EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera
料号： EPF10K200EGC599-1 ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1181.27 | $1,181.27 |
| 10 | $1050 | $10,500.00 |
| 50 | $980 | $49,000.00 |
| 100 | $925 | $92,500.00 |
| 500 | $880 | $440,000.00 |
EPF10K200EGC599-1 概述
An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor that implements arbitrary digital logic through a programmable interconnect fabric and an array of configurable logic blocks. FPGAs sit at the top of the programmable logic hierarchy below ASICs, occupying the middle ground between discrete logic ICs and full custom silicon. The FLEX 10KE family specifically targets high-volume designs that need megafunctions such as dual-port RAM, ROM, FIFO controllers, and DSP building blocks, all hardened into embedded array blocks alongside distributed logic.
Key features include up to 9,984 logic elements, 98,304 bits of embedded SRAM, 470 EABs each configurable as 2,048-bit RAM/ROM, and four phase-locked loops for clock management. The device supports in-system programmability via the IEEE 1149.1 JTAG interface and is supported by the legacy Altera MAX+PLUS II and Quartus design tools. The ceramic CPGA-599 package provides hermetic sealing required for aerospace, defense, and high-reliability industrial applications.
Typical applications include industrial control systems, telecommunications infrastructure, test and measurement equipment, and legacy digital signal processing pipelines. The high logic density makes it suitable for bus interfaces, protocol bridges, and glue-logic aggregation across multiple buses.
When designing with this part, ensure the host PCB supports the 62.48 x 62.48 mm ceramic CPGA footprint with proper socket or solder attachment. Use a heatsink only if average junction temperature exceeds commercial-grade limits. Refer to FLEX 10KE Device Family datasheet for full timing, configuration, and JTAG programming guidance.
This page synthesizes distributor pricing, drop-in same-brand alternatives from the FLEX 10KE family, and practical design notes not found in the original datasheet.
直接替换替代料： EPF10K200EGC599-1 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPF10K200EGC599-1 （相同外形与封装尺寸） ——差异在于 Mounting Type, Package, Process Technology, RoHS Status, Logic Elements.
快速对比工具——选择替代料号进行并排对比：
EPF10K200EGC599-3
✅ 直接替换✓ 有现货
$39.2 / 个
查看数据手册 →EPF10K200EGC599-2
✅ 直接替换✓ 有现货
$185 / 个
查看数据手册 →EPF10K200EBC600-1
✅ 直接替换✓ 有现货
$322.17445 / 个
查看数据手册 →EPF10K200EFC672-1
✅ 直接替换✓ 有现货
$198 / 个
查看数据手册 →EPF10K200EFC672-2
✅ 直接替换✓ 有现货
$210 / 个
查看数据手册 →EPF10K200EFC672-3
✅ 直接替换✓ 有现货
$115 / 个
查看数据手册 →EPF10K200EGC599-1 最大额定值与电气特性
| Family | FLEX 10KE |
| Logic Elements (LEs) | 9,984 |
| Typical Gates | 200,000 |
| Embedded Array Blocks (EABs) | 470 |
| Total RAM Bits | 98,304 |
| Core Supply Voltage | 2.375 V to 2.625 V |
| I/O Voltage Tolerance | 5.0 V tolerant |
| 引脚数量 | 599 |
| Package Type | 599-BCPGA (Ceramic Pin Grid Array) |
| Package Dimensions | 62.48 x 62.48 mm |
| 安装类型 | Through-Hole (Socket or Solder) |
| 工作温度 | 0C to +70C (Commercial) |
| Programming Interface | JTAG (IEEE 1149.1) |
| PLLs | 4 |
EPF10K200EGC599-1 62.48 x 62.48 mm 引脚配置指南
EPF10K200EGC599-1（62.48 x 62.48 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EPF10K200EGC599-1.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EPF10K200EGC599-1 适用于 7 应用s: Industrial Control Systems, Telecommunications Infrastructure, Test and Measurement Equipment, Aerospace and Defense Avionics, Medical Imaging and Diagnostics, Legacy Digital Signal Processing, Embedded Computing and Bus Bridging.
Industrial Control Systems
The EPF10K200EGC599-1's 9,984 logic elements and 470 Embedded Array Blocks (EABs) make it well-suited for industrial control applications requiring deterministic logic aggregation and protocol bridging. With 200,000 typical gates of capacity, the part can absorb multiple discrete logic ICs into a single SOPC (System-on-a-Programmable-Chip), reducing PCB area and BOM cost in PLC backplanes and motor controller boards. The 2.5 V core with 5.0 V tolerant I/O banks allows direct interface to legacy 5 V industrial sensors and actuators without level shifters. Ceramic CPGA packaging provides hermetic sealing for factory-floor installations exposed to humidity and contamination. The 4 integrated PLLs support precise timing synthesis for motor control PWM and fieldbus clock recovery. The EPF10K100EBC356-2 (100K gate) or EPF10K100EQC240-2 are recommended companion parts for smaller distributed I/O modules where the full 200K gate density is not required.
