型 | Surface Mount |
| MSL 等级 | 3 (168 hours) |
| RoHS 状态 | Compliant |
| Lead-Free | Yes |
| DSP Multipliers (18x18) | 384 |
| PLL Count | 4 |
| Global Clock Networks | 12 |
| Configuration Method | JTAG, Active Serial, Passive Serial |
EP3SL70F780C3G 780-bbga, fcbga (29x29 mm) 引脚配置指南
EP3SL70F780C3G（780-bbga, fcbga (29x29 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3SL70F780C3G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3SL70F780C3G 适用于 6 应用s: Telecommunications Infrastructure, High-Performance DSP Signal Processing, Broadcast Video Processing, ASIC Prototyping, Industrial Control and Automation, Test and Measurement Instrumentation.
Telecommunications Infrastructure
The EP3SL70F780C3G fits telecom infrastructure applications requiring high logic density and multiple high-speed serial interfaces. The 67,500 logic elements and 488 user I/Os enable packet processing, framing, and protocol bridging functions in baseband and backhaul equipment. Its 384 (18x18) DSP multipliers support channelization and modulation/demodulation for multi-carrier systems. The Stratix III L low-power architecture reduces thermal load in sealed outdoor enclosures, while the 780-ball FCBGA package supports dense board layouts required by line cards and ATCA blades. Designers typically pair the FPGA with external DDR3 memory and SFP+ transceiver modules for 10G Ethernet or CPRI links, leveraging the device's LVDS I/O capability for chip-to-chip interconnect.
推荐
High-Performance DSP Signal Processing
The EP3SL70F780C3G suits high-performance DSP applications with its 384 embedded (18x18) multipliers delivering up to ~200 GMACs throughput. Engineers deploy this FPGA in radar signal processing, software-defined radio baseband, and medical imaging systems where parallel multiply-accumulate operations must execute at line rate. The 2,699,264 bits of embedded memory (organized as M9K + M144K blocks) provide local data buffering to sustain DSP pipeline throughput without external memory stalls. Its -3 speed grade supports moderate clock rates up to ~300 MHz on DSP paths, while the Stratix III L architecture reduces dynamic power versus standard Stratix III. Typical designs include FFT engines, FIR filter banks, and beamforming matrices that benefit from the device's parallel processing fabric.
推荐
Broadcast Video Processing
The EP3SL70F780C3G addresses broadcast video processing workloads requiring high pixel-rate throughput and real-time format conversion. Its 488 user I/Os accommodate multiple video ports for SDI, HDMI, or DisplayPort interfacing, while the 67,500 logic elements support color-space conversion, scaling, and deinterlacing in real time. Designers integrate the FPGA in production switchers, video walls, and contribution encoders. The Stratix III L device supports DDR2/DDR3 external memory interfaces for frame buffering at 1080p60 and 4K resolutions. Quartus II Video IP cores provide ready-to-use building blocks for SMPTE 424M/425M SDI and HEVC encoding assist functions.
推荐
ASIC Prototyping
The EP3SL70F780C3G serves as an ASIC prototyping platform where engineers validate RTL designs before committing to mask costs. The 67,500 logic elements, 2.7 Mbits of embedded memory, and 488 I/Os allow partitioning and verification of mid-complexity ASIC subsystems. Designers map ASIC blocks into FPGA logic while utilizing the device's memory and DSP resources as functional equivalents. The 780-ball FCBGA package with 1.0 mm pitch supports high-speed signal access for logic analyzers and oscilloscope probes during bring-up. Quartus II design partitioning and incremental compilation flows shorten iteration cycles, making this device a productive vehicle for pre-silicon verification.
推荐
Industrial Control and Automation
The EP3SL70F780C3G supports industrial control applications requiring deterministic real-time response and multiple communication interfaces. Its 488 user I/Os connect to industrial sensors, motor encoders, and actuator drivers via LVTTL, LVCMOS, or RS-485 transceivers. The 67,500 logic elements implement PID controllers, state machines, and EtherCAT/CAN protocol stacks. The Stratix III L low-power design reduces cooling requirements in sealed control cabinets, while the -3 speed grade provides sufficient timing margin for closed-loop control loops running at kHz-MHz rates. Designers deploy this FPGA in PLCs, motion controllers, and SCADA systems where programmable logic flexibility accelerates customization.
