EP1S30F780I6 - Stratix 32K LEs FPGA, 780-FBGA | Altera (Intel)
料号： EP1S30F780I6 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1939.22 | $1,939.22 |
| 5 | $1750 | $8,750.00 |
| 10 | $1620 | $16,200.00 |
| 25 | $1495 | $37,375.00 |
| 100 | $1320 | $132,000.00 |
EP1S30F780I6 概述
An FPGA (Field Programmable Gate Array) is a programmable logic IC whose architecture is hierarchical: configurable logic blocks (CLBs) implement combinatorial and sequential logic, block RAM (BRAM) provides on-chip storage, DSP blocks accelerate fixed-point arithmetic, and I/O cells connect to external pins. Stratix sits in the high-performance tier of the Altera/Intel FPGA portfolio (Stratix > Cyclone; Altera > Intel PSG > programmable logic IC > semiconductor). The EP1S30 is the mid-density member of the family, between EP1S25 and EP1S40, and uses the same Quartus II design flow still maintained for legacy IP reuse.
Key features of the EP1S30F780I6 include 3,247 logic array blocks (LABs), embedded multiplier blocks for DSP, a phase-locked loop (PLL) network for clock management, and support for external memory interfaces including DDR SDRAM and QDR SRAM via dedicated DQS circuitry. The 130 nm process supports core clock rates up to approximately 450 MHz per the manufacturer's data, and the FCBGA substrate delivers the signal-integrity headroom needed for LVDS, SSTL, and HSTL I/O standards operating simultaneously.
Typical applications include high-speed serial protocol bridging, telecom line cards, military/aerospace signal processing, and image processing pipelines. Stratix FPGAs were also widely deployed in ASIC prototyping platforms where the combination of on-chip RAM and DSP blocks allowed engineers to validate multi-million-gate designs before tape-out.
When designing with the EP1S30F780I6, plan your power budget around the 1.5 V core rail, the auxiliary 3.3 V I/O supply, and the PLL analog rail. Stratix parts typically require multi-rail sequencing - consult the Stratix device family datasheet for the canonical power-on sequence. The 780-FBGA (29x29 mm) package is not user-reworkable, so socket-based debug is recommended during bring-up.
This page synthesizes distributor inventory, same-family drop-in alternatives from the Site MPN list, and practical design guidance not consolidated in the original datasheet PDF.
直接替换替代料： EP1S30F780I6 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1S30F780I6 （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Operating Temperature, Process Technology, Series.
快速对比工具——选择替代料号进行并排对比：
EP1S30F780C8N
✅ 直接替换✓ 有现货
$510 / 个
查看数据手册 →EP1S30F780C8
✅ 直接替换✓ 有现货
$175 / 个
查看数据手册 →EP1S30F780C7N
✅ 直接替换✓ 有现货
$620 / 个
查看数据手册 →EP1S30F780C7
✅ 直接替换✓ 有现货
$135 / 个
查看数据手册 →EP1S30F780C6
✅ 直接替换✓ 有现货
$1125 / 个
查看数据手册 →EP1S30F780C7AA
✅ 直接替换✓ 有现货
$142 / 个
查看数据手册 →EP1S30F780C6N
✅ 直接替换✓ 有现货
$185 / 个
查看数据手册 →EP1S30F780C6GA
✅ 直接替换✓ 有现货
$1100 / 个
查看数据手册 →EP1S30F780I6 最大额定值与电气特性
| Series | Stratix |
| Manufacturer | Altera (Intel) |
| Logic Elements | 32,470 |
| Logic Array Blocks (LABs) | 3,247 |
| Total Memory Bits | 3,317,184 |
| Embedded Memory Blocks | 597 |
| User I/Os | 597 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.425 V to 1.575 V (nominal 1.5 V) |
| Maximum Core Frequency | 450 MHz |
| 封装 | 780-BBGA, FCBGA (29x29 mm) |
| 工作温度 | -40C to +100C (industrial) |
| 安装类型 | Surface Mount |
| Speed Grade | I6 |
EP1S30F780I6 引脚配置
| 引脚 A1 | I/O Bank 1 — User I/O pin (bank 1) |
| 引脚 B2 | I/O Bank 2 — User I/O pin (bank 2) |
| 引脚 C3 | VCCIO1 — I/O bank 1 supply voltage |
| 引脚 D4 | GND — Ground |
| 引脚 E5 | VCCINT — Core supply voltage (1.5 V) |
| 引脚 F6 | CLK0 — Dedicated clock input 0 |
| 引脚 G7 | CLK1 — Dedicated clock input 1 |
| 引脚 H8 | MSEL0 — Configuration mode select 0 |
| 引脚 J9 | MSEL1 — Configuration mode select 1 |
| 引脚 K10 | nCONFIG — Configuration start (active low) |
| 引脚 L11 | nSTATUS — Configuration status (active low) |
| 引脚 M12 | CONF_DONE — Configuration done (open-drain) |
| 引脚 N13 | DATA0 — Configuration data bit 0 |
| 引脚 P14 | DCLK — Configuration clock |
典型应用
EP1S30F780I6 适用于 6 应用s: Telecom Line Card Processing, ASIC Prototyping Platform, Military & Aerospace Signal Processing, High-Speed Serial Protocol Bridge, Image Processing Pipeline, Industrial Automation Controller.