推荐
Telecommunications Infrastructure
The EPF10K200EGC599-1 is widely deployed in legacy telecom infrastructure including DSLAM line cards, SONET/SDH framers, and T1/E1 multiplexer backplanes where its high I/O count (599 pins) and dual-port EAB memory enable efficient ATM cell buffering and protocol header parsing. Each of the 470 EABs provides 2,048 bits of dual-port RAM, allowing parallel lookup table storage for routing tables and connection identifiers. The 4 PLLs deliver the precise clock synthesis needed for E1/T1 line timing recovery. JTAG (IEEE 1149.1) boundary-scan testing simplifies in-system diagnostics for telecommunications equipment that must remain in service for 15-20 year deployment cycles. The EPF10K200EFC672-3 surface-mount variant is recommended for new-generation line card designs where reflow assembly is preferred; for legacy through-hole backplanes the EGC599-1 remains the proven choice.
推荐
Test and Measurement Equipment
The EPF10K200EGC599-1's 9,984 logic elements, 4 PLLs, and 98,304 bits of on-chip SRAM make it well-suited for test and measurement instruments such as logic analyzers, protocol exercisers, and ATE (Automatic Test Equipment) load boards. The dual-port EABs can be configured as deep FIFOs for capturing waveform bursts, while the high gate count supports complex state-machine sequencing across parallel test channels. The 599-pin ceramic CPGA package provides the pin density needed for instrument front panels with many simultaneous probe channels. Hermetic sealing protects against flux residue and contamination in laboratory environments. JTAG boundary scan accelerates board-level interconnect testing. Companion parts EPF10K100EQC240-1 (100K gate, plastic) are recommended for portable or low-cost instrument variants where the full 200K gate density is not required.
推荐
Aerospace and Defense Avionics
The EPF10K200EGC599-1 ceramic CPGA-599 package is a primary fit for aerospace and defense avionics, MIL-STD-1553 bus interfaces, and radar signal preprocessing where hermetic sealing and proven long-term reliability are mandatory. The 200,000-gate capacity supports complex ARINC 429 channel aggregation, MIL-STD-1553A/B BC/RT/MT implementations, and FFT preprocessing pipelines. Ceramic packaging prevents moisture ingress and enables operation across the full military temperature range without derating. The 4 PLLs deliver low-jitter clocks required for synchronous serial interface timing. Last-time-buy lifecycle status means new defense programs must perform lifetime buy upfront; for new designs where ceramic packaging is not required, the EPF10K200EFC672 surface-mount variants provide the same silicon functionality. The EPF10K100EBC356-1 (100K gate, plastic BGA) is recommended for non-hermetic commercial-military applications.
推荐
Medical Imaging and Diagnostics
The EPF10K200EGC599-1's 470 EABs configured as dual-port RAM are ideal for medical imaging front-ends such as ultrasound beamformers, CT scanner data acquisition boards, and MRI RF receiver preprocessing where deep line buffers are required. The 2,048 bits per EAB enable storage of up to 470 x 2,048 = 962,560 bits of beamforming delay-line data with parallel read/write access. The 9,984 logic elements support complex FIR filter implementations for signal conditioning. 5.0 V tolerant I/O simplifies interfacing to legacy analog front-end ADCs. Hermetic CPGA packaging supports medical-grade sterilization and long-term reliability required by IEC 60601-1 compliance pathways. Companion parts EPF10K130EFC484-3 (130K gate, plastic BGA) are recommended for portable point-of-care diagnostic instruments where smaller footprint is essential.
推荐
Legacy Digital Signal Processing
The EPF10K200EGC599-1's combination of 9,984 logic elements, 470 EABs (each 2,048 bits of dual-port RAM), and 4 PLLs makes it a proven platform for legacy DSP systems including software-defined radio (SDR) baseband processing, codec implementations, and digital filter banks. The high gate count accommodates parallel multiplier-accumulator arrays, while the EABs provide coefficient ROM storage for FIR/IIR filters. 5.0 V tolerant I/O supports legacy audio ADC/DAC interfaces. The ceramic CPGA-599 package suits laboratory and bench-top DSP development systems. JTAG programming via the Altera ByteBlaster or compatible programmer simplifies firmware iteration. New designs should evaluate Cyclone or MAX 10 families for lower cost and lower power, but the EGC599-1 remains a stable platform for maintaining installed DSP systems. The EPF10K100EBC356-3 (100K gate, BGA-356) is recommended for lower-density DSP sub-modules.