推荐
Test and Measurement Instrumentation
The EP3SL70F780C3G fits test and measurement instruments requiring high-speed data acquisition and real-time signal analysis. Its 488 user I/Os interface with high-speed ADCs and DACs for arbitrary waveform generators, oscilloscopes, and protocol analyzers. The 384 DSP multipliers accelerate FFT computation for spectrum analysis, while the 2.7 Mbits of embedded memory buffer acquisition samples. The Stratix III L low-power variant reduces heat dissipation in fan-cooled benchtop instruments. Quartus II DSP Builder and Simulink integration accelerate model-based design for filter and modulation analysis algorithms used in vector signal analyzers and bit-error-rate testers.
推荐
推荐产品汇总
工程参考数据： EP3SL70F780C3G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3SL70F780C3 | EP3SL70F780C2G | EP3SL70F780C4G | EP3SL50F780C3G | EP3SE50F780C3G |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (29x29 mm) | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Family | Stratix III L (Low Power) | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III E (Enhanced) |
| Logic Elements | 67,500 | 67,500 (same) | 67,500 (same) | 67,500 (same) | 49,500 (-26.7%) | 49,500 (-26.7%) |
| Embedded Memory | 2,699,264 bits | 2,699,264 bits (same) | 2,699,264 bits (same) | 2,699,264 bits (same) | 2,293,760 bits (-15%) | 4,153,344 bits (+54%) |
| Speed Grade | -3 | -3 (same) | -2 (slower) | -4 (faster) | -3 (same) | -3 (same) |
| Number of I/O | 488 | 488 (same) | 488 (same) | 488 (same) | 488 (same) | 488 (same) |
| Static Power | Low Power (L variant) | Low Power (same) | Low Power (same) | Low Power (same) | Low Power (same) | Standard (higher) |
关键差异点
- Drop-in compatible with other Stratix III L 780-FBGA variants （对比 EP3SL70F780C2G)
- Higher logic density than EP3SL50F780C3G in same package （对比 EP3SL50F780C3G)
- Low-power L variant vs standard E variant （对比 EP3SE50F780C3G)
设计说明
The EP3SL70F780C3G requires three independent supply rails: VCCINT (0.9V core), VCCPT (1.1V analog/PLL), and VCCBAT (2.5V battery backup for configuration RAM). According to Intel Stratix III power guidelines, VCCINT sequencing should follow a controlled ramp to prevent latch-up. Use TI or Maxim power management ICs designed for Stratix III power (e.g., TI UCD9222 + UCD7242 digital controllers). Decoupling requires at least 24 low-ESL ceramic capacitors (0402 or 0201) placed adjacent to the FBGA balls with short, wide PCB traces to minimize inductance.
Estimated: With 67,500 LE at typical utilization (50%) and -3 speed grade, the EP3SL70F780C3G dissipates approximately 3-5W under dynamic load. The 780-ball FCBGA package has a theta_JA of approximately 12-15 C/W with a properly designed thermal via array (at least 36 vias in a 6x6 grid beneath the package center, connected to internal ground planes). Without thermal vias, junction temperatures can exceed 100C in still air. Use Intel's Stratix III Thermal Modeling Tool to validate thermal design before layout freeze.
Route all Stratix III I/O signals with controlled impedance (50 ohm single-ended, 100 ohm differential for LVDS). Maintain 1.0 mm ball pitch routing with 0.10 mm trace/space design rules; use microvia stackups (4-6-4 or higher layer counts) for BGA breakout. Match clock-pair lengths within 0.5 mm to preserve LVDS setup/hold margins. Route global clock networks with 50 ohm controlled impedance and avoid routing signals under the FBGA package shadow. Decoupling capacitors must be placed on the opposite PCB side immediately beneath the package balls with vias directly to internal ground planes.
Common mistakes: (1) Exceeding VCCIO bank voltage limits (verify each I/O bank's VCCIO matches the standard being used); (2) Missing VCCPD (I/O pre-driver) supply for configuration pins; (3) Inadequate MSOP-level board assembly profile causing BGA solder joint defects - follow JEDEC J-STD-020 MSL3 handling procedures; (4) Forgetting nCONFIG and nSTATUS pull-up resistors required by passive serial configuration mode; (5) Using non-Intel EPCS configuration devices without validating compatibility. Always verify configuration interface connections against the Stratix III pin connection guidelines document.
合规信息
RoHS compliant per Intel/Altera product page. Lead-free (Pb-free) package marked by 'G' suffix in part number. AEC-Q100 not applicable - this is a commercial-grade FPGA. For industrial temperature grade, use 'I' suffix variants such as EP3SL70F780I3G.