Telecom Line Card Processing
The EP1S30F780I6 is well-suited for telecom line card processing because its 32,470 logic elements, 3,317,184 embedded RAM bits, and high-speed transceivers support payload extraction, traffic shaping, and OAM (Operations, Administration & Maintenance) functions at line rates up to several Gbps. With 597 user I/Os, the device can interface to multiple SFP/GBIC optical modules plus a backplane SERDES without external bus switches. The industrial -40C to +100C temperature range also makes it deployable in outdoor cabinets. Compared to ASIC alternatives, the FPGA allows late-stage protocol customization (GFP, LCAS, LAPS) without re-spinning silicon.
推荐
ASIC Prototyping Platform
Engineers commonly use the EP1S30F780I6 in ASIC prototyping platforms because its 32K logic elements plus abundant embedded RAM can emulate multi-million-gate ASIC designs. The 597 I/Os allow partitioning of large ASICs across multiple FPGAs, with TDM-based pin multiplexing when the ASIC exceeds the FPGA's pin capacity. Quartus II synthesis supports ASIC RTL flow (Verilog/VHDL), and the device's high internal clock rates allow real-time verification at or near target ASIC speeds. This makes the EP1S30 ideal for hardware/software co-design before tape-out, where bug fixes cost orders of magnitude less than post-silicon revisions.
推荐
Military & Aerospace Signal Processing
The EP1S30F780I6 (industrial temperature grade) is widely deployed in military and aerospace signal-processing systems including radar front-ends, electronic warfare (EW) subsystems, and secure communications modems. Its 130 nm radiation-tolerant design combined with the industrial -40C to +100C range addresses harsh-environment SWaP-C requirements. The 597 I/Os support multi-channel ADC/DAC interfaces (LVDS or parallel CMOS), while the embedded DSP blocks accelerate FFTs and digital down-conversion. For higher-reliability applications, the EP1S30F780C7AA military-processed variant in the same 780-FBGA package is preferred and qualified per MIL-STD-883 screening.
推荐
High-Speed Serial Protocol Bridge
The EP1S30F780I6 supports custom high-speed serial protocol bridging applications such as Aurora, Serial RapidIO, and proprietary chip-to-chip links. Its dedicated transceiver channels plus abundant logic and BRAM allow implementing PCS/PMA layers, CRC engines, and link-training state machines in a single device. The 1.5 V core with 3.3 V I/O supports the LVDS, LVPECL, and HSTL I/O standards required to interface legacy backplanes. Designers can implement multi-gigabit bridges between processors, FPGAs, and ASICs without external PHY devices, reducing board complexity and BOM cost.
推荐
Image Processing Pipeline
The EP1S30F780I6 is suitable for real-time image processing pipelines such as machine vision, medical imaging, and video surveillance. Its 3,317,184 embedded RAM bits allow line buffers and frame buffers to be stored on-chip, eliminating external SRAM in many designs. The DSP blocks accelerate 2D convolution, Sobel edge detection, and color-space conversion in real time. With 597 user I/Os, the device can accept parallel data from Camera Link or HDMI receivers and drive DVI/DisplayPort outputs directly. The industrial temperature range supports factory-floor machine-vision deployments.