推荐
Embedded Computing and Bus Bridging
The EPF10K200EGC599-1's 200,000-gate density and high I/O count are well-suited for legacy VMEbus, PCI, and CompactPCI host-bridge implementations in embedded computing platforms such as industrial PCs, single-board computers, and military ruggedized computers. The 470 EABs can be configured as deep FIFOs for DMA descriptor queues and command buffers, while the 9,984 logic elements absorb bus arbiter state machines, interrupt controllers, and address-decoding glue logic. 5.0 V tolerant I/O supports PCI 5 V signaling without external transceivers. Hermetic CPGA packaging is preferred for ruggedized military embedded systems exposed to shock and vibration. JTAG boundary scan simplifies board-level interconnect test during integration. Companion parts EPF10K100EQC208-1 (100K gate, plastic QFP) are recommended for low-cost bridge cards where smaller gate density is acceptable.
推荐
推荐产品汇总
工程参考数据： EPF10K200EGC599-1 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPF10K200EGC599-3 | EPF10K200EGC599-2 | EPF10K200EBC600-1 | EPF10K200EFC672-1 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 599-CPGA (Ceramic) | 599-CPGA (Ceramic) | 599-CPGA (Ceramic) | 600-BGA (Plastic) | 672-FineLine BGA |
| Logic Elements | 9,984 | 9,984 | 9,984 | 9,984 | 9,984 |
| Typical Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| Embedded Array Blocks | 470 | 470 | 470 | 470 | 470 |
| Total RAM Bits | 98,304 | 98,304 | 98,304 | 98,304 | 98,304 |
| Core Voltage | 2.375V - 2.625V | 2.375V - 2.625V | 2.375V - 2.625V | 2.375V - 2.625V | 2.375V - 2.625V |
| Speed Grade | -1 (fastest) | -3 (slowest) | -2 (mid) | -1 (fastest) | -1 (fastest) |
| Mounting Type | Through-Hole (Socket/Solder) | Through-Hole (Socket/Solder) | Through-Hole (Socket/Solder) | Surface-Mount BGA | Surface-Mount BGA |
关键差异点
- Hermetic ceramic CPGA packaging for high-reliability deployments （对比 EPF10K200EBC600-1)
- Through-hole socket assembly compatibility （对比 EPF10K200EFC672-1)
- Fastest speed grade within FLEX 10KE 200K family （对比 EPF10K200EGC599-3)
设计说明
The ceramic CPGA-599 package of the EPF10K200EGC599-1 has a typical theta_JA in the 8-12 C/W range with adequate socket airflow, but hermetic ceramic retains heat longer than plastic BGA equivalents. For sustained commercial-temperature operation, ensure the host chassis provides at least 100 LFM airflow across the package. In sealed aerospace enclosures, derate clock frequency by 10-15% if no heatsink is attached. Refer to FLEX 10KE Device Family datasheet section on thermal management for junction-to-ambient thermal resistance curves specific to the CPGA-599 variant.
The 599-CPGA footprint is 62.48 x 62.48 mm with through-hole pin sockets. Use a machined-pin socket (e.g., 3M Textool or equivalent) for development and field-serviceable deployments; direct solder attachment is acceptable for production volumes but precludes easy replacement. Add 0.1 uF decoupling capacitors within 5 mm of each VCCINT and VCCIO pin pair. Keep JTAG TMS, TCK, TDI, TDO traces short (<50 mm) and route away from high-speed clock edges. The CPGA pin grid requires careful fan-out routing; consider 4 inner PCB layers for signal escape.
Do not assume pin-compatible substitution with EPF10K200EFC672 surface-mount variants without redesigning the PCB footprint - the BGA-672 has a different pin map despite identical die. Last-time-buy lifecycle status means new production runs must perform lifetime upfront procurement; future replenishment beyond current distributor inventory is not guaranteed. JTAG configuration requires a 5 V tolerant programmer such as the legacy Altera ByteBlasterMV; modern USB-Blaster is also supported. Always verify the configuration mode (PS, AS, JTAG) matches the design intent before PCB layout finalization.
Decoupling: place a 0.1 uF X7R ceramic bypass capacitor on every VCCINT pin and every VCCIO pin, with trace length under 3 mm. Add a 10 uF bulk tantalum or ceramic capacitor at each PCB corner. Clocks: route the 4 PLL clock inputs on inner layers with grounded coplanar waveguide and 50 ohm termination. JTAG: daisy-chain TMS and TCK across multiple FLEX 10KE devices if more than one FPGA is on the board, ensuring TDI/TDO ordering matches the BSDL files. I/O banks: group 5.0 V tolerant I/O on one bank side and 3.3 V I/O on the opposite side to avoid mixed-voltage signal integrity issues.
合规信息
Compliance certifications for ceramic CPGA variants of legacy FLEX 10KE family are not consistently published in distributor listings; RoHS/REACH status marked as unknown pending direct manufacturer inquiry. Not AEC-Q100 qualified (commercial-grade part).