推荐
Industrial Automation Controller
The EP1S30F780I6 is used in industrial automation controllers including PLCs, motion controllers, and CNC machine controllers where deterministic, low-latency logic execution is required. Its 32K logic elements support multiple servo loops (typically a few kHz each), EtherCAT/PROFIBUS protocol stacks, and safety logic in parallel. The 597 I/Os handle encoder feedback, discrete I/O, and fieldbus interfaces simultaneously. Industrial -40C to +100C operation and the ruggedized 780-FBGA package support deployment in factory-floor cabinets with vibration and thermal cycling. For new designs, consider migration to Cyclone IV or Cyclone V for lower cost and lower power.
推荐
推荐产品汇总
工程参考数据： EP1S30F780I6 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1S30F780C8N | EP1S30F780C7N | EP1S30F780C7AA |
|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 780-FBGA (29x29) | 780-FBGA (29x29) | 780-FBGA (29x29) | 780-FBGA (29x29) |
| Logic Elements | 32,470 | 32,470 | 32,470 | 32,470 |
| Speed Grade | I6 (industrial) | C8 (commercial) | C7 (commercial) | C7 + military processing |
| Core Voltage | 1.425-1.575 V | 1.425-1.575 V | 1.425-1.575 V | 1.425-1.575 V |
| Operating Temperature | -40C to +100C | 0C to +85C | 0C to +85C | -40C to +100C (mil-screened) |
| User I/Os | 597 | 597 | 597 | 597 |
| Embedded RAM | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits |
关键差异点
- Largest 780-FBGA logic density in original Stratix family （对比 EP1S25F780I6)
- Industrial temperature grade with same package （对比 EP1S30F780C8N)
- Dedicated 130 nm transceiver and DSP blocks （对比 EP2S30F780 (Stratix II))
设计说明
The Stratix EP1S30F780I6 requires multi-rail power sequencing: VCCINT (1.5 V core), VCCIO (per bank), VCCA_PLL (1.5 V analog), and VCCPD (3.3 V pre-driver) must ramp in the order specified in the Stratix device handbook. A violation can cause latch-up or permanent damage to the I/O cells. Use a power supply sequencer IC (e.g., TPS65200 or equivalent) to enforce the sequence. Decoupling requires at least 30 low-ESR 0.1 uF capacitors distributed around the 780-FBGA plus bulk 220 uF polymer caps on each rail.
Estimated: at typical utilization (~50% logic toggle rate, 100 MHz core, all I/O active) the EP1S30F780I6 dissipates 3-5 W in still air. The 780-FBGA has a theta_JA of approximately 8 C/W with a JEDEC 4-layer test board. For industrial (-40C to +100C) operation in a sealed enclosure, derate by 70% and consider forced-air cooling above 4 W. Industrial-grade parts may operate with Tj up to 100C (case), so verify your thermal model against the actual workload rather than relying on datasheet maximums.
The 780-FBGA at 1.0 mm pitch requires a 4-layer (or preferably 6-layer) PCB stack-up with microvia or via-in-pad technology for the breakout. Use 0.4 mm laser-drilled microvias on the top inner layers and 0.2 mm capture pads. Maintain 50 ohm controlled impedance on all high-speed serial traces and 100 ohm differential for LVDS pairs. Signal-integrity simulation is mandatory for transceiver channels above 1 Gbps - use the Stratix IBIS models from Altera/Intel.
Do not reuse bitstreams across speed grades - a C8 bitstream will not run on I6 silicon and vice versa due to timing model differences. Verify configuration mode (AS, AP, PS, FPP) via MSEL pin resistors before generating the .pof file. When migrating to Stratix II (EP2S30F780), plan for full re-implementation - the bitstream format changed and the I/O register structure is different.
合规信息
RoHS and REACH status not documented in the provided web data. Original Stratix family predates full RoHS enforcement; check date code and label on received parts. AEC-Q100 not applicable (FPGA, not automotive qualified). For military/aerospace use, the EP1S30F780C7AA is preferred.